Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
162 words
A semiconductor device comprising a semiconductor bulk in which a cell including a plurality of basic circuit elements is formed, first conductive lines (24) for connecting the basic circuit elements being formed on a first insulation layer (22) of the said semiconductor bulk and a second insulation layer (25) being formed over the first interconnecting lines, characterized in that at least one of the said first conductive lines (24) between two of the said basic elements (Ql, Rl) in the cell comprises two separate portions, one end of each of the portions being connected to a respective one of the basic elements, and in that the said second insulation layer (25) is provided with a pair of through-holes (11, 11') which communicate respectively with the other ends of the said two portions of the said conductive line (24), whereby the basic elements can be interconnected (16) by connecting together, by way of the through-holes, the said other ends of the two portions.
Claim 2
Dependent Claim
162 words
A semiconductor device comprising a semiconductor bulk in which a cell including a plurality of basic circuit elements is formed, first conductive lines (24) for connecting the basic circuit elements being formed on a first insulation layer (22) of the said semiconductor bulk and a second insulation layer (25) being formed over the first interconnecting lines, characterized in that at least one of the said first conductive lines (24) between two of the said basic elements (Ql, Rl) in the cell comprises two separate portions, one end of each of the portions being connected to a respective one of the basic elements, and in that the said second insulation layer (25) is provided with a pair of through-holes (11, 11') which communicate respectively with the other ends of the said two portions of the said conductive line (24), whereby the basic elements can be interconnected (16) by connecting together, by way of the through-holes, the said other ends of the two portions.
Claim 3
Dependent Claim
39 words
A semiconductor device as set forth in claim 1, characterized in-that at least one conductor (16) is provided on the second insulation layer and extends into the said through-holes so as to electrically connect the said two portions .
Claim 4
Dependent Claim
32 words
A semiconductor device as set forth in claim 1 or 2, characterized in that at least one of the through-holes is arranged for selective connection to a power line or ground line.
Claim 5
Dependent Claim
91 words
A semiconductor device as set forth in claim 2, characterized in that the through-holes are distributed in through-hole areas formed on said second insulation layer, in that second interconnecting lines formed thereon, including the said conductor, are distributed on line areas formed on the same second insulation layer, the through-hole areas being spaced in a first direction (X) at a predetermined pitch and extend a second direction (Y), perpendicular to the first direction, each of the said line areas being located between one through-hole area and another through-hole area adjacent thereto.
Claim 6
Dependent Claim
33 words
A semiconductor device as set forth in claim 4, wherein the first interconnecting lines are arranged in the first direction (X) and the second interconnecting lines are arranged in the second direction (Y).
Claim 7
Dependent Claim
31 words
A semiconductor device as set forth in claim 5, wherein the first interconnecting line is connected to the second interconnecting line via the through-hole located adjacent to the first interconnecting line.
Claim 8
Dependent Claim
35 words
A semiconductor device as set forth in claim 4, wherein the said conductor is also distributed on the said through-hole area, if a corresponding pair of the through-holes are located on the same through-hole area.