Multilayer circuit ceramic board

Abstract

Abstract PURPOSE:To increase the density of viahole pitch and to decrease an electric resistance of a voltage supply layer by increasing the viahole pitch of a meshlike power source layer requiring a large current than that of a meshlike power source layer not requiring a large current. CONSTITUTION:A plurality of meshlike power source layers E1, E2, E3, D4, D5 are disposed in division of layers in a laminated ceramic board 1. The layers E1, E2, E3 are disposed on the rear face side of the board 1, and used as power source layers requiring a large current. On the other hand, the layers D4, D5 are disposed on the front face side of the board 1, and used as power source layers not requiring a large current. They are connected to signal interconnections S or the layers D4, D5 or E1, E2, E3 through viaholes 2S, 2D, 2E. Here, the viahole pitch PE of the layers E1, E2, E3 is increased twice as large as that PD of the layers D4, D5.

Inventors

• 👤 Toyoji Yasuda
• 👤 豊司 安田
• 👤 Taichi Kon
• 👤 昆　太一
• 👤 Yukiharu Ono
• 👤 大野　幸春

Bibliographic Details