Patent Explorer
Browse, filter, and analyze 946 patents across global jurisdictions.
| Patent Number | Title | Assignee | Status | Filing Date | Grant Date | Expires | Remaining | Claims | Actions |
|---|---|---|---|---|---|---|---|---|---|
| FR2284189A1 | PROCESS FOR DEPOSITING POLYCRYSTALLINE SEMICONDUCTOR MATERIAL | Radiotechnique Compelec RTC SA | Expired / Lapsed | 1974-09-03 | — | 1994-09-03 | 0.0 yrs | 0 | |
| DE19603107A1 | Self pre-ageing circuit device for semiconductor memory e.g. application specific memory | SK Hynix Inc | Expired / Lapsed | 1996-01-29 | — | 2016-01-29 | 0.0 yrs | 0 | |
| GB2049202A | Eprom reliability test circuit | Fairchild Semiconductor Corp | Expired / Lapsed | 1980-02-26 | — | 2000-02-26 | 0.0 yrs | 10 | |
| GB2042296A | Nonvolatile static random access method and memory device | Xicor LLC | Expired / Lapsed | 1980-01-16 | — | 2000-01-16 | 0.0 yrs | 14 | |
| WO1979000724A1 | Amorphous semiconductors equivalent to crystalline semiconductors | Energy Conversion Devices Inc | Expired / Lapsed | 1979-03-02 | — | 1999-03-02 | 0.0 yrs | 0 | |
| JPS6017726A | Semiconductor optical switch | KDDI Corp | Expired / Lapsed | 1983-07-12 | — | 2003-07-12 | 0.0 yrs | 0 | |
| JPS5860726A | Optical switch | NTT Inc | Expired / Lapsed | 1981-10-08 | — | 2001-10-08 | 0.0 yrs | 0 | |
| DE1105526B | Method for manufacturing a semiconductor device | Siemens Corp | Expired / Lapsed | 1959-12-29 | — | 1979-12-29 | 0.0 yrs | 0 | |
| EP0165865A2 | Method and apparatus for testing integrated circuits | Fairchild Semiconductor Corp | Expired / Lapsed | 1985-06-14 | — | 2005-06-14 | 0.0 yrs | 65 | |
| EP0190107A2 | Laser equipment for medical use | Individual | Expired / Lapsed | 1986-01-24 | — | 2006-01-24 | 0.0 yrs | 5 | |
| GB1469486A | Testing semiconductor devices | International Business Machines Corp | Expired / Lapsed | 1974-05-01 | — | 1994-05-01 | 0.0 yrs | 0 | |
| EP1444734A1 | Fib-protected semiconductor chip | Infineon Technologies AG | Expired / Lapsed | 2002-10-21 | — | 2022-10-21 | 0.0 yrs | 0 | |
| JPS5740964A | Cooling device for semiconductor power element | Toshiba Corp | Expired / Lapsed | 1980-08-26 | — | 2000-08-26 | 0.0 yrs | 0 | |
| JPS54160167A | Bonding device | Toshiba Corp | Expired / Lapsed | 1978-06-09 | — | 1998-06-09 | 0.0 yrs | 0 | |
| CH331017A | Method for producing a PN junction in a semiconductor | Standard Telephon & Radio Ag | Expired / Lapsed | 1954-07-22 | — | 1974-07-22 | 0.0 yrs | 0 | |
| US20020001905A1 | Vertical nano-size transistor using carbon nanotubes and manufacturing method thereof | Samsung Electronics Co Ltd | Expired / Lapsed | 2001-06-27 | — | 2021-06-27 | 0.0 yrs | 16 | |
| GB738216A | Improvements in and relating to broad area transistors | General Electric Co | Expired / Lapsed | 1953-06-15 | — | 1973-06-15 | 0.0 yrs | 0 | |
| JPS63122148A | Manufacture of semiconductor device | Fujitsu Ltd | Expired / Lapsed | 1986-11-11 | — | 2006-11-11 | 0.0 yrs | 0 | |
| EP0020116A1 | Masterslice semiconductor device and method of producing it | Fujitsu Ltd | Expired / Lapsed | 1980-05-23 | — | 2000-05-23 | 0.0 yrs | 8 | |
| EP0051158A1 | Electrically alterable double dense memory | International Business Machines Corp | Expired / Lapsed | 1981-10-05 | — | 2001-10-05 | 0.0 yrs | 14 |
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