Patent US6744137B2 successfully refreshed from Google Patents.
US6744137B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Bumped die and wire bonded board-on-chip package
Assignee: Micron Technology Inc
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Filing: 2002-03-05
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Granted: 2004-06-01
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Expires: 2022-03-05
Abstract
Abstract An apparatus for making a semiconductor assembly and, specifically, interconnecting a semiconductor die to a carrier substrate. The carrier substrate includes a first surface and a second surface with at least one opening therethrough. The die includes an active surface and a back surface, wherein the die is attached facedown to the first surface of the carrier substrate with conductive bumps therebetween. In addition, a plurality of bond wires is attached through the at least one opening in the carrier substrate between the active surface of the die and the second surface of the carrier substrate. With this arrangement, both the conductive bumps and the bond wires share in the electrical interconnection between the die and the carrier substrate, thereby allowing more space for bond pads to interconnect with bond wires and/or allowing for smaller die sizes.
Inventors
- 👤 Larry D. Kinsman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:23
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/68; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/111; H10W74/129; H10W74/15; H10W90/00; H10W90/701; H10W99/00; H10W72/00; H10W72/01; H10W72/012; H10W72/01221; H10W72/01225; H10W72/071; H10W72/072; H10W72/07231; H10W72/07234; H10W72/07236; H10W72/073; H10W72/075; H10W72/20; H10W72/251; H10W72/252; H10W72/253; H10W72/29; H10W72/50; H10W72/551; H10W72/851; H10W72/853; H10W72/856; H10W72/859; H10W72/90; H10W72/941; H10W72/944; H10W72/9445; H10W72/951; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 57
Claim 1
Independent Claim
119 words
A semiconductor assembly comprising: a substrate having a first surface, a second surface and at least one opening therethrough, the at least one opening in the substrate extending from the first surface to the second surface of the substrate; a semiconductor die having an active surface and a back surface, the active surface of the semiconductor die attached to the first surface of the substrate; a plurality of bond wires extending through the at least one opening in the substrate and bonded from the active surface of the semiconductor die to the second surface of the substrate; and a plurality of conductive bumps disposed between the active surface of the semiconductor die and the first surface of the substrate.
Claim 2
Dependent Claim
119 words
A semiconductor assembly comprising: a substrate having a first surface, a second surface and at least one opening therethrough, the at least one opening in the substrate extending from the first surface to the second surface of the substrate; a semiconductor die having an active surface and a back surface, the active surface of the semiconductor die attached to the first surface of the substrate; a plurality of bond wires extending through the at least one opening in the substrate and bonded from the active surface of the semiconductor die to the second surface of the substrate; and a plurality of conductive bumps disposed between the active surface of the semiconductor die and the first surface of the substrate.
Claim 3
Dependent Claim
19 words
The assembly of claim 1 , further comprising a filler material located between the semiconductor die and the substrate.
Claim 4
Dependent Claim
15 words
The assembly of claim 1 , wherein the plurality of conductive bumps comprises solder balls.
Claim 5
Dependent Claim
15 words
The assembly of claim 1 , wherein the plurality of conductive bumps comprises stud bumps.
Claim 6
Dependent Claim
17 words
The assembly of claim 1 , wherein the plurality of conductive bumps comprises a z-axis conductive material.
Claim 7
Dependent Claim
24 words
The assembly of claim 1 , wherein the plurality of conductive bumps comprises power and ground connections between the semiconductor die and the substrate.
Claim 8
Dependent Claim
25 words
The assembly of claim 1 , wherein the plurality of conductive bumps comprises a portion of signal routing between the semiconductor die and the substrate.
Claim 9
Dependent Claim
28 words
The assembly of claim 1 , wherein the plurality of bond wires and the plurality of conductive bumps comprise signal routing between the semiconductor die and the substrate.
Claim 10
Dependent Claim
19 words
The assembly of claim 1 , further comprising a sealant material encapsulating at least the plurality of bond wires.
Claim 11
Dependent Claim
18 words
The assembly of claim 9 , wherein the sealant material substantially encapsulates exposed portions of the semiconductor die.
Claim 12
Dependent Claim
18 words
The assembly of claim 1 , further comprising interconnect bumps disposed on the second surface of the substrate.
Claim 13
Dependent Claim
16 words
The assembly of claim 11 , wherein the interconnect bumps interconnect with a printed circuit board.
Claim 14
Dependent Claim
24 words
The assembly of claim 12 , wherein a filler material is disposed between the second surface of the substrate and the printed circuit board.
Claim 15
Dependent Claim
23 words
The assembly of claim 1 , wherein the substrate comprises at least one of a carrier substrate, interposer and a printed circuit board.
Claim 16
Dependent Claim
19 words
The assembly of claim 1 , wherein the at least one opening is substantially centrally located in the substrate.
Claim 17
Dependent Claim
66 words
The assembly of claim 15 , wherein the semiconductor die is attached to the substrate having centrally located bond pads on the active surface of the semiconductor die exposed through the at least one opening and outer bond pads on the active surface of the semiconductor die are mirrored with bond pads on the first surface of the substrate having the plurality of conductive bumps therebetween.
Claim 18
Dependent Claim
29 words
The assembly of claim 1 , wherein the at least one opening comprises a plurality of openings extending proximate more than one side of a periphery of the substrate.
Claim 19
Dependent Claim
24 words
The assembly of claim 1 , wherein the at least one opening extends proximate more than one side of a periphery of the substrate.
Claim 20
Dependent Claim
65 words
The assembly of claim 17 , wherein the semiconductor die is attached to the substrate having peripheral bond pads on the active surface of the semiconductor die exposed through the plurality of openings and centrally located bond pads on the active surface of the semiconductor die are mirrored with bond pads on the first surface of the substrate having the plurality of conductive bumps therebetween.
Claim 21
Dependent Claim
85 words
An interconnection assembly between an active surface of a semiconductor die attached to a substrate having a first surface, a second surface and at least one opening extending therethrough, the assembly comprising: a plurality of bond wires extending through the at least one opening in the substrate and bonded from the active surface of the semiconductor die to the second surface of the substrate; a plurality of conductive bumps disposed between the active surface of the semiconductor die and the first surface of the substrate.
Claim 22
Dependent Claim
85 words
An interconnection assembly between an active surface of a semiconductor die attached to a substrate having a first surface, a second surface and at least one opening extending therethrough, the assembly comprising: a plurality of bond wires extending through the at least one opening in the substrate and bonded from the active surface of the semiconductor die to the second surface of the substrate; a plurality of conductive bumps disposed between the active surface of the semiconductor die and the first surface of the substrate.
Claim 23
Dependent Claim
19 words
The assembly of claim 20 , further comprising a filler material located between the semiconductor die and the substrate.
Claim 24
Dependent Claim
15 words
The assembly of claim 20 , wherein the plurality of conductive bumps comprises solder balls.
Claim 25
Dependent Claim
15 words
The assembly of claim 20 , wherein the plurality of conductive bumps comprises stud bumps.
Claim 26
Dependent Claim
17 words
The assembly of claim 20 , wherein the plurality of conductive bumps comprises a z-axis conductive material.
Claim 27
Dependent Claim
24 words
The assembly of claim 20 , wherein the plurality of conductive bumps comprises power and ground connections between the semiconductor die and the substrate.
Claim 28
Dependent Claim
25 words
The assembly of claim 20 , wherein the plurality of conductive bumps comprises a portion of signal routing between the semiconductor die and the substrate.
Claim 29
Dependent Claim
28 words
The assembly of claim 20 , wherein the plurality of bond wires and the plurality of conductive bumps comprise signal routing between the semiconductor die and the substrate.
Claim 30
Dependent Claim
19 words
The assembly of claim 20 , further comprising a sealant material encapsulating at least the plurality of bond wires.
Claim 31
Dependent Claim
18 words
The assembly of claim 28 , wherein the sealant material substantially encapsulates exposed portions of the semiconductor die.
Claim 32
Dependent Claim
18 words
The assembly of claim 20 , further comprising interconnect bumps disposed on the second surface of the substrate.
Claim 33
Dependent Claim
19 words
The assembly of claim 20 , wherein the at least one opening is substantially centrally located in the substrate.
Claim 34
Dependent Claim
66 words
The assembly of claim 31 , wherein the semiconductor die is attached to the substrate having centrally located bond pads on the active surface of the semiconductor die exposed through the at least one opening and outer bond pads on the active surface of the semiconductor die are mirrored with bond pads on the first surface of the substrate having the plurality of conductive bumps therebetween.
Claim 35
Dependent Claim
29 words
The assembly of claim 20 , wherein the at least one opening comprises a plurality of openings extending proximate more than one side of a periphery of the substrate.
Claim 36
Dependent Claim
24 words
The assembly of claim 20 , wherein the at least one opening extends proximate more than one side of a periphery of the substrate.
Claim 37
Dependent Claim
65 words
The assembly of claim 33 , wherein the semiconductor die is attached to the substrate having peripheral bond pads on the active surface of the semiconductor die exposed through the plurality of openings and centrally located bond pads on the active surface of the semiconductor die are mirrored with bond pads on the first surface of the substrate having the plurality of conductive bumps therebetween.
Claim 38
Dependent Claim
118 words
An assembly comprising: a substrate having a first surface, a second surface and at least one opening therethrough, the at least one opening in the substrate extending from the first surface to the second surface of the substrate; a semiconductor die having an active surface and a back surface, the active surface of the semiconductor die attached to the first surface of the substrate; a plurality of bond wires extending through the at least one opening in the substrate and bonded from the active surface of the semiconductor die to the second surface of the substrate; and a plurality of conductive bumps disposed between the active surface of the semiconductor die and the first surface of the substrate.
Claim 39
Dependent Claim
118 words
An assembly comprising: a substrate having a first surface, a second surface and at least one opening therethrough, the at least one opening in the substrate extending from the first surface to the second surface of the substrate; a semiconductor die having an active surface and a back surface, the active surface of the semiconductor die attached to the first surface of the substrate; a plurality of bond wires extending through the at least one opening in the substrate and bonded from the active surface of the semiconductor die to the second surface of the substrate; and a plurality of conductive bumps disposed between the active surface of the semiconductor die and the first surface of the substrate.
Claim 40
Dependent Claim
19 words
The assembly of claim 36 , further comprising a filler material located between the semiconductor die and the substrate.
Claim 41
Dependent Claim
15 words
The assembly of claim 36 , wherein the plurality of conductive bumps comprises solder balls.
Claim 42
Dependent Claim
15 words
The assembly of claim 36 , wherein the plurality of conductive bumps comprises stud bumps.
Claim 43
Dependent Claim
17 words
The assembly of claim 36 , wherein the plurality of conductive bumps comprises a z-axis conductive material.
Claim 44
Dependent Claim
24 words
The assembly of claim 36 , wherein the plurality of conductive bumps comprises power and ground connections between the semiconductor die and the substrate.
Claim 45
Dependent Claim
25 words
The assembly of claim 36 , wherein the plurality of conductive bumps comprises a portion of signal routing between the semiconductor die and the substrate.
Claim 46
Dependent Claim
28 words
The assembly of claim 36 , wherein the plurality of bond wires and the plurality of conductive bumps comprise signal routing between the semiconductor die and the substrate.
Claim 47
Dependent Claim
19 words
The assembly of claim 36 , further comprising a sealant material encapsulating at least the plurality of bond wires.
Claim 48
Dependent Claim
18 words
The assembly of claim 44 , wherein the sealant material substantially encapsulates exposed portions of the semiconductor die.
Claim 49
Dependent Claim
18 words
The assembly of claim 36 , further comprising interconnect bumps disposed on the second surface of the substrate.
Claim 50
Dependent Claim
16 words
The assembly of claim 46 , wherein the interconnect bumps interconnect with a printed circuit board.
Claim 51
Dependent Claim
24 words
The assembly of claim 47 , wherein a filler material is disposed between the second surface of the substrate and the printed circuit board.
Claim 52
Dependent Claim
23 words
The assembly of claim 36 , wherein the substrate comprises at least one of a carrier substrate, interposer and a printed circuit board.
Claim 53
Dependent Claim
19 words
The assembly of claim 36 , wherein the at least one opening is substantially centrally located in the substrate.
Claim 54
Dependent Claim
66 words
The assembly of claim 50 , wherein the semiconductor die is attached to the substrate having centrally located bond pads on the active surface of the semiconductor die exposed through the at least one opening and outer bond pads on the active surface of the semiconductor die are mirrored with bond pads on the first surface of the substrate having the plurality of conductive bumps therebetween.
Claim 55
Dependent Claim
29 words
The assembly of claim 36 , wherein the at least one opening comprises a plurality of openings extending proximate more than one side of a periphery of the substrate.
Claim 56
Dependent Claim
24 words
The assembly of claim 36 , wherein the at least one opening extends proximate more than one side of a periphery of the substrate.
Claim 57
Dependent Claim
65 words
The assembly of claim 36 , wherein the semiconductor die is attached to the substrate having peripheral bond pads on the active surface of the semiconductor die exposed through the plurality of openings and centrally located bond pads on the active surface of the semiconductor die are mirrored with bond pads on the first surface of the substrate having the plurality of conductive bumps therebetween.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-06-01 | 2007-12-01 | 2008-06-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-06-01 | 2011-12-01 | 2012-06-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-06-01 | 2015-12-01 | 2016-06-01 | $7700.00 | Window Closed / Lapsed |