JPS522281A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Method of making semiconductor devices
Assignee: Hitachi Ltd
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Filing: 1975-06-24
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Granted: —
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Expires: 1995-06-24
Abstract
Abstract PURPOSE: To directly attach a header to a chassis by firmly sticking a lead frame and the header with an insulating adhesive. COPYRIGHT: (C)1977,JPO&Japio
Inventors
- 👤 Masayoshi Yoshimura
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-05 01:11
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
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