Semiconductor chip high density packaging

Claim 2

A package for semiconductor devices comprising: a rack, consisting of a support having first and second major surfaces and having a plurality of parallel, juxtaposed, cantilevered plates on said first major surface; said support having a plurality of wiring elements on said second major surface thereof; a semiconductor chip having a fixed thickness between two of said plates; the spacing between said two of said plates being greater than the thickness of the chip therebetween; and conductive means coupling said semiconductor chip to selected ones of said wiring elements.

Claim 3

The package of claim 1 wherein there is further provided a base upon which the rack is mounted and a enclosure encompassing the rack and hermetically sealed to the base.

Claim 4

The package of claim 2 wherein said rack has a lower extension passing through and hermetically sealed to the base, said wiring elements on said back extending across said lower extension and having terminals thereon.

Claim 5

A package for semiconductor devices comprising: a base having first and second major surfaces and having an aperture therein; a semiconductor chip supporting rack, having a back with first and second, parallel, major surfaces, mounted on said base, a major portion of said back of said rack extending from said first major surface of said base and a minor portion of the back of said rack extending through the aperture on the base and beyond said second major surface of said base; the first major surface of the back of said rack being provided with a plurality of spaced, canterlevered, conterminate shelves, the second major surface of the back of said rack having a plurality of wiring elements on both said major and minor portions of said second major surface; means for hermetically sealing said printed circuit board in said aperture in said base; conductive means coupling a semiconductor chip supported between said conterminate shelves to selected ones of said wiring elements, disposed on said second major surface of said back of said rack; said semiconductor chip having a fixed height; the spacing between said shelves being greater than the height of the chip therebetween; enclosure means hermetically sealed to said base and surrounding the major portion of said printed circuit board, said semiconductor chip and said sleeve thereon; and a cooling fluid in said enclosure.

Claim 6

A package for semiconductor devices comprising: a base having first and second major surfaces and having an aperture therein; a semiconductor chip supporting rack, having a back with first and second, parallel, major surfaces, mounted on said base, a major portion of said back of said rack extending from said first major surface of said base and a minor portion of the back of said rack extending through the aperture on the base and beyond said second major surface of said base; the first major surface of the back of said rack being provided with a plurality of spaced, canterlevered, conterminate shelves, the second major surface of the back of said rack having a plurality of wiring elements on both said major and minor portions of said second major surface; means for hermetically sealing said printed circuit board in said aperture in said base; conductive means coupling a semiconductor chip supported between said conterminate shelves to selected ones of said wiring elements, disposed on said second major surface of said back of said rack; said semiconductor chip having a fixed height; the spacing between said shelves being greater than the height of the chip therebetween; enclosure means hermetically sealed to said base and surrounding the major portion of said printed circuit board, said semiconductor chip and said sleeve thereon; and a cooling fluid in said enclosure.

Claim 7

A package for semiconductor devices comprising: a base having first and second major surfaces; a printed circuit board, having first and second, parallel, major surfaces affixed to said base; said printed circuit board having a plurality of wiring elements on said major and minor portions of said major surfaces; conductive means coupling a plurality of semiconductor chips, each having a fixed height, to selected ones of said wiring elements, disposed on said major portion of said printed circuit board; an insulating rack having spaced shelves substantially surrounding and mechanically protecting and restricting the movement of a semiconductor chip therebetween; and the spacing between the shelves of said rack being greater than the height of the chip therebetween; a cooling fluid in said enclosure.

Claim 8

A package for semiconductor devices comprising: a base having first and second major surfaces; a printed circuit board, having first and second, parallel, major surfaces affixed to said base; said printed circuit board having a plurality of wiring elements on said major and minor portions of said major surfaces; conductive means coupling a plurality of semiconductor chips, each having a fixed height, to selected ones of said wiring elements, disposed on said major portion of said printed circuit board; an insulating rack having spaced shelves substantially surrounding and mechanically protecting and restricting the movement of a semiconductor chip therebetween; and the spacing between the shelves of said rack being greater than the height of the chip therebetween; a cooling fluid in said enclosure.

Claim 9

The package of claim 5 wherein: said base has an aperture therein; and said printed circuit board, passes through said aperture in said base, a major portion of said printed circuit board extending from said first major surface of said base and a minor portion of said printed circuit board extending beyond said second major surface of said base.

Claim 10

The package of claim 6 wherein: a major portion of said printed circuit board extends from said first major surface of said base and a minor portion of said printed circuit board extends beyond said second major surface of said base.

Claim 11

The package of claim 7 wherein there is further provided: means for hermetically sealing said printed circuit board in said aperture in said base; and enclosure means hermetically sealed to said base and surrounding the major portion of said printed circuit board, said semiconductor chip and said rack thereon.

Claim 12

The package of claim 8 wherein there is further provided a cooling fluid in said enclosure.

Claim 13

A package for semiconductor devices comprising: an epoxy base having first and second major surfaces and having an a rectangular aperture therein; a printed circuit board, having first and second parallel, major surfaces, passing through and hermetically sealed in said aperture, a major portion of said printed circuit board extending from said first major surface of said base and a minor portion of said printed circuit board extending beyond said second major surface of said base; said printed circuit board having a plurality of wiring elements on said major and minor portions of said major surface; lead frames fingers connecting respective semiconductor chips, having a known height, to selected ones of said wiring elements disposed on said major portion of said printed circuit board; an insulating rack having a plurality of shelves, each of said shelves being interleaved between adjacent ones of said semiconductor chips and mechanically protecting and restricting the movement of said semiconductor chips therebetween: the spacing between any adjacent shelves of said rack being greater than the height of the chip therebetween; an aluminum enclosure hermetically sealed to said base and surrounding the major portion of said printed circuit board, said semiconductor chip and said sleeve thereon; and a cooling fluid within said enclosure.

Claim 14

A package for semiconductor devices comprising: an epoxy base having first and second major surfaces and having an a rectangular aperture therein; a printed circuit board, having first and second parallel, major surfaces, passing through and hermetically sealed in said aperture, a major portion of said printed circuit board extending from said first major surface of said base and a minor portion of said printed circuit board extending beyond said second major surface of said base; said printed circuit board having a plurality of wiring elements on said major and minor portions of said major surface; lead frames fingers connecting respective semiconductor chips, having a known height, to selected ones of said wiring elements disposed on said major portion of said printed circuit board; an insulating rack having a plurality of shelves, each of said shelves being interleaved between adjacent ones of said semiconductor chips and mechanically protecting and restricting the movement of said semiconductor chips therebetween: the spacing between any adjacent shelves of said rack being greater than the height of the chip therebetween; an aluminum enclosure hermetically sealed to said base and surrounding the major portion of said printed circuit board, said semiconductor chip and said sleeve thereon; and a cooling fluid within said enclosure.