US5687474A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of assembling and cooling a package structure with accessible chip
Assignee: SEONG CAPITAL Ltd LLC
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Filing: 1996-01-11
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Granted: 1997-11-18
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Expires: 2016-01-11
Abstract
Abstract A package for an integrated-circuit includes a package body having a die-cavity formed therein. A die-attach pad is formed in the package body adjacent the die-cavity. An opening is formed in the central portion of the die-attach pad for exposing one side of the integrated-circuit die so that an external cooling media can directly contact the exposed side of the integrated-circuit die. The die-attach pad can be formed as a die-mounting ring adjacent the die-attach cavity. The peripheral edge of the integrated-circuit die is fixed to a mounting surface on the die-mounting ring portion to accommodate direct cooling of the exposed side of the integrated-circuit die. The mounting surface of the die-mounting ring extends beyond the peripheral edge of the integrated-circuit die to accommodate a range of sizes of the integrated-circuit die. The exposed surface of the integrated circuit die is cooled, for example, with a cooling fluid, a heatsink, or a thermo-electric refrigeration unit in contact with the exposed side of the die. The exposed side of the die is coated with a film to provide a seal for the exposed side of the integrated-circuit die.
Inventors
- 👤 Ahmad Hamzehdoost
- 👤 Leonard Lucio Mora
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 22:03
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W40/00; H10W40/20; H10W40/22; H10W40/70; H10W40/77; H10W40/778; H10W72/00; H10W72/071; H10W72/073; H10W72/07351; H10W72/07352; H10W72/075; H10W72/07551; H10W72/07554; H10W72/30; H10W72/321; H10W72/50; H10W72/541; H10W72/547; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W74/10; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/736; H10W90/751; H10W90/754; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
113 words
A method for directly cooling an integrated-circuit die, having a front and back surface, mounted in an integrally formed package assembly comprising the steps of: fixing said back surface of an unpackaged integrated-circuit die to a mounting surface formed on an inwardly extending portion of a package body having a cavity formed therein for accepting said unpackaged integrated-circuit die to form an integral package assembly of said previously unpackaged integrated circuit die and said package body; and exposing said back surface of said fixed integrated-circuit die through a central opening formed in said package body to provide direct cooling to said back surface of said integrated circuit die in said integral package assembly.
Claim 2
Independent Claim
113 words
A method for directly cooling an integrated-circuit die, having a front and back surface, mounted in an integrally formed package assembly comprising the steps of: fixing said back surface of an unpackaged integrated-circuit die to a mounting surface formed on an inwardly extending portion of a package body having a cavity formed therein for accepting said unpackaged integrated-circuit die to form an integral package assembly of said previously unpackaged integrated circuit die and said package body; and exposing said back surface of said fixed integrated-circuit die through a central opening formed in said package body to provide direct cooling to said back surface of said integrated circuit die in said integral package assembly.
Claim 3
Dependent Claim
22 words
The method of claim 1 including the step of directly contacting said exposed back surface of said integrated-circuit die with cooling means.
Claim 4
Dependent Claim
24 words
The method of claim 2 including the step of directly contacting said exposed back surface of said integrated-circuit die with a fluid cooling media.
Claim 5
Dependent Claim
33 words
The method of claim 2 including the step of directly contacting said exposed back surface of said integrated-circuit die with a heat sink coupled to said exposed back surface of said integrated-circuit die.
Claim 6
Dependent Claim
24 words
The method of claim 2 including the step of directly cooling said exposed back surface of said integrated-circuit die with a thermo-electric cooling mechanism.
Claim 7
Independent Claim
126 words
A method for directly cooling an integrated-circuit die, having a front and back surface, mounted in an integrally formed package assembly comprising the steps off fixing said back surface of an unpackaged integrated-circuit die to a mounting surface formed on an inwardly extending portion of a package body having a cavity formed therein for accepting said unpackaged integrated-circuit die to form an integral package assembly of said previously unpackaged integrated circuit die and said package body; and exposing said back surface of said integrated-circuit die through a central opening formed in said package body to provide direct cooling to said back surface of said integrated circuit die in said integral package assembly: and directly contacting said exposed back surface of said integrated-circuit die with cooling means.
Claim 8
Independent Claim
126 words
A method for directly cooling an integrated-circuit die, having a front and back surface, mounted in an integrally formed package assembly comprising the steps off fixing said back surface of an unpackaged integrated-circuit die to a mounting surface formed on an inwardly extending portion of a package body having a cavity formed therein for accepting said unpackaged integrated-circuit die to form an integral package assembly of said previously unpackaged integrated circuit die and said package body; and exposing said back surface of said integrated-circuit die through a central opening formed in said package body to provide direct cooling to said back surface of said integrated circuit die in said integral package assembly: and directly contacting said exposed back surface of said integrated-circuit die with cooling means.
Claim 9
Dependent Claim
24 words
The method of claim 6 including the step of directly contacting said exposed back surface of said integrated-circuit die with a fluid cooling media.
Claim 10
Dependent Claim
33 words
The method of claim 6 including the step of directly contacting said exposed back surface of said integrated-circuit die with a heat sink coupled to said exposed back surface of said integrated-circuit die.
Claim 11
Dependent Claim
24 words
The method of claim 6 including the step of directly cooling said exposed back surface of said integrated-circuit die with a thermo-electric cooling mechanism.
Claim 12
Independent Claim
139 words
A method for directly cooling an integrated-circuit circuit die, having a front and back surface, mounted in an integrally formed package assembly comprising the steps of: fixing said back surface of an unpackaged integrated-circuit die to a mounting surface formed on an inwardly extending portion of a package body having a cavity formed therein for accepting said unpackaged integrated-circuit die to form an integral package assembly of said previously unpackaged integrated circuit die and said package body; and exposing said back surface of said fixed integrated-circuit die through a central opening formed in said package body to provide direct cooling to said back surface of said integrated circuit die in said integral package assembly; and directly contacting said exposed back surface of said integrated-circuit die with a heat sink coupled to said exposed back surface of said integrated-circuit die.
Claim 13
Independent Claim
139 words
A method for directly cooling an integrated-circuit circuit die, having a front and back surface, mounted in an integrally formed package assembly comprising the steps of: fixing said back surface of an unpackaged integrated-circuit die to a mounting surface formed on an inwardly extending portion of a package body having a cavity formed therein for accepting said unpackaged integrated-circuit die to form an integral package assembly of said previously unpackaged integrated circuit die and said package body; and exposing said back surface of said fixed integrated-circuit die through a central opening formed in said package body to provide direct cooling to said back surface of said integrated circuit die in said integral package assembly; and directly contacting said exposed back surface of said integrated-circuit die with a heat sink coupled to said exposed back surface of said integrated-circuit die.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-11-17 | 2001-05-19 | 2001-11-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-11-17 | 2005-05-19 | 2005-11-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-11-17 | 2009-05-19 | 2009-11-18 | $7700.00 | Window Closed / Lapsed |