US5327327A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Three dimensional assembly of integrated circuit chips
Assignee: Texas Instruments Inc
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Filing: 1992-10-30
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Granted: 1994-07-05
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Expires: 2012-10-30
Abstract
Abstract The multi-chip circuit module of the invention comprises a plurality of circuit chips assembled in a laminated stack. Each chip includes a plurality of layers of thin film interconnect patterns in the normal configuration, except for the final layer or layers, which comprise a reroute pattern that locates all circuit input and output pads along a single edge of each chip. The relocated pads are provided with contact bumps to facilitate the addition of a bonded lead to each I/O pad extending therefrom to a point beyond the edge of each chip. Thus, upon lamination the protruding tips form an array of leads on a single lateral face of the laminated chip stack.
Inventors
- 👤 Dean L. Frew
- 👤 Mark A. Kressley
- 👤 Arthur M. Wilson
- 👤 Juanita G. Miller
- 👤 Philip E. Hecker, Jr.
- 👤 James Drumm
- 👤 Randall E. Johnson
- 👤 Rick Elder
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 00:15
CPC Classifications
H; H10; H10W; H10W90/00; H10W72/00; H10W72/01; H10W72/60; H10W72/834; H10W90/20
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
92 words
A multi-chip circuit module comprising a plurality of circuit chips assembled in a laminated stack, each of said chips having a plurality of layers of thin-film interconnect patterns thereon, a final layer of which comprises a reroute pattern that locates all circuit input and output pads along a single edge of each chip, and further including a bonded lead extending from each rerouted I/O pad to a point beyond said single edge of each chip, whereby an array of protruding lead tips extends from a single lateral face of said laminated stack.
Claim 2
Dependent Claim
92 words
A multi-chip circuit module comprising a plurality of circuit chips assembled in a laminated stack, each of said chips having a plurality of layers of thin-film interconnect patterns thereon, a final layer of which comprises a reroute pattern that locates all circuit input and output pads along a single edge of each chip, and further including a bonded lead extending from each rerouted I/O pad to a point beyond said single edge of each chip, whereby an array of protruding lead tips extends from a single lateral face of said laminated stack.
Claim 3
Dependent Claim
56 words
The multichip circuit module as in claim 1, further including a second set of relocated input and output pads along the opposite edge of said chip, and further including a first set of bonded leads extending from said second set of pads, whereby testing of electrical connections to the first set of bonded leads is facilitated.
Claim 4
Dependent Claim
23 words
The multichip circuit module as in claim 1, wherein said reroute patent comprises a film having two sublayers of titanium-tungsten separated by aluminum.
Claim 5
Dependent Claim
24 words
The multichip circuit module as in claim 1, wherein said bonded leads comprises gold-plated copper, attached to tin-plated gold bumps on each pad, respectively.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-07-04 | 1998-01-03 | 1998-07-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-07-04 | 2002-01-03 | 2002-07-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-07-04 | 2006-01-03 | 2006-07-05 | $7700.00 | Window Closed / Lapsed |