US6667439B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit package including opening exposing portion of an IC
Assignee: Apple Inc
•
Filing: 2001-08-16
•
Granted: 2003-12-23
•
Expires: 2021-08-16
Abstract
Abstract An IC package preferably includes an IC and encapsulating material surrounding the IC, with the encapsulating material having an opening therein to define an exposed portion of the IC. Vestigial portions of encapsulating material may be left on the exposed portion of the IC and spaced inwardly from a periphery of the opening based upon molding using a mold protrusion which includes a bleed-through retention channel positioned inwardly from peripheral edges. The channel collects and retains any bleed-through of the encapsulating material. The IC package may further include a leadframe carrying the IC. The leadframe may include a die pad, finger portions, and a plurality of die pad support bars. The die pad may be downset below a level of the finger portions. Each of the die pad support bars may be resiliently deformed to accommodate the downset of the die pad. Low stress encapsulating material and adhesive may also be included in the IC package.
Inventors
- 👤 Matthew M. Salatino
- 👤 Patrick O. Weber
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 11:13
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; G; G06; G06V; G06V40/00; G06V40/10; G06V40/12; G06V40/13; G06V40/1306; H10W74/01; H10W74/016; H10W72/00; H10W72/50; H10W72/531; H10W72/5366; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 63
Claim 1
Independent Claim
57 words
An integrated circuit package comprising: an integrated circuit (IC) and encapsulating material surrounding said IC, said encapsulating material having an opening therein to define an exposed portion of said IC; and vestigial portions of said encapsulating material on the exposed portion of said IC an spaced inwardly from a periphery of the opening in maid ecapsulating material.
Claim 2
Dependent Claim
57 words
An integrated circuit package comprising: an integrated circuit (IC) and encapsulating material surrounding said IC, said encapsulating material having an opening therein to define an exposed portion of said IC; and vestigial portions of said encapsulating material on the exposed portion of said IC an spaced inwardly from a periphery of the opening in maid ecapsulating material.
Claim 3
Dependent Claim
48 words
An integrated circuit package according to claim 1 wherein the opening in said encapsulating material is generally rectangular; and wherein said vestigial portions of encapsulating material are arranged along at least one side of an imaginary rectangle spaced inwardly from the generally rectangular opening in said encapsulating material.
Claim 4
Dependent Claim
23 words
An integrated circuit package according to claim 1 wherein said vestigial portions are spaced inwardly a distance of from 0.1 to 3 mm.
Claim 5
Dependent Claim
15 words
An integrated circuit package according to claim 1 further comprising a leadframe carrying said IC.
Claim 6
Dependent Claim
34 words
An integrated circuit package according to claim 4 wherein said leadframe comprises a die pad, finger portions, and a plurality of die pad support bars extending between said die pad and said finger portions.
Claim 7
Dependent Claim
21 words
An integrated circuit package according to claim 5 wherein said die pad is downset below a level of said finger portions.
Claim 8
Dependent Claim
27 words
An integrated circuit package according to claim 6 wherein each of said die pad support bars is resiliently deformed to accommodate the downset of said die pad.
Claim 9
Dependent Claim
38 words
An integrated circuit package according to claim 6 further comprising bond wires extending between said IC and the finger portion having a desired clearance from adjacent portions of said IC and an upper surface of said encapsulating material.
Claim 10
Dependent Claim
16 words
An integrated circuit package according to claim 5 wherein said die pad has an opening therein.
Claim 11
Dependent Claim
23 words
An integrated circuit package according to claim 5 further comprising a low stress, low modulus adhesive securing said IC to said die pad.
Claim 12
Dependent Claim
23 words
An integrated circuit package according to claim 1 further comprising a substrate adjacent a back surface of said IC opposite the exposed portion.
Claim 13
Dependent Claim
30 words
An integrated circuit package according to claim 1 wherein said substrate covers the back surface of said IC so that said encapsulating material does not extend onto the back surface.
Claim 14
Dependent Claim
18 words
An integrated circuit package according to claim 1 wherein said encapsulating material comprises a low stress encapsulating material.
Claim 15
Dependent Claim
33 words
An integrated circuit package according to claim 1 wherein said IC comprises upper surface portions with active devices formed therein; and wherein the exposed portion of said IC comprises upper surface portions thereof.
Claim 16
Dependent Claim
15 words
An integrated circuit package according to claim 14 wherein the active devices define a sensor.
Claim 17
Dependent Claim
18 words
An integrated circuit package according to claim 14 wherein the active devices define an electric field fingerprint sensor.
Claim 18
Dependent Claim
88 words
An integrated circuit package comprising: an integrated circuit (IC) comprising upper surface portions with active devices formed therein and encapsulating material surrounding said IC; said encapsulating material having an opening therein adjacent the upper surface portions of said IC to define an exposed portion of said IC; and a leadframe comprising a die pad carrying said IC, finger portions, and a plurality of die pad support bars extending between said die pad and said finger portions; said die pad being downset below a level of said finger portions.
Claim 19
Dependent Claim
88 words
An integrated circuit package comprising: an integrated circuit (IC) comprising upper surface portions with active devices formed therein and encapsulating material surrounding said IC; said encapsulating material having an opening therein adjacent the upper surface portions of said IC to define an exposed portion of said IC; and a leadframe comprising a die pad carrying said IC, finger portions, and a plurality of die pad support bars extending between said die pad and said finger portions; said die pad being downset below a level of said finger portions.
Claim 20
Dependent Claim
27 words
An integrated circuit package according to claim 17 wherein each of said die pad support bars is resiliently deformed to accommodate the downset of said die pad.
Claim 21
Dependent Claim
38 words
An integrated circuit package according to claim 18 further comprising bond wires extending between said IC and the finger portion having a desired clearance from adjacent portions of said IC and an upper surface of said encapsulating material.
Claim 22
Dependent Claim
16 words
An integrated circuit package according to claim 17 wherein said die pad has an opening therein.
Claim 23
Dependent Claim
23 words
An integrated circuit package according to claim 20 further comprising a low stress, low modulus adhesive securing said IC to said die pad.
Claim 24
Dependent Claim
18 words
An integrated circuit package according to claim 17 wherein said encapsulating material comprises a low stress encapsulating material.
Claim 25
Dependent Claim
35 words
An integrated circuit package according to claim 17 further comprising vestigial portions of encapsulating material on the exposed portion of said IC and spaced inwardly from a periphery of the opening in said encapsulating material.
Claim 26
Dependent Claim
43 words
An integrated circuit package according to claim 23 wherein the opening in said encapsulating material is generally rectangular; and wherein said vestigial portions of encapsulating material are arranged along an imaginary rectangle spaced inwardly from the generally rectangular opening in said encapsulating material.
Claim 27
Dependent Claim
23 words
An integrated circuit package according to claim 23 wherein said vestigial portions are spaced inwardly a distance of from 0.1 to 3 mm.
Claim 28
Dependent Claim
15 words
An integrated circuit package according to claim 17 wherein the active devices define a sensor.
Claim 29
Dependent Claim
18 words
An integrated circuit package according to claim 17 wherein the active devices define an electric field fingerprint sensor.
Claim 30
Dependent Claim
86 words
An integrated circuit package comprising: an integrated circuit (IC) comprising upper surface portions with active devices formed therein and encapsulating material surrounding said IC; said encapsulating material having an opening therein adjacent the upper surface portions of said IC to define an exposed portion of said IC; and a leadframe comprising a die pad carrying said IC, finger portions, and a plurality of die pad support bars extending between said die pad and said finger portions, each of said die pad support bars being resiliently deformed.
Claim 31
Dependent Claim
86 words
An integrated circuit package comprising: an integrated circuit (IC) comprising upper surface portions with active devices formed therein and encapsulating material surrounding said IC; said encapsulating material having an opening therein adjacent the upper surface portions of said IC to define an exposed portion of said IC; and a leadframe comprising a die pad carrying said IC, finger portions, and a plurality of die pad support bars extending between said die pad and said finger portions, each of said die pad support bars being resiliently deformed.
Claim 32
Dependent Claim
21 words
An integrated circuit package according to claim 28 wherein said die pad is downset below a level of said finger portions.
Claim 33
Dependent Claim
38 words
An integrated circuit package according to claim 29 further comprising bond wires extending between said IC and the finger portion having a desired clearance from adjacent portions of said IC and an upper surface of said encapsulating material.
Claim 34
Dependent Claim
16 words
An integrated circuit package according to claim 28 wherein said die pad has an opening therein.
Claim 35
Dependent Claim
23 words
An integrated circuit package according to claim 31 further comprising a low stress, low modulus adhesive securing said IC to said die pad.
Claim 36
Dependent Claim
18 words
An integrated circuit package according to claim 28 wherein said encapsulating material comprises a low stress encapsulating material.
Claim 37
Dependent Claim
35 words
An integrated circuit package according to claim 28 further comprising vestigial portions of encapsulating material on the exposed portion of said IC and spaced inwardly from a periphery of the opening in said encapsulating material.
Claim 38
Dependent Claim
43 words
An integrated circuit package according to claim 34 wherein the opening in said encapsulating material is generally rectangular; and wherein said vestigial portions of encapsulating material are arranged along an imaginary rectangle spaced inwardly from the generally rectangular opening in said encapsulating material.
Claim 39
Dependent Claim
23 words
An integrated circuit package according to claim 34 wherein said vestigial portions are spaced inwardly a distance of from 0.1 to 3 mm.
Claim 40
Dependent Claim
15 words
An integrated circuit package according to claim 28 wherein the active devices define a sensor.
Claim 41
Dependent Claim
18 words
An integrated circuit package according to claim 28 wherein the active devices define an electric field fingerprint sensor.
Claim 42
Dependent Claim
61 words
An integrated circuit package comprising: an integrated circuit (IC) comprising upper surface portions with active devices formed therein and encapsulating material surrounding said IC; said encapsulating material having an opening therein adjacent the upper surface portions of said IC to define an exposed portion of said IC; and a die pad carrying said IC, said die pad having an opening therein.
Claim 43
Dependent Claim
61 words
An integrated circuit package comprising: an integrated circuit (IC) comprising upper surface portions with active devices formed therein and encapsulating material surrounding said IC; said encapsulating material having an opening therein adjacent the upper surface portions of said IC to define an exposed portion of said IC; and a die pad carrying said IC, said die pad having an opening therein.
Claim 44
Dependent Claim
43 words
An integrated circuit package according to claim 39 further comprising finger portions, and a plurality of die pad support bars extending between said die pad and said finger portions, and wherein said die pad is downset below a level of said finger portions.
Claim 45
Dependent Claim
27 words
An integrated circuit package according to claim 40 wherein each of said die pad support bars is resilient deformed to accommodate the downset of said die pad.
Claim 46
Dependent Claim
38 words
An integrated circuit package according to claim 40 further comprising bond wires extending between said IC and the finger portion having a desired clearance from adjacent portions of said IC and an upper surface of said encapsulating material.
Claim 47
Dependent Claim
23 words
An integrated circuit package according to claim 39 further comprising a low stress, low modulus adhesive securing said IC to said die pad.
Claim 48
Dependent Claim
18 words
An integrated circuit package according to claim 39 wherein said encapsulating material comprises a low stress encapsulating material.
Claim 49
Dependent Claim
35 words
An integrated circuit package according to claim 39 further comprising vestigial portions of encapsulating material on the exposed portion of said IC and spaced inwardly from a periphery of the opening in said encapsulating material.
Claim 50
Dependent Claim
43 words
An integrated circuit package according to claim 45 wherein the opening in said encapsulating material is generally rectangular; and wherein said vestigial portions of encapsulating material are arranged along an imaginary rectangle spaced inwardly from the generally rectangular opening in said encapsulating material.
Claim 51
Dependent Claim
23 words
An integrated circuit package according to claim 45 wherein said vestigial portions are spaced inwardly a distance of from 0.1 to 3 mm.
Claim 52
Dependent Claim
15 words
An integrated circuit package according to claim 39 wherein the active devices define a sensor.
Claim 53
Dependent Claim
18 words
An integrated circuit package according to claim 39 wherein the active devices define an electric field fingerprint sensor.
Claim 54
Dependent Claim
59 words
An integrated circuit package comprising: an integrated circuit (IC) and encapsulating material surrounding said IC; said encapsulating material having an opening therein to define an exposed portion of said IC; and a substrate covering a back surface of said IC opposite the exposed portion so that said encapsulating material does not extend onto the back surface of said IC.
Claim 55
Dependent Claim
59 words
An integrated circuit package comprising: an integrated circuit (IC) and encapsulating material surrounding said IC; said encapsulating material having an opening therein to define an exposed portion of said IC; and a substrate covering a back surface of said IC opposite the exposed portion so that said encapsulating material does not extend onto the back surface of said IC.
Claim 56
Dependent Claim
16 words
An integrated circuit package according to claim 50 wherein said substrate comprises a printed circuit board.
Claim 57
Dependent Claim
34 words
An integrated circuit package according to claim 50 further vestigial portions of encapsulating material on the exposed portion of said IC and spaced inwardly from a periphery of the opening in said encapsulating material.
Claim 58
Dependent Claim
48 words
An integrated circuit package according to claim 52 wherein the opening in said encapsulating material is generally rectangular; and wherein said vestigial portions of encapsulating material are arranged along at least one side of an imaginary rectangle spaced inwardly from the generally rectangular opening in said encapsulating material.
Claim 59
Dependent Claim
23 words
An integrated circuit package according to claim 52 wherein said vestigial portions are spaced inwardly a distance of from 0.1 to 3 mm.
Claim 60
Dependent Claim
18 words
An integrated circuit package according to claim 52 wherein said encapsulating material comprises a low stress encapsulating material.
Claim 61
Dependent Claim
33 words
An integrated circuit package according to claim 52 wherein said IC comprises upper surface portions with active devices formed therein; and wherein the exposed portion of said IC comprises upper surface portions thereof.
Claim 62
Dependent Claim
15 words
An integrated circuit package according to claim 56 wherein the active devices define a sensor.
Claim 63
Dependent Claim
18 words
An integrated circuit package according to claim 57 wherein the active devices define an electric field fingerprint sensor.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-12-22 | 2007-06-23 | 2007-12-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-12-22 | 2011-06-23 | 2011-12-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-12-22 | 2015-06-23 | 2015-12-23 | $7700.00 | Window Closed / Lapsed |