US6087719A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Chip for multi-chip semiconductor device and method of manufacturing the same
Assignee: Kioxia Corp
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Filing: 1998-04-23
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Granted: 2000-07-11
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Expires: 2018-04-23
Abstract
Abstract A plurality of chips each having two or more alignment holes for transmitting a laser beam are stacked. The laser beam is irradiated onto the uppermost or lowermost one of the stacked chips. A photodetector detects the laser beam output from the stacked chips through the alignment holes in these chips. The positions of the chips are so controlled that the amount of the light detected by this photodetector is a maximum.
Inventors
- 👤 Yoshitaka Tsunashima
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 10:42
CPC Classifications
H; H10; H10W; H10W90/00; H10W20/00; H10W20/01; H10W20/021; H10W20/023; H10W20/0245; H10W20/20; H10W44/00; H10W44/601; H10W46/00; H10W72/00; H10W72/01; H10W72/0198; H10W72/071; H10W72/072; H10W72/07221; H10W72/07223; H10W72/07251; H10W72/20; H10W72/90; H10W72/921; H10W72/923; H10W72/951; H10W72/952; H10W90/20; H10W90/22; H10W90/288; H10W90/297; H10W90/701; H10W90/721; H10W90/722
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
60 words
A chip applied to a multi-chip semiconductor device, comprising: a semiconductor substrate on which at least one element is formed; a connecting portion formed to extend through the semiconductor substrate and electrically connected to an adjacent chip via the conducting portions arranged on both surfaces of the semiconductor substrate; and two or more light-transmitting portions formed in the semiconductor substrate.
Claim 2
Dependent Claim
60 words
A chip applied to a multi-chip semiconductor device, comprising: a semiconductor substrate on which at least one element is formed; a connecting portion formed to extend through the semiconductor substrate and electrically connected to an adjacent chip via the conducting portions arranged on both surfaces of the semiconductor substrate; and two or more light-transmitting portions formed in the semiconductor substrate.
Claim 3
Dependent Claim
18 words
A chip according to claim 1, wherein the light-transmitting portions are through holes extending through the semiconductor substrate.
Claim 4
Dependent Claim
17 words
A chip according to claim 2, wherein an optical transparent material is buried in the through holes.
Claim 5
Dependent Claim
78 words
A multi-chip semiconductor device comprising: a plurality of stacked chips; and a plurality of conducting portions each formed between the chips, wherein each of the chips comprises: a semiconductor substrate on which at least one element is formed; a connecting portion formed to extend through the semiconductor substrate and electrically connected to an adjacent chip via the conducting portions arranged on both surfaces of the semiconductor substrate; and two or more light-transmitting portions formed in the semiconductor substrate.
Claim 6
Dependent Claim
78 words
A multi-chip semiconductor device comprising: a plurality of stacked chips; and a plurality of conducting portions each formed between the chips, wherein each of the chips comprises: a semiconductor substrate on which at least one element is formed; a connecting portion formed to extend through the semiconductor substrate and electrically connected to an adjacent chip via the conducting portions arranged on both surfaces of the semiconductor substrate; and two or more light-transmitting portions formed in the semiconductor substrate.
Claim 7
Dependent Claim
18 words
A device according to claim 4, wherein the light-transmitting portions are through holes extending through the semiconductor substrate.
Claim 8
Dependent Claim
17 words
A device according to claim 5, wherein an optical transparent material is buried in the through holes.
References Cited (Backward Citations)
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US4807021A
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US5270261A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-07-11 | 2004-01-10 | 2004-07-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-07-11 | 2008-01-10 | 2008-07-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-07-11 | 2012-01-10 | 2012-07-11 | $7700.00 | Window Closed / Lapsed |