Electroless plating composition and method of use

Claim 2

An alkaline electroless metal plating solution comprising, in aqueous solution, a water soluble metal salt, a reducing agent sufficient to cause reduction of said metal salt to metallic form, a complexing agent sufficient to control the rate of reduction of said metal salt, and a water soluble saccharide derivative at a concentration of about 0.1 to about 20 grams per liter of said solution.

Claim 3

A plating solution in accordance with claim 1 in which said saccharide derivative is a polysaccharide having a molecular weight of at least about 10,000.

Claim 4

A plating solution in accordance with claim 1 in which said saccharide derivative is a plant exudate.

Claim 5

A plating solution in accordance with claim 1 in which said saccharide derivative is a member selected from the group consisting of algin, carrageenan, acacia, ghatti gum and sodium glucoheptonate.

Claim 6

A plating solution in accordance with claim 1 in which said saccharide derivative is a polysaccharide having a molecular weight of about 100,000 to about 1,000,000.

Claim 7

A plating solution in accordance with claim 1 in which the concentration of said saccharide derivative is from about 0.1 to about 10 grams per liter of said solution.

Claim 8

A plating solution in accordance with claim 1 in which said metal salt is a copper salt.

Claim 9

A plating solution in accordance with claim 1 in which said metal is copper and the anion of said salt is a member selected from the group consisting of chloride, sulfate and nitrate.

Claim 10

A plating solution in accordance with claim 1 in which the pH of said solution is from about 8 to about 14.

Claim 11

An alkaline electroless copper plating solution comprising, in aqueous solution: (a) a water soluble copper salt selected from the group consisting of cupric chloride, copper sulfate and copper nitrate; (b) a reducing agent sufficient to cause reduction of said copper salt to metallic copper; (c) a complexing agent sufficient to control the rate of reduction of said copper salt; (d) a base sufficient to render the pH of said solution from 11 to about 13; and (e) at least one water soluble saccharide derivative selected from the group consisting of algin, acacia, carrageenan, ghatti gum and sodium glucoheptonate, at a total concentration of from about 0.1 to about 10 grams of saccharide derivative per liter of said solution.

Claim 12

An alkaline electroless copper plating solution comprising, in aqueous solution: (a) a water soluble copper salt selected from the group consisting of cupric chloride, copper sulfate and copper nitrate; (b) a reducing agent sufficient to cause reduction of said copper salt to metallic copper; (c) a complexing agent sufficient to control the rate of reduction of said copper salt; (d) a base sufficient to render the pH of said solution from 11 to about 13; and (e) at least one water soluble saccharide derivative selected from the group consisting of algin, acacia, carrageenan, ghatti gum and sodium glucoheptonate, at a total concentration of from about 0.1 to about 10 grams of saccharide derivative per liter of said solution.

Claim 13

A plating solution in accordance with claim 10 in which said water soluble saccharide derivative is selected from the group consisting of algin and acacia.

Claim 14

A process for the electroless metal plating of a nonconductor, said process comprising: (a) treating said nonconductor with an agent catalytic for electroless metal deposition; and (b) contacting said treated nonconductor with an alkaline aqueous solution comprising a water soluble metal salt, a reducing agent sufficient to reduce said metal to metallic form, a complexing agent sufficient to control the rate of reduction of said metal, and a water soluble saccharide derivative at a concentration of about 0.1 to about 20 grams per liter of said solution, to deposit thereon a layer of said metal in metallic form.

Claim 15

A process for the electroless metal plating of a nonconductor, said process comprising: (a) treating said nonconductor with an agent catalytic for electroless metal deposition; and (b) contacting said treated nonconductor with an alkaline aqueous solution comprising a water soluble metal salt, a reducing agent sufficient to reduce said metal to metallic form, a complexing agent sufficient to control the rate of reduction of said metal, and a water soluble saccharide derivative at a concentration of about 0.1 to about 20 grams per liter of said solution, to deposit thereon a layer of said metal in metallic form.

Claim 16

A process in accordance with claim 12 in which the concentration of said saccharide derivative is from about 0.1 to about 10 grams per liter of said alkaline aqueous solution.

Claim 17

A process in accordance with claim 12 in which said metal salt is a member selected from the group consisting of copper chloride, copper sulfate and copper nitrate.

Claim 18

A process in accordance with claim 12 in which said catalytic agent is comprised of an aqueous solution of a precious metal halide and reducing agent therefor.

Claim 19

A process in accordance with claim 12 in which said catalytic agent is comprised of an aqueous solution of palladium chloride and stannous chloride, and said metal salt is cupric chloride.

Claim 20

A process in accordance with claim 12 in which the pH of the alkaline aqueous solution of step (b) is from about 8 to about 14.

Claim 21

A process in accordance with claim 12 in which said metal salt is a copper salt and the pH of the alkaline solution in step (b) is from about 11 to about 13.

Claim 22

A process in accordance with claim 12 in which said metal salt is a copper salt and said saccharide derivative is a polysaccharide having a molecular weight of at least about 10,000.

Claim 23

A process in accordance with claim 12 in which said metal salt is a copper salt and said saccharide derivative is a member selected from the group consisting of algin, carrageenan, acacia, ghatti gum, and sodium glucoheptonate.

Claim 24

A process for the electroless copper plating of a nonconductor, said process comprising: (a) contacting said nonconductor with an aqueous solution of palladium chloride and stannous chloride to sensitize the surface of said nonconductor for electroless copper deposition; and (b) contacting said sensitized nonconductor surface with an aqueous solution having a pH of from about 11 to about 13, said solution comprising cupric chloride, a reducing agent sufficient to reduce said cupric ion to copper metal, a complexing agent sufficient to control the rate of reduction of said ion, and at least one water soluble saccharide derivative selected from the group consisting of algin, acacia, and sodium glucoheptonate, at a total saccharide derivative concentration of from about 0.1 to about 10 grams per liter of said solution.

Claim 25

A process for the electroless copper plating of a nonconductor, said process comprising: (a) contacting said nonconductor with an aqueous solution of palladium chloride and stannous chloride to sensitize the surface of said nonconductor for electroless copper deposition; and (b) contacting said sensitized nonconductor surface with an aqueous solution having a pH of from about 11 to about 13, said solution comprising cupric chloride, a reducing agent sufficient to reduce said cupric ion to copper metal, a complexing agent sufficient to control the rate of reduction of said ion, and at least one water soluble saccharide derivative selected from the group consisting of algin, acacia, and sodium glucoheptonate, at a total saccharide derivative concentration of from about 0.1 to about 10 grams per liter of said solution.