US5862248A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit device having an opening exposing the integrated circuit die and related methods
Assignee: Apple Inc
•
Filing: 1996-06-27
•
Granted: 1999-01-19
•
Expires: 2016-06-27
Abstract
Abstract An integrated circuit device, such as a fingerprint sensing device, includes an integrated circuit die, a body of encapsulating material surrounding the integrated circuit die and having an opening therein exposing a portion of the integrated circuit die, and an electrically conductive member or frame being mounted to the body of encapsulating material adjacent the opening therein. The electrically conductive member may preferably be positioned so as to define at least a portion of a frame for the opening in the body of encapsulating material. The electrically conductive member may be adhesively secured to the integrated circuit die. Accordingly, the adhesive and electrically conductive member may serve as a seal to the interface between the body of encapsulating material and the die. The electrically conductive member may define a frame that surrounds a body of removable material during an intermediate stage in manufacturing. More particularly, the body of removable material and its frame may be positioned on the integrated circuit die while plastic is injection molded to encapsulate the asembly.
Inventors
- 👤 Matthew M. Salatino
- 👤 S. James Studebaker
- 👤 Nicolaas W. VanVonno
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 21:14
CPC Classifications
G; G06; G06F; G06F3/00; G06F3/01; G06F3/03; G06F3/041; G06F3/044; G06F21/00; G06F21/70; G06F21/86; G06F3/0445; G06V; G06V40/00; G06V40/10; G06V40/12; G06V40/13; G06V40/1306; G06V40/60; G06V40/67; G07; G07C; G07C9/00; G07C9/00174; G07C9/00563; G07C9/20; G07C9/22; G07C9/25; G07C9/26; G07C9/30; G07C9/32; G07C9/37; H; H10; H10W; H10W74/00; H10W74/10; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 42
Claim 1
Independent Claim
147 words
A fingerprint sensing device comprising: an integrated circuit die comprising a first fingerprint sensing portion for direct contact by a finger of a user, and a second surface portion opposite the first fingerprint sensing portion; an integrally molded body of encapsulating material surrounding said integrated circuit die including the second surface portion thereof, said body of encapsulating material having an opening therein exposing the first fingerprint sensing portion of said integrated circuit die to adjacent a periphery of the first fingerprint sensing portion to permit direct contact by the finger of the user with the first fingerprint sensing portion; and an electrically conductive member being mounted to said body of encapsulating material adjacent the opening therein and adjacent the first fingerprint sensing portion so that the finger of the user directly contacts the electrically conductive member as the finger is positioned onto the first fingerprint sensing portion.
Claim 2
Dependent Claim
147 words
A fingerprint sensing device comprising: an integrated circuit die comprising a first fingerprint sensing portion for direct contact by a finger of a user, and a second surface portion opposite the first fingerprint sensing portion; an integrally molded body of encapsulating material surrounding said integrated circuit die including the second surface portion thereof, said body of encapsulating material having an opening therein exposing the first fingerprint sensing portion of said integrated circuit die to adjacent a periphery of the first fingerprint sensing portion to permit direct contact by the finger of the user with the first fingerprint sensing portion; and an electrically conductive member being mounted to said body of encapsulating material adjacent the opening therein and adjacent the first fingerprint sensing portion so that the finger of the user directly contacts the electrically conductive member as the finger is positioned onto the first fingerprint sensing portion.
Claim 3
Dependent Claim
35 words
A fingerprint sensing device according to claim 1 wherein said electrically conductive member is positioned so as to define at least a portion of a frame for the opening in said body of encapsulating material.
Claim 4
Dependent Claim
18 words
A fingerprint sensing device according to claim 1 wherein said electrically conductive member has a closed geometric shape.
Claim 5
Dependent Claim
18 words
A fingerprint sensing device according to claim 1 wherein said electrically conductive member has a generally rectangular shape.
Claim 6
Dependent Claim
24 words
A fingerprint sensing device according to claim 1 further comprising interconnection means for electrically connecting said electrically conductive member to said integrated circuit die.
Claim 7
Dependent Claim
46 words
A fingerprint sensing device according to claim 5 wherein said interconnection means comprises: an electrically conductive adhesive between said electrically conductive member and said integrated circuit die; at least one via in said integrated circuit die; and electrically conductive material in said at least one via.
Claim 8
Dependent Claim
20 words
A fingerprint sensing device according to claim 1 wherein said first fingerprint sensing portion comprises an electric field fingerprint sensor.
Claim 9
Dependent Claim
74 words
A fingerprint sensing device according to claim 7 wherein said electric field fingerprint sensor comprises: an array of electric field sensing electrodes; a dielectric layer adjacent said electric field sensing electrodes, said dielectric layer for receiving a finger adjacent thereto; and drive means for applying an electric field drive signal to said electric field sensing electrodes and adjacent portions of the finger so that said electric field sensing electrodes produce a fingerprint image signal.
Claim 10
Dependent Claim
25 words
A fingerprint sensing device according to claim 1 further comprising voltage clamping means operatively connected to said electrically conductive member for clamping a voltage thereof.
Claim 11
Dependent Claim
32 words
A fingerprint sensing device according to claim 1 further comprising electrostatic discharge means for reducing an electrostatic charge of a user as the finger of the user touches said electrically conductive member.
Claim 12
Dependent Claim
33 words
A fingerprint sensing device according to claim 1 wherein said integrated circuit die further comprises a plurality of bond pads, and wherein said body of encapsulating material covers said plurality of bond pads.
Claim 13
Dependent Claim
23 words
A fingerprint sensing device according to claim 11 further comprising bond pad sealing means for protecting said plurality of bond pads from corrosion.
Claim 14
Dependent Claim
36 words
A fingerprint sensing device according to claim 12 wherein each of said bond pads comprises a first metal layer, and wherein said bond pad sealing means comprises a barrier metal layer on said first metal layer.
Claim 15
Dependent Claim
25 words
A fingerprint sensing device according to claim 13 wherein said bond pad sealing means further comprises a layer of gold on said barrier metal layer.
Claim 16
Dependent Claim
42 words
A fingerprint sensing device according to claim 1 wherein said integrated circuit die comprises: a relatively rigid substrate; and a plurality of metal layers on said substrate and being relatively thin and relatively rigid to provide strength to said integrated circuit die.
Claim 17
Dependent Claim
20 words
A fingerprint sensing device according to claim 15 wherein each of said plurality of metal layers comprises a refractory metal.
Claim 18
Dependent Claim
20 words
A fingerprint sensing device according to claim 15 wherein each of said plurality of metal layers is devoid of aluminum.
Claim 19
Dependent Claim
19 words
A fingerprint sensing device according to claim 1 further comprising a lead frame connected to said integrated circuit die.
Claim 20
Dependent Claim
15 words
A fingerprint sensing device according to claim 1 wherein said electrically conductive member comprises metal.
Claim 21
Dependent Claim
18 words
A fingerprint sensing device according to claim 1 wherein said integrated circuit die comprises an outermost passivating layer.
Claim 22
Dependent Claim
23 words
A fingerprint sensing device according to claim 20 wherein said outermost passivating layer comprises at least one of a nitride, carbide, and diamond.
Claim 23
Dependent Claim
23 words
A fingerprint sensing device according to claim 1 further comprising an adhesive layer between said integrated circuit die and said electrically conductive member.
Claim 24
Dependent Claim
16 words
A fingerprint sensing device according to claim 1 wherein said body of encapsulating material comprises plastic.
Claim 25
Dependent Claim
18 words
A fingerprint sensing device according to claim 1 wherein said body of encapsulating material comprises injection molded plastic.
Claim 26
Dependent Claim
33 words
A fingerprint sensing device according to claim 1 further comprising locking means defined at an interface between said electrically conductive member and said body of encapsulating material for forming a mechanical lock therebetween.
Claim 27
Dependent Claim
21 words
A fingerprint sensing device according to claim 1 further comprising corrosion sensing means for sensing corrosion of said integrated circuit die.
Claim 28
Dependent Claim
152 words
A fingerprint sensing device comprising: an integrated circuit die comprising a first fingerprint sensing portion for direct contact by a finger of a user, and a second surface portion opposite the first fingerprint sensing portion; an integrally molded body of encapsulating material surrounding said integrated circuit die including the second surface portion thereof, said body of encapsulating material having an opening therein exposing the first fingerprint sensing portion of said integrated circuit die to adjacent a periphery of the first fingerprint sensing portion to permit direct contact by the finger of the user with the first fingerprint sensing portion; and an electrically conductive member being mounted to said body of encapsulating material adjacent the opening therein to define at least a portion of a frame for the opening so that the finger of the user directly contacts the electrically conductive member as the finger is positioned onto the first fingerprint sensing portion.
Claim 29
Dependent Claim
152 words
A fingerprint sensing device comprising: an integrated circuit die comprising a first fingerprint sensing portion for direct contact by a finger of a user, and a second surface portion opposite the first fingerprint sensing portion; an integrally molded body of encapsulating material surrounding said integrated circuit die including the second surface portion thereof, said body of encapsulating material having an opening therein exposing the first fingerprint sensing portion of said integrated circuit die to adjacent a periphery of the first fingerprint sensing portion to permit direct contact by the finger of the user with the first fingerprint sensing portion; and an electrically conductive member being mounted to said body of encapsulating material adjacent the opening therein to define at least a portion of a frame for the opening so that the finger of the user directly contacts the electrically conductive member as the finger is positioned onto the first fingerprint sensing portion.
Claim 30
Dependent Claim
18 words
A fingerprint sensing device according to claim 27 wherein said electrically conductive member has a closed geometric shape.
Claim 31
Dependent Claim
24 words
A fingerprint sensing device according to claim 27 further comprising interconnection means for electrically connecting said electrically conductive member to said integrated circuit die.
Claim 32
Dependent Claim
25 words
A fingerprint sensing device according to claim 27 further comprising voltage clamping means operatively connected to said electrically conductive member for clamping a voltage thereof.
Claim 33
Dependent Claim
36 words
A fingerprint sensing device according to claim 27 wherein said integrated circuit die further comprises a plurality of bond pads, and further comprising bond pad sealing means for protecting said plurality of bond pads from corrosion.
Claim 34
Dependent Claim
42 words
A fingerprint sensing device according to claim 27 wherein said integrated circuit die comprises: a relatively rigid substrate; and a plurality of metal layers on said substrate and being relatively thin and relatively rigid to provide strength to said integrated circuit die.
Claim 35
Dependent Claim
23 words
A fingerprint sensing device according to claim 27 further comprising an adhesive layer between said integrated circuit die and said electrically conductive member.
Claim 36
Dependent Claim
32 words
A fingerprint sensing device according to claim 27 further comprising locking means defined at an interface between said electrically conductive member and body of encapsulating material for forming a mechanical lock therebetween.
Claim 37
Dependent Claim
146 words
A fingerprint sensing device comprising: an integrated circuit die comprising a first fingerprint sensing portion for direct contact by a finger of a user, and a second surface portion opposite the first fingerprint sensing portion; an integrally molded body of encapsulating material surrounding said integrated circuit die including the second surface portion thereof, said body of encapsulating material having an opening therein exposing the first fingerprint sensing portion of said integrated circuit die to adjacent a periphery of the first fingerprint sensing portion to permit direct contact by the finger of the user with the first fingerprint sensing portion; an electrically conductive member mounted to said body of encapsulating material and adjacent the first fingerprint sensing portion so that the finger of the user directly contacts the electrically conductive member; and voltage clamping means operatively connected to said electrically conductive member for clamping a voltage thereof.
Claim 38
Dependent Claim
146 words
A fingerprint sensing device comprising: an integrated circuit die comprising a first fingerprint sensing portion for direct contact by a finger of a user, and a second surface portion opposite the first fingerprint sensing portion; an integrally molded body of encapsulating material surrounding said integrated circuit die including the second surface portion thereof, said body of encapsulating material having an opening therein exposing the first fingerprint sensing portion of said integrated circuit die to adjacent a periphery of the first fingerprint sensing portion to permit direct contact by the finger of the user with the first fingerprint sensing portion; an electrically conductive member mounted to said body of encapsulating material and adjacent the first fingerprint sensing portion so that the finger of the user directly contacts the electrically conductive member; and voltage clamping means operatively connected to said electrically conductive member for clamping a voltage thereof.
Claim 39
Dependent Claim
33 words
A fingerprint sensing device according to claim 35 wherein said voltage clamping means comprises electrostatic discharge means for reducing an electrostatic charge of a user upon the user touching said electrically conductive member.
Claim 40
Dependent Claim
35 words
A fingerprint sensing device according to claim 35 wherein said electrically conductive member is positioned so as to define at least a portion of a frame for the opening in said body of encapsulating material.
Claim 41
Dependent Claim
18 words
A fingerprint sensing device according to claim 35 wherein said electrically conductive member has a closed geometric shape.
Claim 42
Dependent Claim
23 words
A fingerprint sensing device according to claim 35 further comprising an adhesive layer between said integrated circuit die and said electrically conductive member.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-01-18 | 2002-07-20 | 2003-01-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-01-18 | 2006-07-20 | 2007-01-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-01-18 | 2010-07-20 | 2011-01-19 | $7700.00 | Window Closed / Lapsed |