Process for the production of a diode array and liquid crystal display screen

Claim 1

A process for the production of the diode array and liquid crystal display screen in which: an upper plate is produced by depositing on a first substrate transparent conductive control rows, a lower plate is produced by depositing on a second substrate a transparent conductive material layer, followed by a first conductive material layer and carrying out a first photogravure process on these two layers for forming a matrix of electrode segments, said matrix being constituted by rows of electrode segments and columns of electrode segments, each electrode segment having at least one projection, each electrode segment constituting an elementary display point, as well as for forming control columns placed between the column of electrode segments, each electrode segment is connected to an adjacent control column by a bridge having two diodes, the two plates obtained are assembled with a liquid crystal material therebetween in such a way that the control rows covering the first substrate of the upper plate cover the rows of electrode segments of the matrix, said control rows covering the first substrate of said upper plate being perpendicular to the columns of the lower plate, wherein, for producing a bridge between each electrode segment and the adjacent control column, the following operations are performed: an intrinsic hydrogenated amorphous silicon layer aSi:H(i) is deposited on the lower plate following the first photogravure operation, a second conductive material is deposited, the first and second conductive materials being chosen in such a way that the stack constituted by these two materials and the interposed aSi:H(i) layer has a diode-type structure, a second photogravure operation is performed for freeing each electrode segment, but leaving between each projection and the adjacent column a bridge formed by the stack of the layer of the first conductive material, the aSi:H(i) layer and the layer of the second conductive material, said bridge being electrically equivalent to two diodes connected in head to head manner.