Stacked type semiconductor device

Claim 2

A stacked type semiconductor device formed of a plurality of semiconductor integrated circuit devices stacked, each having a parameter and including a semiconductor integrated circuit chip, wherein at least three of the semiconductor integrated circuit devices, at least two of which differ in a numerical value of the parameter, are stacked in the order of a numerical value of the parameter, wherein the parameter is selected from a group of power consumption, operating voltage, number of operating voltages, operating current, guaranteed operating temperature, amount of generated electromagnetic waves, operating frequency, number of connection terminals, connection terminal pitch, thickness, amount of signals transmitted to and from a base substrate on which the semiconductor integrated circuit devices are to be mounted, and amount of signals transmitted to and from an external environment.

Claim 3

A stacked type semiconductor device according to claim 1 , wherein each of the semiconductor integrated circuit devices further includes a substrate on which the semiconductor integrated circuit chip is mounted.

Claim 4

A stacked type semiconductor device according to claim 1 , wherein each of the semiconductor integrated circuit chips has the parameter.

Claim 5

A stacked type semiconductor device according to claim 1 , wherein said at least three of the semiconductor integrated circuit devices are sequentially stacked.

Claim 6

A stacked type semiconductor device according to claim 1 , further comprising: a fourth semiconductor integrated circuit device arranged between one and two others of said at least three semiconductor integrated circuit devices.

Claim 7

A stacked type semiconductor device according to claim 1 , wherein said at least three of the semiconductor integrated circuit devices include at least one of an uppermost one and a lowermost one of the semiconductor integrated circuit devices.

Claim 8

A stacked type semiconductor device according to claim 1 , wherein each of the semiconductor integrated circuit devices includes a conductor that penetrates the semiconductor integrated circuit device, and the semiconductor integrated circuit devices are electrically connected by the conductors.

Claim 9

A stacked type semiconductor device formed of at least three semiconductor integrated circuit devices stacked, each having a parameter and including a semiconductor integrated circuit chip, wherein at least two of the semiconductor integrated circuit devices differ in a numerical value of the parameter, and a numerical value of the parameter of the uppermost semiconductor integrated circuit device or the lowermost semiconductor integrated circuit device is maximum or minimum, wherein the parameter is selected from a group of power consumption, operating voltage, number of operating voltages, operating current, guaranteed operating temperature, amount of generated electromagnetic waves, operating frequency, number of connection terminals, connection terminal pitch, thickness, amount of signals transmitted to and from a base substrate on which the semiconductor integrated circuit devices are to be mounted, and amount of signals transmitted to and from an external environment.

Claim 10

A stacked type semiconductor device formed of at least three semiconductor integrated circuit devices stacked, each having a parameter and including a semiconductor integrated circuit chip, wherein at least two of the semiconductor integrated circuit devices differ in a numerical value of the parameter, and a numerical value of the parameter of the uppermost semiconductor integrated circuit device or the lowermost semiconductor integrated circuit device is maximum or minimum, wherein the parameter is selected from a group of power consumption, operating voltage, number of operating voltages, operating current, guaranteed operating temperature, amount of generated electromagnetic waves, operating frequency, number of connection terminals, connection terminal pitch, thickness, amount of signals transmitted to and from a base substrate on which the semiconductor integrated circuit devices are to be mounted, and amount of signals transmitted to and from an external environment.

Claim 11

A stacked type semiconductor device according to claim 8 , wherein each of the semiconductor integrated circuit devices further includes a substrate on which the semiconductor integrated circuit chip is mounted.

Claim 12

A stacked type semiconductor device according to claim 8 , wherein each of the semiconductor integrated circuit chips has the parameter.

Claim 13

A stacked type semiconductor device according to claim 8 , wherein each of the semiconductor integrated circuit devices includes a conductor that penetrates the semiconductor integrated circuit device, and the semiconductor integrated circuit devices are electrically connected by the conductors.

Claim 14

A stacked type semiconductor device formed of at least two semiconductor integrated circuit devices stacked, each having a parameter and including a semiconductor integrated circuit chip, wherein each of the semiconductor integrated circuit devices includes a conductor that penetrates the semiconductor integrated circuit device, the semiconductor integrated circuit devices are electrically connected by the conductors, at least two of the semiconductor integrated circuit devices differ in a numerical value of the parameter, and a numerical value of the parameter of the uppermost semiconductor integrated circuit device or the lowermost semiconductor integrated circuit device is maximum or minimum, wherein the parameter is selected from a group of power consumption, operating voltage, number of operating voltages, operating current, guaranteed operating temperature, amount of generated electromagnetic waves, operating frequency, number of connection terminals, connection terminal pitch, thickness, amount of signals transmitted to and from a base substrate on which the semiconductor integrated circuit devices are to be mounted, and amount of signals transmitted to and from an external environment.

Claim 15

A stacked type semiconductor device formed of at least two semiconductor integrated circuit devices stacked, each having a parameter and including a semiconductor integrated circuit chip, wherein each of the semiconductor integrated circuit devices includes a conductor that penetrates the semiconductor integrated circuit device, the semiconductor integrated circuit devices are electrically connected by the conductors, at least two of the semiconductor integrated circuit devices differ in a numerical value of the parameter, and a numerical value of the parameter of the uppermost semiconductor integrated circuit device or the lowermost semiconductor integrated circuit device is maximum or minimum, wherein the parameter is selected from a group of power consumption, operating voltage, number of operating voltages, operating current, guaranteed operating temperature, amount of generated electromagnetic waves, operating frequency, number of connection terminals, connection terminal pitch, thickness, amount of signals transmitted to and from a base substrate on which the semiconductor integrated circuit devices are to be mounted, and amount of signals transmitted to and from an external environment.

Claim 16

A stacked type semiconductor device according to claim 12 , wherein each of the semiconductor integrated circuit devices further includes a substrate on which the semiconductor integrated circuit chip is mounted.

Claim 17

A stacked type semiconductor device according to claim 12 , wherein each of the semiconductor integrated circuit chips has the parameter.

Claim 18

A stacked type semiconductor device according to claim 12 , wherein the conductor penetrates the semiconductor integrated circuit chip or a substrate on which the semiconductor integrated circuit chip is mounted.

Claim 19

A stacked type semiconductor device formed of a plurality of semiconductor integrated circuit devices stacked, each having a parameter and including a semiconductor integrated circuit chip, wherein at least two of the semiconductor integrated circuit devices differ in a numerical value of the parameter, and at least two, but not all, of the semiconductor integrated circuit devices form a group, have numerical values of the parameter which fall within a predetermined range and are sequentially stacked, wherein the parameter is selected from a group of power consumption, operating voltage, number of operating voltages, operating current, guaranteed operating temperature, amount of generated electromagnetic waves, operating frequency, number of connection terminals, connection terminal pitch, thickness, amount of signals transmitted to and from a base substrate on which the semiconductor integrated circuit devices are to be mounted, and amount of signals transmitted to and from an external environment.

Claim 20

A stacked type semiconductor device formed of a plurality of semiconductor integrated circuit devices stacked, each having a parameter and including a semiconductor integrated circuit chip, wherein at least two of the semiconductor integrated circuit devices differ in a numerical value of the parameter, and at least two, but not all, of the semiconductor integrated circuit devices form a group, have numerical values of the parameter which fall within a predetermined range and are sequentially stacked, wherein the parameter is selected from a group of power consumption, operating voltage, number of operating voltages, operating current, guaranteed operating temperature, amount of generated electromagnetic waves, operating frequency, number of connection terminals, connection terminal pitch, thickness, amount of signals transmitted to and from a base substrate on which the semiconductor integrated circuit devices are to be mounted, and amount of signals transmitted to and from an external environment.

Claim 21

A stacked type semiconductor device according to claim 16 , wherein each of the semiconductor integrated circuit devices further includes a substrate on which the semiconductor integrated circuit chip is mounted.

Claim 22

A stacked type semiconductor device according to claim 16 , wherein each of the semiconductor integrated circuit chips has the parameter.

Claim 23

A stacked type semiconductor device according to claim 16 , wherein sequentially stacked semiconductor integrated circuit devices other than said at least two of the semiconductor integrated circuit devices forming the group, form an additional group, and the semiconductor integrated circuit devices forming said additional group have numerical values of the parameter which fall within a range other than said predetermined range.

Claim 24

A stacked type semiconductor device according to claim 16 , wherein two of the semiconductor integrated circuit devices, between which a difference of the numerical values of the parameter is smallest, are included in the group.

Claim 25

A stacked type semiconductor device according to claim 16 , wherein each of the semiconductor integrated circuit devices includes a conductor that penetrates the semiconductor integrated circuit device, and the semiconductor integrated circuit devices are electrically connected by the conductors.

Claim 26

A stacked type semiconductor device formed of a plurality of semiconductor integrated circuit devices stacked, each including a semiconductor integrated circuit chip, wherein two of the semiconductor integrated circuit devices, between which a largest amount of signals is transmitted, are sequentially stacked.

Claim 27

A stacked type semiconductor device formed of a plurality of semiconductor integrated circuit devices stacked, each including a semiconductor integrated circuit chip, wherein two of the semiconductor integrated circuit devices, between which a largest amount of signals is transmitted, are sequentially stacked.

Claim 28

A stacked type semiconductor device comprising: a first semiconductor integrated circuit device including a semiconductor integrated circuit chip; a second semiconductor integrated circuit device including a semiconductor integrated circuit chip and spaced apart from the first semiconductor integrated circuit device in a first direction; and a plurality of semiconductor integrated circuit devices arranged in a plane perpendicular to the first direction and sandwiched by the first and second semiconductor integrated circuit devices, each of the semiconductor integrated circuit devices including a semiconductor integrated circuit chip.

Claim 29

A stacked type semiconductor device comprising: a first semiconductor integrated circuit device including a semiconductor integrated circuit chip; a second semiconductor integrated circuit device including a semiconductor integrated circuit chip and spaced apart from the first semiconductor integrated circuit device in a first direction; and a plurality of semiconductor integrated circuit devices arranged in a plane perpendicular to the first direction and sandwiched by the first and second semiconductor integrated circuit devices, each of the semiconductor integrated circuit devices including a semiconductor integrated circuit chip.

Claim 30

A stacked type semiconductor device formed of a plurality of semiconductor integrated circuit devices stacked, each having a parameter and including a semiconductor integrated circuit chip, wherein at least one of the semiconductor integrated circuit devices is stacked out of the order of a numerical value of the parameter, and at least two, but not all, of the semiconductor integrated circuit devices form a group, have numerical values of the parameter which fall within a predetermined range and are sequentially stacked, wherein the parameter is selected from a group of power consumption, operating voltage, number of operating voltages, operating current, guaranteed operating temperature, amount of generated electromagnetic waves, operating frequency, size, number of connection terminals, connection terminal pitch, thickness, amount of signals transmitted to and from a base substrate on which the semiconductor integrated circuit devices are to be mounted, and amount of signals transmitted to and from an external environment.

Claim 31

A stacked type semiconductor device formed of a plurality of semiconductor integrated circuit devices stacked, each having a parameter and including a semiconductor integrated circuit chip, wherein at least one of the semiconductor integrated circuit devices is stacked out of the order of a numerical value of the parameter, and at least two, but not all, of the semiconductor integrated circuit devices form a group, have numerical values of the parameter which fall within a predetermined range and are sequentially stacked, wherein the parameter is selected from a group of power consumption, operating voltage, number of operating voltages, operating current, guaranteed operating temperature, amount of generated electromagnetic waves, operating frequency, size, number of connection terminals, connection terminal pitch, thickness, amount of signals transmitted to and from a base substrate on which the semiconductor integrated circuit devices are to be mounted, and amount of signals transmitted to and from an external environment.

Claim 32

A stacked type semiconductor device comprising at least four semiconductor integrated circuit devices stacked, each having a parameter and including a semiconductor integrated circuit chip, wherein a numerical value of the parameter of a predetermined one, other than an uppermost one and a lowermost one, of the semiconductor integrated circuit devices is maximum, and at least three, including said predetermined one, of the semiconductor integrated circuit devices differ in a numerical value of the parameter and are stacked in the order of a numerical value of the parameter, wherein the parameter is selected from a group of power consumption, operating voltage, number of operating voltages, operating current, guaranteed operating temperature, amount of generated electromagnetic waves, operating frequency, size, number of connection terminals, connection terminal pitch, thickness, amount of signals transmitted to and from a base substrate on which the semiconductor integrated circuit devices are to be mounted, and amount of signals transmitted to and from an external environment.

Claim 33

A stacked type semiconductor device comprising at least four semiconductor integrated circuit devices stacked, each having a parameter and including a semiconductor integrated circuit chip, wherein a numerical value of the parameter of a predetermined one, other than an uppermost one and a lowermost one, of the semiconductor integrated circuit devices is maximum, and at least three, including said predetermined one, of the semiconductor integrated circuit devices differ in a numerical value of the parameter and are stacked in the order of a numerical value of the parameter, wherein the parameter is selected from a group of power consumption, operating voltage, number of operating voltages, operating current, guaranteed operating temperature, amount of generated electromagnetic waves, operating frequency, size, number of connection terminals, connection terminal pitch, thickness, amount of signals transmitted to and from a base substrate on which the semiconductor integrated circuit devices are to be mounted, and amount of signals transmitted to and from an external environment.

Claim 34

A stacked type semiconductor device comprising at least three semiconductor integrated circuit devices stacked, each having a parameter and including a semiconductor integrated circuit chip, wherein a numerical value of the parameter of a predetermined one, other than an uppermost one and a lowermost one, of the semiconductor integrated circuit devices is minimum, and at least two, including said predetermined one, of the semiconductor integrated circuit devices differ in a numerical value of the parameter and are stacked in the order of a numerical value of the parameter, wherein the parameter is selected from a group of power consumption, operating voltage, number of operating voltages, operating current, guaranteed operating temperature, amount of generated electromagnetic waves, operating frequency, size, number of connection terminals, connection terminal pitch, thickness, amount of signals transmitted to and from a base substrate on which the semiconductor integrated circuit devices are to be mounted, and amount of signals transmitted to and from an external environment.

Claim 35

A stacked type semiconductor device comprising at least three semiconductor integrated circuit devices stacked, each having a parameter and including a semiconductor integrated circuit chip, wherein a numerical value of the parameter of a predetermined one, other than an uppermost one and a lowermost one, of the semiconductor integrated circuit devices is minimum, and at least two, including said predetermined one, of the semiconductor integrated circuit devices differ in a numerical value of the parameter and are stacked in the order of a numerical value of the parameter, wherein the parameter is selected from a group of power consumption, operating voltage, number of operating voltages, operating current, guaranteed operating temperature, amount of generated electromagnetic waves, operating frequency, size, number of connection terminals, connection terminal pitch, thickness, amount of signals transmitted to and from a base substrate on which the semiconductor integrated circuit devices are to be mounted, and amount of signals transmitted to and from an external environment.