US5719440A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flip chip adaptor package for bare die
Assignee: Round Rock Research LLC
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Filing: 1995-12-19
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Granted: 1998-02-17
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Expires: 2015-12-19
Abstract
Abstract A board connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement. The board comprises a printed circuit board including first elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the board and the master board, and second elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the semiconductor die and the board. The board has circuit traces for electrical communication between the board/master board electrical contact elements, and the semiconductor die board electrical contact elements.
Inventors
- 👤 Walter L. Moden
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 15:57
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/328; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/68; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/111; H10W74/15; H10W90/00; H10W90/701; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H05K2201/00; H05K2201/04; H05K2201/049; H05K2201/10; H05K2201/10431; H05K2201/10439; H05K2201/10477; H05K2203/00; H05K2203/04; H05K2203/0415; H05K2203/049; H05K3/36; H05K3/368; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/071; H10W72/0711; H10W72/072; H10W72/07231; H10W72/07236; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5445; H10W72/851; H10W72/853; H10W72/856; H10W72/865; H10W72/874; H10W72/884; H10W72/90; H10W72/941; H10W72/9415; H10W90/721; H10W90/724; H10W90/751; H10W90/754; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
180 words
A board for connecting a bare semiconductor die which does not conform to a specific or standardized pin out, connector pad locations or lead placement on a master board with which the bare semiconductor die is to be employed, comprising: a board having at least one via extending therethrough, a die side surface and an attachment surface; means for making electrical contact between said board and said attachment surface of said master board, said means for making electrical contact including a plurality of solder balls protruding from said attachment surface of the board; means for making electrical contact between said board and said master board, said means for making electrical contact including a plurality of bond wires wherein said bond wires are electrically connected with said semiconductor die and extend through said via to electrically connect to said attachment side of said board; and said board having circuit traces for electrical communication between said means for making electrical contact between said board and said mater board, and said means for making electrical contact between said semiconductor die and said board.
Claim 2
Dependent Claim
180 words
A board for connecting a bare semiconductor die which does not conform to a specific or standardized pin out, connector pad locations or lead placement on a master board with which the bare semiconductor die is to be employed, comprising: a board having at least one via extending therethrough, a die side surface and an attachment surface; means for making electrical contact between said board and said attachment surface of said master board, said means for making electrical contact including a plurality of solder balls protruding from said attachment surface of the board; means for making electrical contact between said board and said master board, said means for making electrical contact including a plurality of bond wires wherein said bond wires are electrically connected with said semiconductor die and extend through said via to electrically connect to said attachment side of said board; and said board having circuit traces for electrical communication between said means for making electrical contact between said board and said mater board, and said means for making electrical contact between said semiconductor die and said board.
Claim 3
Dependent Claim
163 words
A board for connecting a bare semiconductor die which does not conform to a specific or standardized pin out, connector pad locations, or lead placement on a master board with which the bare semiconductor die is to be employed, comprising: a board having at least one via extending therethrough, a die side surface and an attachment surface; means for making electrical contact between said board and said master board, said means including pins protruding from the attachment surface of the board; means for making electrical contact between said semiconductor die and said board, said means including a plurality of bond wires wherein said bond wires are electrically connected with said semiconductor die and extend through said via to electrically connect to said attachment side of said board; and said board having circuit traces for electrical communication between said means for making electrical contact between said board and said master board, and means for making electrical contact between said semiconductor die and said board.
Claim 4
Dependent Claim
163 words
A board for connecting a bare semiconductor die which does not conform to a specific or standardized pin out, connector pad locations, or lead placement on a master board with which the bare semiconductor die is to be employed, comprising: a board having at least one via extending therethrough, a die side surface and an attachment surface; means for making electrical contact between said board and said master board, said means including pins protruding from the attachment surface of the board; means for making electrical contact between said semiconductor die and said board, said means including a plurality of bond wires wherein said bond wires are electrically connected with said semiconductor die and extend through said via to electrically connect to said attachment side of said board; and said board having circuit traces for electrical communication between said means for making electrical contact between said board and said master board, and means for making electrical contact between said semiconductor die and said board.
Claim 5
Dependent Claim
143 words
A board for connecting a bare semiconductor die which does not conform to a specific or standardized pin out, connector pad locations, or lead placement on a master board with which the bare semiconductor die is to be employed, comprising: a board having at least one via extending therethrough, a die side surface, and an attachment surface; means for making electrical contact between said board and said master board, said means including a plurality of bond wires; means for making electrical contact between said semiconductor die and said board, said means including a plurality of bond wires wherein said bond wires are electrically connected with said semiconductor die and extend through said via to electrically connect to said board; and said board having circuit traces for electrical communication between said board/master board electrical contact means, and said semiconductor die board electrical contact means.
Claim 6
Dependent Claim
143 words
A board for connecting a bare semiconductor die which does not conform to a specific or standardized pin out, connector pad locations, or lead placement on a master board with which the bare semiconductor die is to be employed, comprising: a board having at least one via extending therethrough, a die side surface, and an attachment surface; means for making electrical contact between said board and said master board, said means including a plurality of bond wires; means for making electrical contact between said semiconductor die and said board, said means including a plurality of bond wires wherein said bond wires are electrically connected with said semiconductor die and extend through said via to electrically connect to said board; and said board having circuit traces for electrical communication between said board/master board electrical contact means, and said semiconductor die board electrical contact means.
Claim 7
Dependent Claim
151 words
An assembly of electrical elements adapting a die to a master board comprising: a master board; a bare semiconductor die which does not conform to a specific or standardized pin out, connector pad locations, or lead placement on said master board; and a board having at least one via extending therethrough, a die side surface, and an attachment surface wherein said master board is electrically connected to said board attachment surface by a plurality of solder balls protruding from the attachment surface of the board and are refluxed to attach said board to said master board, and said bare semiconductor die is electrically connected to said board die side surface by a plurality of bond wires and extend through said at least one via to electrically connect to said attachment side of the board, said board having circuit traces for electrical communication between said bare semiconductor die and said master board.
Claim 8
Dependent Claim
151 words
An assembly of electrical elements adapting a die to a master board comprising: a master board; a bare semiconductor die which does not conform to a specific or standardized pin out, connector pad locations, or lead placement on said master board; and a board having at least one via extending therethrough, a die side surface, and an attachment surface wherein said master board is electrically connected to said board attachment surface by a plurality of solder balls protruding from the attachment surface of the board and are refluxed to attach said board to said master board, and said bare semiconductor die is electrically connected to said board die side surface by a plurality of bond wires and extend through said at least one via to electrically connect to said attachment side of the board, said board having circuit traces for electrical communication between said bare semiconductor die and said master board.
Claim 9
Dependent Claim
145 words
An assembly of electrical elements adapting a die to a master board comprising: a master board having an attachment side surface; a bare semiconductor die which does not conform to a specific or standardized pin out, connector pad locations, or lead placement on said master board; and a board having a die side surface and an attachment surface wherein said master board is electrically connected to said board attachment surface by pins protruding form the attachment surface of the board attached to the attachment side surface of said master board, and said bare semiconductor die is electrically connected to said board die side surface by a plurality of pins extending substantially perpendicularly from an attachment surface of said semiconductor die attached to the die surface of said board, said board having circuit traces for electrical communication between said bare semiconductor die and said master board.
Claim 10
Dependent Claim
145 words
An assembly of electrical elements adapting a die to a master board comprising: a master board having an attachment side surface; a bare semiconductor die which does not conform to a specific or standardized pin out, connector pad locations, or lead placement on said master board; and a board having a die side surface and an attachment surface wherein said master board is electrically connected to said board attachment surface by pins protruding form the attachment surface of the board attached to the attachment side surface of said master board, and said bare semiconductor die is electrically connected to said board die side surface by a plurality of pins extending substantially perpendicularly from an attachment surface of said semiconductor die attached to the die surface of said board, said board having circuit traces for electrical communication between said bare semiconductor die and said master board.
Claim 11
Dependent Claim
159 words
An assembly of electrical elements adapting a die to a master board comprising: a master board having an attachment side surface; a bare semiconductor die which does not conform to a specific or standardized pin out, connector pad locations, or lead placement on said master board; and a board having at least one via extending therethrough, a die side surface, and an attachment surface wherein said master board is electrically connected to said board attachment surface by pins protruding from the attachment surface of the board attached to the attachment side surface of said master board, and said bare semiconductor die is electrically connected to said board die side surface by a plurality of bond wires wherein said bond wires are electrically connected with said semiconductor die and extend through said via to electrically connect to said attachment side of said board, said board having circuit traces for electrical communication between said bare semiconductor die and said master board.
Claim 12
Dependent Claim
159 words
An assembly of electrical elements adapting a die to a master board comprising: a master board having an attachment side surface; a bare semiconductor die which does not conform to a specific or standardized pin out, connector pad locations, or lead placement on said master board; and a board having at least one via extending therethrough, a die side surface, and an attachment surface wherein said master board is electrically connected to said board attachment surface by pins protruding from the attachment surface of the board attached to the attachment side surface of said master board, and said bare semiconductor die is electrically connected to said board die side surface by a plurality of bond wires wherein said bond wires are electrically connected with said semiconductor die and extend through said via to electrically connect to said attachment side of said board, said board having circuit traces for electrical communication between said bare semiconductor die and said master board.
Claim 13
Dependent Claim
127 words
An assembly of electrical elements adapting a die to a master board comprising: a master board; a bare semiconductor die which does not conform to a specific or standardized pin out, connector pad locations, or lead placement on said master board; and a board having a die side surface and an attachment surface wherein said master board is electrically connected to said board attachment surface by a plurality of bond wires, and said bare semiconductor die is electrically connected to said board die side surface by a plurality of pins extending substantially perpendicularly from an attachment surface of said semiconductor die attached to said die side surface of said board, said board having circuit traces for electrical communication between said bare semiconductor die and said master board.
Claim 14
Dependent Claim
127 words
An assembly of electrical elements adapting a die to a master board comprising: a master board; a bare semiconductor die which does not conform to a specific or standardized pin out, connector pad locations, or lead placement on said master board; and a board having a die side surface and an attachment surface wherein said master board is electrically connected to said board attachment surface by a plurality of bond wires, and said bare semiconductor die is electrically connected to said board die side surface by a plurality of pins extending substantially perpendicularly from an attachment surface of said semiconductor die attached to said die side surface of said board, said board having circuit traces for electrical communication between said bare semiconductor die and said master board.
Claim 15
Dependent Claim
108 words
An assembly of electrical elements adapting a die to a master board comprising: a master board; a bare semiconductor die which does not conform to a specific or standardized pin out, connector pad locations, or lead placement on said master board; and a board having a die side surface and an attachment surface wherein said master board is electrically connected to said board attachment surface by a plurality of bond wires, and said bare semiconductor die is electrically connected to said board die side surface by a plurality of bond wires; said board having circuit traces for electrical communication between said bare semiconductor die and said master board.
Claim 16
Dependent Claim
108 words
An assembly of electrical elements adapting a die to a master board comprising: a master board; a bare semiconductor die which does not conform to a specific or standardized pin out, connector pad locations, or lead placement on said master board; and a board having a die side surface and an attachment surface wherein said master board is electrically connected to said board attachment surface by a plurality of bond wires, and said bare semiconductor die is electrically connected to said board die side surface by a plurality of bond wires; said board having circuit traces for electrical communication between said bare semiconductor die and said master board.
Claim 17
Dependent Claim
114 words
An assembly of electrical elements adapting a die to a master board comprising: a master board; a bare semiconductor die which does not conform to a specific or standardized pin out, connector pad locations, or lead placement on said master board; and a board having at least one via extending therethrough, a die side surface and an attachment surface wherein said master board is electrically connected to said board attachment surface by a plurality of bond wires, and said bare semiconductor die is electrically connected to said board die side surface by a plurality of bond wires, said board having circuit traces for electrical communication between said bare semiconductor die and said master board.
Claim 18
Dependent Claim
114 words
An assembly of electrical elements adapting a die to a master board comprising: a master board; a bare semiconductor die which does not conform to a specific or standardized pin out, connector pad locations, or lead placement on said master board; and a board having at least one via extending therethrough, a die side surface and an attachment surface wherein said master board is electrically connected to said board attachment surface by a plurality of bond wires, and said bare semiconductor die is electrically connected to said board die side surface by a plurality of bond wires, said board having circuit traces for electrical communication between said bare semiconductor die and said master board.
Claim 19
Dependent Claim
125 words
An assembly of electrical elements adapting a die to a master board comprising: a master board; a bare semiconductor die which does not conform to a specific or standardized pin out, connector pad locations, or lead placement on said master board; and a board having at least one via extending therethrough, a die side surface, and an attachment surface wherein said master board is electrically connected to said board attachment surface by a plurality of bond wires, and said bare semiconductor die is electrically connected to said board die side surface by a plurality of bond wires and extend through said via to electrically connect to said board, said board having circuit traces for electrical communication between said bare semiconductor die and said master board.
Claim 20
Dependent Claim
125 words
An assembly of electrical elements adapting a die to a master board comprising: a master board; a bare semiconductor die which does not conform to a specific or standardized pin out, connector pad locations, or lead placement on said master board; and a board having at least one via extending therethrough, a die side surface, and an attachment surface wherein said master board is electrically connected to said board attachment surface by a plurality of bond wires, and said bare semiconductor die is electrically connected to said board die side surface by a plurality of bond wires and extend through said via to electrically connect to said board, said board having circuit traces for electrical communication between said bare semiconductor die and said master board.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-02-16 | 2001-08-18 | 2002-02-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-02-16 | 2005-08-18 | 2006-02-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-02-16 | 2009-08-18 | 2010-02-17 | $7700.00 | Window Closed / Lapsed |