Catalytic lacquer for producing printing circuits
Abstract
Abstract A catalytic lacquer for the production of printed circuit boards using basic materials and metal deposition methods. The lacquer has the following composition: a binding agent based on synthetic or natural materials; water; a metal salt; a complex former; and a reducing agent. The binding agent may be a water soluble or dispersable compound. The metal salt may be a water soluble palladium, copper, silver, gold or nickel salt, preferably the sulphate. The complex former may be in the form of a compound forming stable complexes with metal ions. The reducing agent may be in the form of formaldehyde, hydrazine or its derivatives, boron compounds, sorbitols, phosphites, or hydrophosphites. The lacquer may also include an organic solvent or solvent mixture, preferably methylene chloride. A filler and stabilizer may also be included in the composition of the lacquer. The lacquer may be applied to base materials by means of silk screen printing, and then dried so that the metal seed layer is strengthened by the action of a metal deposition reduction bath.
Inventors
- 👤 Kurt Heymann
- 👤 Rolf Rolff
Bibliographic Details
Claims Analysis
Total Claims: 7References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-03-02 | 1984-09-01 | 1985-03-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-03-02 | 1988-09-01 | 1989-03-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-03-02 | 1992-09-01 | 1993-03-03 | $7700.00 | Window Closed / Lapsed |