US5811799A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Image sensor package having a wall with a sealed cover
Assignee: Harvatek Corp
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Filing: 1997-07-31
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Granted: 1998-09-22
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Expires: 2017-07-31
Abstract
Abstract An image sensor chip is mounted on a printed wiring frame over a substrate, which is plated with a spider web of plated conductors connecting the IC through via holes to the bottom of the substrate as output terminals. After wiring bonding the IC to the plated conductor, the package is sealed. A wall is erected around the image sensor chip and is covered with a transparent glass. A lens may be placed in the middle of the cover for focusing. The structure is amenable to mass production. A large number of printed wiring frames are arranged as a matrix on a common substrate. The frames are sealed column by column or sealed all at once. After sealing, the common substrate are diced into individual packages. The image sensor package may mounted with integrated circuit chips as peripheral circuits. The image sensor chips may be sealed with transparent glue and the integrated circuit chip may be sealed with opaque glue.
Inventors
- 👤 Liang-Chung Wu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 19:08
CPC Classifications
H; H10; H10F; H10F77/00; H10F77/50; H10F39/00; H10F39/80; H10F39/804; H10W; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
82 words
An image sensor package, comprising: an image sensor chip with multiple output terminals; a printed wiring frame having at least one conductor thereon, said conductor having one end coupled to one of said output terminals, and said conductor having a second end extending to the bottom of said printed wiring frame; a wall erected around said image sensor chip with a height taller than the height of the image sensor chip; and a transparent cover sealed over the top of said wall.
Claim 2
Dependent Claim
82 words
An image sensor package, comprising: an image sensor chip with multiple output terminals; a printed wiring frame having at least one conductor thereon, said conductor having one end coupled to one of said output terminals, and said conductor having a second end extending to the bottom of said printed wiring frame; a wall erected around said image sensor chip with a height taller than the height of the image sensor chip; and a transparent cover sealed over the top of said wall.
Claim 3
Dependent Claim
17 words
An image sensor package as described in claim 1, wherein said transparent cover is made of glass.
Claim 4
Dependent Claim
17 words
An image sensor package as described in claim 1, wherein said transparent cover is made of plastic.
Claim 5
Dependent Claim
32 words
An image sensor package as described in claim 1, wherein said transparent cover has a lens in the middle of the transparent cover for focusing an image on said image sensor chip.
Claim 6
Dependent Claim
27 words
An image sensor package as described in claim 1, wherein said image sensor chip is connected with at least one more integrated circuit chip within said package.
Claim 7
Dependent Claim
19 words
An image sensor package as described in claim 5, wherein said integrated circuit chip is covered with opaque seal.
Claim 8
Dependent Claim
20 words
An image sensor package as described in claim 6, wherein said wall and said seal are integrated as one component.
Claim 9
Dependent Claim
22 words
An image sensor package as described in claim 6, wherein said opaque seal is made of the same material as said wall.
Claim 10
Dependent Claim
27 words
An image sensor package as described in claim 5, wherein said integrated circuit chip is surrounded with a wall similar to that surrounding said image sensor chip.
Claim 11
Dependent Claim
25 words
An image sensor package as described in claim 5, wherein said image sensor chip and said integrated circuit chip are surrounded by a common wall.
Claim 12
Dependent Claim
18 words
An image sensor package as described in claim 1, wherein said image sensor is a charge coupled device.
Claim 13
Dependent Claim
18 words
An image sensor package as described in claim 1, wherein said image sensor is a complementary MOS sensor.
Claim 14
Independent Claim
142 words
A method of mass producing a multiplicity of image sensor packages on a common substrate, each having: an image sensor chip with multiple output terminals, a printed wiring frame having at least one conductor thereon, said conductor having a first end coupled to one of said output terminals, and a second extending to the bottom of said printed wiring frame; a wall erected around said image sensor chip with a height taller than the height of said image sensor chip, and a transparent cover sealed over said wall, comprising the steps of: printing a large number of said printed wiring frame on said common substrate as a matrix, applying glue around each said image sensor chip to erect said wall, sealing said wall with a common said transparent cover, and dicing said common substrate into said number of said image sensor packages.
Claim 15
Independent Claim
142 words
A method of mass producing a multiplicity of image sensor packages on a common substrate, each having: an image sensor chip with multiple output terminals, a printed wiring frame having at least one conductor thereon, said conductor having a first end coupled to one of said output terminals, and a second extending to the bottom of said printed wiring frame; a wall erected around said image sensor chip with a height taller than the height of said image sensor chip, and a transparent cover sealed over said wall, comprising the steps of: printing a large number of said printed wiring frame on said common substrate as a matrix, applying glue around each said image sensor chip to erect said wall, sealing said wall with a common said transparent cover, and dicing said common substrate into said number of said image sensor packages.
Claim 16
Dependent Claim
35 words
A method of mass producing a multiplicity of image sensor packages as described in claim 13, wherein said image sensor chip is connected to at least one more integrated chip mounted in the same package.
Claim 17
Dependent Claim
26 words
A method of mass producing a multiplicity of image sensor packages as described in claim 14, wherein said integrated circuit chip is covered with opaque seal.
Claim 18
Dependent Claim
29 words
A method of mass producing a multiplicity of image sensor packages as described in claim 15, wherein said opaque seal is made of the same material as said wall.
References Cited (Backward Citations)
US5289002A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-09-21 | 2002-03-23 | 2002-09-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-09-21 | 2006-03-23 | 2006-09-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-09-21 | 2010-03-23 | 2010-09-22 | $7700.00 | Window Closed / Lapsed |