US4282271A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Dispersions for activating non-conductors for electroless plating
Assignee: Individual
•
Filing: 1979-07-11
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Granted: 1981-08-04
•
Expires: 1999-07-11
Abstract
Abstract Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless (chemical) coating process comprised of coating the surface of the substrate with colloids of catalytic non-precious metals wherein the metals are either part of an alloy or in the elemental state or a compound and wherein the colloidal suspension further comprises antioxidant as to minimize the surface oxidation of the colloids and are further admixed in a manner resulting in good colloidal stability.
Inventors
- 👤 Nathan Feldstein
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 05:34
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/28; H; H05; H05K; H05K3/00; H05K3/38; H05K3/381; H05K3/10; H05K3/18; H05K3/181
Claims Analysis
Total Claims: 42
Claim 1
Independent Claim
85 words
A process for the electroless plating of a non-conductor substrate which comprises (a) immersing said substrate into a colloidal dispersion of at least one non-precious catalytic metal capable of electroless plating initiation and an antioxidant capable of decreasing the surface oxidation of said catalytic metal when contacted with water and/or air and further wherein said antioxidant is incapable of reducing ions of said catalytic metal to the metallic state; and (b) immersing said treated substrate into an electroless plating bath to deposit a metallic coating.
Claim 2
Dependent Claim
85 words
A process for the electroless plating of a non-conductor substrate which comprises (a) immersing said substrate into a colloidal dispersion of at least one non-precious catalytic metal capable of electroless plating initiation and an antioxidant capable of decreasing the surface oxidation of said catalytic metal when contacted with water and/or air and further wherein said antioxidant is incapable of reducing ions of said catalytic metal to the metallic state; and (b) immersing said treated substrate into an electroless plating bath to deposit a metallic coating.
Claim 3
Dependent Claim
12 words
The process according to claim 1 wherein said catalytic metal is copper.
Claim 4
Dependent Claim
14 words
The process according to claim 2 wherein said copper is in an elemental state.
Claim 5
Dependent Claim
14 words
The process according to claim 2 wherein said copper is part of an alloy.
Claim 6
Dependent Claim
15 words
The process according to claim 2 wherein said copper is part of an hydrous oxide.
Claim 7
Dependent Claim
14 words
The process according to claim 1 further containing the step of electroless metal deposition.
Claim 8
Dependent Claim
28 words
The process according to claim 1 further containing the step of etching of the substrate which is prior to the contacting of the substrate with the colloidal dispersion.
Claim 9
Dependent Claim
11 words
The process according to claim 1 further containing a colloid stabilizer.
Claim 10
Dependent Claim
21 words
The process according to claim 1 wherein the colloid of said colloidal dispersion was nucleated at a temperature above room temperature.
Claim 11
Dependent Claim
21 words
The process according to claim 1 wherein said colloidal dispersion was prepared by the dispersion of a powder in a solvent.
Claim 12
Dependent Claim
24 words
The process according to claim 1 wherein said colloidal dispersion is derived through a chemical reduction step of a compound bearing the catalytic metal.
Claim 13
Dependent Claim
14 words
The process according to claim 1 wherein said copper is part of a compound.
Claim 14
Dependent Claim
25 words
The process according to claim 1 further containing the step of activation and wherein said step of activation constitutes a selective dissolution of the colloid.
Claim 15
Dependent Claim
19 words
The process according to claim 1 wherein said antioxidant is sacrificially oxidized when in contact with air or oxygen.
Claim 16
Dependent Claim
14 words
The process according to claim 1 wherein said substrate is a printed circuitry substrate.
Claim 17
Dependent Claim
27 words
The process according to claim 1 further containing the step of etching, said etching being prior to the step of immersing said substrate with said colloidal dispersion.
Claim 18
Dependent Claim
20 words
The process according to claim 1 further containing the step of water rinsing to remove excess colloid from said substrate.
Claim 19
Dependent Claim
91 words
A process for the metallization of a printed circuitry substrate comprising: a. immersing said substrate into an etchant, b. immersing said substrate into a colloidal dispersion of at least one non-precious catalytic metal capable of electroless plating initiation and an antioxidant, said antioxidant capable of decreasing the oxidation of said catalytic metal when contacted with water and/or air, and further wherein said antioxidant is incapable of reducing ions of said catalytic metal to the metallic state; and c. immersing said substrate into an electroless plating bath to deposit a metallic coating.
Claim 20
Dependent Claim
91 words
A process for the metallization of a printed circuitry substrate comprising: a. immersing said substrate into an etchant, b. immersing said substrate into a colloidal dispersion of at least one non-precious catalytic metal capable of electroless plating initiation and an antioxidant, said antioxidant capable of decreasing the oxidation of said catalytic metal when contacted with water and/or air, and further wherein said antioxidant is incapable of reducing ions of said catalytic metal to the metallic state; and c. immersing said substrate into an electroless plating bath to deposit a metallic coating.
Claim 21
Dependent Claim
13 words
The process according to claim 18 wherein said electroless plating bath is copper.
Claim 22
Dependent Claim
24 words
The process according to claim 18 wherein said colloidal dispersion is derived through a nucleation reaction, said nucleation reaction taking place above room temperature.
Claim 23
Dependent Claim
14 words
The process according to claim 18 wherein said printed circuitry substrate further contains through-holes.
Claim 24
Dependent Claim
46 words
The process according to claim 18 further containing the step of removal of excess colloid from said printed circuitry substrate, said removal of excess colloid taking place after the contacting of the substrate with the colloidal dispersion but prior to the step of electroless metal deposition.
Claim 25
Dependent Claim
15 words
The process according to claim 18 wherein said electroless plating bath operates above room temperature.
Claim 26
Dependent Claim
15 words
The process according to claim 18 wherein said electroless plating bath is comprised of formaldehyde.
Claim 27
Dependent Claim
14 words
The process according to claim 18 wherein said colloidal dispersion further contains a surfactant.
Claim 28
Dependent Claim
15 words
The process according to claim 18 wherein said colloidal dispersion further contains a colloid stabilizer.
Claim 29
Dependent Claim
13 words
The process according to claim 18 wherein said colloidal dispersion further contains water.
Claim 30
Dependent Claim
14 words
The process according to claim 18 wherein said antioxidant is also a colloid stabilizer.
Claim 31
Dependent Claim
43 words
The process according to claim 18 further containing the step of activation, said activation taking place after said step `b` but prior to said step `c`, said activation reducing the induction time for the metal deposition taking place in the electroless plating bath.
Claim 32
Dependent Claim
93 words
A process for the electroless plating of a non-conductor substrate which comprises (a) immersing said substrate into a stable colloidal dispersion which comprises a copper colloid and an antioxidant, said antioxidant capable of decreasing the surface oxidation of said copper colloid when contacted with water and/or air, and further wherein said antioxidant is incapable of reducing ions of copper to the metallic state under the conditions employed, and further said copper colloid is nucleated above room temperature; and (b) immersing said treated substrate into an electroless plating bath to deposit a metallic coating.
Claim 33
Dependent Claim
93 words
A process for the electroless plating of a non-conductor substrate which comprises (a) immersing said substrate into a stable colloidal dispersion which comprises a copper colloid and an antioxidant, said antioxidant capable of decreasing the surface oxidation of said copper colloid when contacted with water and/or air, and further wherein said antioxidant is incapable of reducing ions of copper to the metallic state under the conditions employed, and further said copper colloid is nucleated above room temperature; and (b) immersing said treated substrate into an electroless plating bath to deposit a metallic coating.
Claim 34
Dependent Claim
14 words
The process according to claim 30 wherein said substrate is a printed circuitry substrate.
Claim 35
Dependent Claim
14 words
The process according to claim 31 wherein said printed circuitry substrate further contains through-holes.
Claim 36
Dependent Claim
25 words
The process according to claim 30 wherein said substrate is a printed circuitry substrate and wherein said electroless plating bath is an electroless copper bath.
Claim 37
Dependent Claim
16 words
The process according to claim 33 wherein said electroless copper bath is used above room temperature.
Claim 38
Dependent Claim
15 words
The process according to claim 30 wherein said colloidal dispersion further contains a colloid stabilizer.
Claim 39
Dependent Claim
14 words
The process according to claim 30 wherein said antioxidant is also a colloid stabilizer.
Claim 40
Dependent Claim
27 words
The process according to claim 30 further containing the step of activation, said activation taking place subsequent to the immersion of said substrate into said colloidal dispersion.
Claim 41
Dependent Claim
32 words
The process according to claim 37 wherein said activation being an immersion of said substrate into a composition comprising a reducing agent capable of reducing copper ions to a lower oxidation state.
Claim 42
Dependent Claim
35 words
The process according to claim 30 further containing the step of water rinsing to remove excess colloid from said substrate, said rinsing taking place subsequent to the contacting of said substrate with said copper colloid.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-08-03 | 1985-02-02 | 1985-08-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-08-03 | 1989-02-02 | 1989-08-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-08-03 | 1993-02-02 | 1993-08-04 | $7700.00 | Window Closed / Lapsed |