Patent US2197300A successfully refreshed from Google Patents.
US4132832A
Expired / Lapsed
US
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Method of applying dispersions for activating non-conductors for electroless plating and article
Assignee: Individual
•
Filing: 1977-11-25
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Granted: 1979-01-02
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Expires: 1997-11-25
Abstract
Abstract Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless (chemical) coating process comprised of coating the surface of the substrate with colloids of catalytic non-precious metals wherein the metals are either part of an alloy or in the elemental state or a compound and wherein the colloidal compositions are prepared by a special method which renders the colloids a greater catalytic activity when used in the plating process.
Inventors
- 👤 Nathan Feldstein
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 05:11
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/28; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31678; Y10T428/31692; Y10T428/31696; Y10T428/31699
Claims Analysis
Total Claims: 42
Claim 1
Independent Claim
39 words
A process for the preparation of non-conductor substrate prior to electroless plating which comprises contacting said substrate with a colloidal composition comprising a copper colloid admixed with nickel ions and wherein said admixing takes place post copper colloid nucleation.
Claim 2
Dependent Claim
39 words
A process for the preparation of non-conductor substrate prior to electroless plating which comprises contacting said substrate with a colloidal composition comprising a copper colloid admixed with nickel ions and wherein said admixing takes place post copper colloid nucleation.
Claim 3
Dependent Claim
17 words
The process according to claim 1 wherein said copper colloid is derived from a copper (II) compound.
Claim 4
Dependent Claim
24 words
The process according to claim 1 wherein said copper colloid nucleation is derived through the chemical interaction of copper ions with a reducing agent.
Claim 5
Dependent Claim
13 words
The process according to claim 3 wherein said reducing agent is an hydride.
Claim 6
Dependent Claim
14 words
The process according to claim 1 wherein said copper colloid is of copper metal.
Claim 7
Dependent Claim
15 words
The process according to claim 1 wherein said copper colloid is of a copper compound.
Claim 8
Dependent Claim
14 words
The process according to claim 1 wherein said copper colloid is a copper alloy.
Claim 9
Dependent Claim
23 words
The process according to claim 1 wherein said copper colloid is selected from the group of metal, compound and alloy and mixtures thereof.
Claim 10
Dependent Claim
17 words
The process according to claim 1 wherein said copper colloid is derived from a copper (I) compound.
Claim 11
Dependent Claim
13 words
The process according to claim 1 wherein said electroless plating is of copper.
Claim 12
Dependent Claim
21 words
The process according to claim 1 wherein said colloidal composition is derived from the suspension of a powder in a solvent.
Claim 13
Dependent Claim
21 words
The process according to claim 1 wherein said copper colloid is derived from a suspension of a powder in a solvent.
Claim 14
Dependent Claim
15 words
The process according to claim 1 wherein said colloidal composition further containing a colloid stabilizer.
Claim 15
Dependent Claim
27 words
The process according to claim 1 wherein the molar concentration of said nickel ions is less than the molar concentration of the copper in said copper colloid.
Claim 16
Dependent Claim
16 words
The process according to claim 1 wherein said nickel ions are derived from a nickel compound.
Claim 17
Dependent Claim
13 words
The process according to claim 1 wherein said copper colloid is positively charged.
Claim 18
Dependent Claim
13 words
The process according to claim 1 wherein said copper colloid is negatively charged.
Claim 19
Dependent Claim
12 words
The process according to claim 1 wherein said electroless plating is copper.
Claim 20
Dependent Claim
11 words
The process according to claim 1 wherein said non-conductor is ABS.
Claim 21
Dependent Claim
15 words
The process according to claim 1 wherein said copper colloid is nucleated above room temperature.
Claim 22
Dependent Claim
13 words
The process according to claim 1 further containing the step of electroless plating.
Claim 23
Dependent Claim
47 words
The process according to claim 1 wherein said copper colloid is nucleated through the interaction of the copper ions with a reducing agent and wherein said reducing agent is selected from the group consisting of tannic acid, hydrazine, amineboranes, hypophosphites, borohydrides, and sulfur types, and mixtures thereof.
Claim 24
Dependent Claim
26 words
The process according to claim 1 further containing the step of activation and wherein said step of activation is prior to the step of electroless plating.
Claim 25
Dependent Claim
18 words
The process according to claim 23 wherein said activation encompasses a selective dissolution of the colloidal stablizer(s) present.
Claim 26
Dependent Claim
16 words
The process according to claim 1 wherein said colloidal composition contains at least one colloid stabilizer.
Claim 27
Dependent Claim
49 words
A metallized non-conductor substrate produced by the steps comprising (1) contacting said non-conductor substrate with a colloidal composition comprising a copper colloid admixed with nickel ions and wherein said admixing takes place post copper colloid nucleation, and (2) depositing a metal or alloy from a compatible electroless plating bath.
Claim 28
Dependent Claim
49 words
A metallized non-conductor substrate produced by the steps comprising (1) contacting said non-conductor substrate with a colloidal composition comprising a copper colloid admixed with nickel ions and wherein said admixing takes place post copper colloid nucleation, and (2) depositing a metal or alloy from a compatible electroless plating bath.
Claim 29
Dependent Claim
25 words
The article according to claim 26 wherein said copper colloid is selected from the group consisting of copper metal, compound, and alloy, and mixtures thereof.
Claim 30
Dependent Claim
16 words
The article according to claim 26 wherein said copper colloid is derived from a copper(I) compound.
Claim 31
Dependent Claim
13 words
The article according to claim 26 wherein said electroless plating is of copper.
Claim 32
Dependent Claim
21 words
The article according to claim 26 wherein said colloidal composition is derived from the suspension of a powder in a solvent.
Claim 33
Dependent Claim
15 words
The article according to claim 26 wherein said colloidal composition further contains a colloid stabilizer.
Claim 34
Dependent Claim
27 words
The article according to claim 26 wherein the molar concentration of said nickel ion is less than the molar concentration of the copper in said copper colloid.
Claim 35
Dependent Claim
16 words
The article according to claim 26 wherein said nickel ions are derived from a nickel compound.
Claim 36
Dependent Claim
13 words
The article according to claim 26 wherein said copper colloid is positively charged.
Claim 37
Dependent Claim
13 words
The article according to claim 26 wherein said copper colloid is negatively charged.
Claim 38
Dependent Claim
11 words
The article according to claim 26 wherein said non-conductor is ABS.
Claim 39
Dependent Claim
15 words
The article according to claim 26 wherein said copper colloid is nucleated above room temperature.
Claim 40
Dependent Claim
50 words
The article according to claim 26 wherein said copper colloid is nucleated through the interreaction of the copper ion with the reducing agent and wherein said reducing agent is selected from the group consisting of tannic acid, hydrazine, amineborane, hypophosphite and its derivatives, borohydride, and sulfur type, and mixtures thereof.
Claim 41
Dependent Claim
26 words
The article according to claim 26 further containing the step of activation and wherein said step of activation is prior to the step of electroless plating.
Claim 42
Dependent Claim
17 words
The article according to claim 39 wherein said activation encompasses a selective dissolution of colloid stabilizers present.
References Cited (Backward Citations)
US3958048A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1982-01-01 | 1982-07-03 | 1983-01-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1986-01-01 | 1986-07-03 | 1987-01-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1990-01-01 | 1990-07-03 | 1991-01-02 | $7700.00 | Window Closed / Lapsed |