Process for the autopositioning of an interconnection line on an electric contact hole of an integrated circuit

Claim 1

A process for autopositioning an interconnecting line on an electric contact hole of an integrated circuit, consistng of the successive steps of: (a) forming an insulating layer on a whole substrate having a semiconductor active zone; (b) forming an opening in said insulating layer in front of said active zone, in order to obtain said electric contact hole; (c) depositing a first conductive coating on said insulating layer and on said active zone; (d) depositing on said first conductive coating a filling material used for filling the contact hole, the surface of said material being substantially planar; (e) carrying out an anisotropic etching of said filling material, so as to expose those parts of said first conductive coating located outside said contact hole, and while retaining only that filling material portion which fills the contact hole; (f) depositing on the structure obtained a second conductive coating, in which said interconnecting line will be formed; (g) forming on said second conductive coating a resin mask used for defining the dimensions of said interconnecting line; (h) eliminating those parts of said second and first conductive coating which are free from the mask, in order to form said inteconnecting line; (i) eliminating said mask.