US4180600A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process using activated electroless plating catalysts
Assignee: Individual
•
Filing: 1978-09-11
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Granted: 1979-12-25
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Expires: 1998-09-11
Abstract
Abstract A process and method for the formation of novel colloidal catalytic electroless plating compositions comprising the admixture of at least one primary colloid stabilizer which otherwise renders the colloidal dispersion highly stable however weakly active with at least one secondary colloid stabilizer (or reactivity modifier) thereby activating the colloidal dispersion to a more active state when used in the catalytic treatment prior to electroless (chemical) plating.
Inventors
- 👤 Nathan Feldstein
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 19:18
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/28; H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181
Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
106 words
A process for electroless or chemical plating onto a non-conductor substrate comprising the step of contacting said substrate with an activated colloidal dispersion wherein said colloidal dispersion comprises a metal which in one of its oxidation states is capable of electroless or chemical plating initiation and wherein said metal may be in an elemental state or alloy or compound and mixtures thereof and further wherein said activated colloidal dispersion comprises at least one primary stabilizer which alone renders the dispersion weakly active and at least one reactivity modifier and wherein said primary stabilizer and said reactivity modifier are inherently colloid stabilizers however they are different materials.
Claim 2
Dependent Claim
106 words
A process for electroless or chemical plating onto a non-conductor substrate comprising the step of contacting said substrate with an activated colloidal dispersion wherein said colloidal dispersion comprises a metal which in one of its oxidation states is capable of electroless or chemical plating initiation and wherein said metal may be in an elemental state or alloy or compound and mixtures thereof and further wherein said activated colloidal dispersion comprises at least one primary stabilizer which alone renders the dispersion weakly active and at least one reactivity modifier and wherein said primary stabilizer and said reactivity modifier are inherently colloid stabilizers however they are different materials.
Claim 3
Dependent Claim
14 words
The process according to claim 1 wherein said primary stabilizer is a secondary colloid.
Claim 4
Dependent Claim
22 words
The process according to claim 1 wherein the primary stabilizer and the reactivity modifier are admixed prior to the colloid nucleation process.
Claim 5
Dependent Claim
22 words
The process according to claim 1 wherein said metal is selected from the group consisting of copper, cobalt, nickel, palladium and iron.
Claim 6
Dependent Claim
14 words
The process according to claim 1 wherein said activated colloidal dispersion is positively charged.
Claim 7
Dependent Claim
14 words
The process according to claim 1 wherein said activated colloidal dispersion is negatively charged.
Claim 8
Dependent Claim
26 words
The process according to claim 1 further containing the step of activation and wherein the step of activation reduces the induction time prior to metal deposition.
Claim 9
Dependent Claim
13 words
The process according to claim 1 further containing the step of metal deposition.
Claim 10
Dependent Claim
14 words
The process according to claim 1 wherein said primary stabilizer is an amphoteric compound.
Claim 11
Dependent Claim
14 words
The process according to claim 1 wherein said reactivity modifier is an amphoteric compound.
Claim 12
Dependent Claim
13 words
The process according to claim 2 wherein said secondary colloid is a protein.
Claim 13
Dependent Claim
13 words
The process according to claim 1 wherein said electroless plating is of copper.
Claim 14
Dependent Claim
13 words
The process according to claim 1 wherein said electroless plating is of nickel.
Claim 15
Dependent Claim
25 words
The process according to claim 1 wherein said weakly active colloidal dispersion is prepared through the chemical interaction of the catalytic metals with soluble hydrides.
Claim 16
Dependent Claim
30 words
The process according to claim 1 wherein said reactivity modifier is selected from the group consisting of surfactants, alcohol, dispersants, mercapto-benzo-triazole and its derivatives and soluble halides and mixtures thereof.
Claim 17
Dependent Claim
20 words
The process according to claim 1 wherein said reactivity modifier is capable of adsorbing onto the nucleus of the colloid.
Claim 18
Dependent Claim
17 words
The process according to claim 1 wherein said weakly active colloidal dispersion contains an hydrous oxide colloid.
Claim 19
Dependent Claim
12 words
The process according to claim 1 wherein said non-conductor substrate is ABS.
Claim 20
Dependent Claim
13 words
The process according to claim 1 wherein said colloid stabilizer is gum arabic.
Claim 21
Dependent Claim
14 words
The process according to claim 1 wherein said colloid stabilizer is a soluble lignosulfonate.
Claim 22
Dependent Claim
23 words
The process according to claim 1 wherein said weakly active colloidal dispersion is derived through the nucleation reaction carried forth above room temperature.
Claim 23
Dependent Claim
13 words
The process according to claim 1 further containing the step of water rinsing.
Claim 24
Dependent Claim
30 words
The process according to claim 1 wherein the admixing of the weakly active colloidal dispersion with the reactivity modifier further results in a reduction of the colloid particle size distribution.
Claim 25
Dependent Claim
25 words
The process according to claim 1 wherein said colloidal dispersion is derived from the nucleation reaction and further wherein a starting compound(s) is soluble compound(s).
Claim 26
Dependent Claim
25 words
The process according to claim 1 wherein said colloidal dispersion is derived from the nucleation reaction and further wherein a starting compound(s) is insoluble compound(s).
Claim 27
Dependent Claim
18 words
The process according to claim 1 wherein said colloidal dispersion comprises the interaction product of copper and tin.
Claim 28
Dependent Claim
15 words
The process according to claim 1 wherein said metal is part of an hydrous oxide.
Claim 29
Dependent Claim
15 words
The process according to claim 1 wherein said metal is part of an elemental state.
Claim 30
Dependent Claim
25 words
The process according to claim 1 further containing the step of activation and wherein said activation step is prior to the electroless metal deposition step.
Claim 31
Dependent Claim
34 words
The process according to claim 1 further containing the step of surface treatment and wherein said surface treatment step is prior to the step in which the substrate is contacted with the colloidal dispersion.
Claim 32
Dependent Claim
18 words
The process according to claim 1 wherein said electroless plating is part of a printed circuitry through-hole metallization.
References Cited (Backward Citations)
US4048354A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1982-12-24 | 1983-06-25 | 1983-12-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1986-12-24 | 1987-06-25 | 1987-12-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1990-12-24 | 1991-06-25 | 1991-12-25 | $7700.00 | Window Closed / Lapsed |