US5644169A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Mold and method for manufacturing a package for a semiconductor chip and the package manufactured thereby
Assignee: SK Hynix Inc
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Filing: 1996-04-03
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Granted: 1997-07-01
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Expires: 2016-04-03
Abstract
Abstract A mold and a method for manufacturing a semiconductor package and the semiconductor package manufactured thereby. The semiconductor package includes a chip attached to a paddle of a lead frame. And with electrically connecting the chip and inner leads of lead frame with a metal wire, a semi-finished product having electric connections is molded by using molding dies having an extrusion in a cavity for providing an opening on an upper portion of a light receiving region of the chip, and a transparent lid is provided on the upper portion of the opening of the semiconductor package. With the invention being able to provide an excellent resin semiconductor package and improved manufacturing processes, thereby reducing the manufacturing cost, enhancing a productivity and making a manufacturing process simpler.
Inventors
- 👤 Heung Sup Chun
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 17:04
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W74/10; H10W74/111; H10W74/40; H10W74/47; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
133 words
A mold for manufacturing a package for a semiconductor chip, comprising: a lower mold die; an upper mold die having a recess; and a protrusion provided on a predetermined portion of the recess to cover a light receiving area of the semiconductor chip for providing an opening of a molded body of the package, wherein the protrusion includes an extension provided on a portion of a first surface thereof and extending beyond said first surface of the protrusion for preventing a formation of a molding resin on a predetermined portion of the package, wherein the molded body of the package is formed in an area defined by said lower and upper mold dies, said protrusion and said extension, and said protrusion and extension are not part of the package manufactured using the mold.
Claim 2
Dependent Claim
133 words
A mold for manufacturing a package for a semiconductor chip, comprising: a lower mold die; an upper mold die having a recess; and a protrusion provided on a predetermined portion of the recess to cover a light receiving area of the semiconductor chip for providing an opening of a molded body of the package, wherein the protrusion includes an extension provided on a portion of a first surface thereof and extending beyond said first surface of the protrusion for preventing a formation of a molding resin on a predetermined portion of the package, wherein the molded body of the package is formed in an area defined by said lower and upper mold dies, said protrusion and said extension, and said protrusion and extension are not part of the package manufactured using the mold.
Claim 3
Dependent Claim
17 words
The mold of claim 1, wherein the buffering member is coated with a resin of polymer group.
Claim 4
Dependent Claim
17 words
The mold of claim 1, wherein the buffering member is laminated with a resin of polymer group.
Claim 5
Dependent Claim
16 words
The mold of claim 1, wherein said protrusion includes a shoulder for introducing a transparent lid.
Claim 6
Dependent Claim
31 words
The mold of claim 1, wherein the extension includes a buffering member thereon at the first surface thereon for preventing the light receiving area of the semiconductor chip from being damaged.
Claim 7
Dependent Claim
19 words
The mold of claim 1, wherein the extension is provided on a peripheral portion of the first surface thereof.
Claim 8
Dependent Claim
13 words
The mold of claim 1, wherein said extension is integral with said protrusion.
Claim 9
Dependent Claim
14 words
The mold of claim 5, wherein said buffering member is integral with said extension.
Claim 10
Dependent Claim
13 words
The mold of claim 1, wherein the first surface is a bottom surface.
Claim 11
Dependent Claim
19 words
The mold of claim 1, wherein said protrusion and extension cover a light receiving region of the semiconductor chip.
References Cited (Backward Citations)
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Cited
US4663833A
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US4769344A
Cited
US4894707A
Cited
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Cited
US5122861A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-06-30 | 2000-12-30 | 2001-07-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-06-30 | 2004-12-30 | 2005-07-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-06-30 | 2008-12-30 | 2009-07-01 | $7700.00 | Window Closed / Lapsed |