US4261747A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Dispersions for activating non-conductors for electroless plating
Assignee: Individual
•
Filing: 1978-12-06
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Granted: 1981-04-14
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Expires: 1998-12-06
Abstract
Abstract Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless (chemical) coating process comprised of coating the surface of the substrate with colloids of catalytic non-precious metals wherein the metals are either part of an alloy or in the elemental state or a compound and wherein the colloidal compositions are prepared by a special method which renders the colloids a greater catalytic activity when used in the plating process.
Inventors
- 👤 Nathan Feldstein
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 17:32
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/28; H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
58 words
A colloidal composition useful in the catalytic preparation of non-conductors prior to electroless plating comprising a copper colloid admixed with nickel ions and wherein said copper colloid is produced through the chemical interaction of copper ions with a reducing agent and further wherein the admixing of nickel ions takes place subsequent to the production of the copper colloid.
Claim 2
Dependent Claim
58 words
A colloidal composition useful in the catalytic preparation of non-conductors prior to electroless plating comprising a copper colloid admixed with nickel ions and wherein said copper colloid is produced through the chemical interaction of copper ions with a reducing agent and further wherein the admixing of nickel ions takes place subsequent to the production of the copper colloid.
Claim 3
Dependent Claim
18 words
The colloidal composition according to claim 1 wherein said copper colloid is derived from a copper (II) compound.
Claim 4
Dependent Claim
18 words
The colloidal composition according to claim 1 wherein said copper colloid is derived from a copper (I) compound.
Claim 5
Dependent Claim
17 words
The colloidal composition according to claim 1 wherein said colloidal composition is derived from a dry powder.
Claim 6
Dependent Claim
14 words
The colloidal composition according to claim 1 wherein said reducing agent is an hydride.
Claim 7
Dependent Claim
15 words
The composition according to claim 1 wherein said non conductor is a printed circuit board.
Claim 8
Dependent Claim
15 words
The composition according to claim 1 wherein said colloidal composition further contains a colloidal stabilizer.
Claim 9
Dependent Claim
14 words
The composition according to claim 1 wherein said copper colloid is of copper metal.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-04-13 | 1984-10-13 | 1985-04-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-04-13 | 1988-10-13 | 1989-04-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-04-13 | 1992-10-13 | 1993-04-14 | $7700.00 | Window Closed / Lapsed |