Patent US6531335B1 successfully refreshed from Google Patents.
US6531335B1
Expired / Lapsed
US
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Interposers including upwardly protruding dams, semiconductor device assemblies including the interposers, and methods
Assignee: Micron Technology Inc
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Filing: 2000-04-28
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Granted: 2003-03-11
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Expires: 2020-04-28
Abstract
Abstract A dam for substantially laterally confining a quantity of encapsulant material over a region of a substrate, such as an interposer. The dam is configured to protrude upwardly from a surface of the interposer or other substrate. The interposer may be positioned at least partially around a slot or aperture through the substrate so as to laterally confine encapsulant material over the slot or aperture and over any intermediate conductive elements extending through the slot or aperture. The dam may be fabricated by stereolithography. A package including the interposer, the dam, and a semiconductor die to which the interposer is secured may include a sealing element between the interposer and the active surface of the die. All or part of the sealing element may also be fabricated using stereolithography. Methods and systems using machine vision in conjunction with stereolithography equipment are also disclosed.
Inventors
- 👤 Ford B. Grigg
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:33
CPC Classifications
H; H10; H10D; H10D64/00; H10D64/01; H10D64/011; B; B33; B33Y; B33Y10/00; B33Y80/00; H10W; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H10W90/00; H10W90/701; B33Y30/00; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/075; H10W72/20; H10W72/851; H10W72/853; H10W72/865; H10W72/90; H10W72/951; H10W74/00; H10W74/10; H10W74/111; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 52
Claim 1
Independent Claim
183 words
A method for protecting conductive elements of a semiconductor device package, comprising: providing an assembly including at least one semiconductor die and at least one interposer, said at least one semiconductor die including at least one bond pad on an active surface thereof, said at least one interposer including at least one slot therethrough, said at least one bond pad being exposed through said at least one slot, a first surface of a substrate of said at least one interposer being secured to said active surface by an adhesive layer, said at least one bond pad being connected to a corresponding contact pad of said at least one interposer by way of an intermediate conductive element extending through said at least one slot; forming, without a preformed dam, at least one upwardly protruding dam on a second surface of said substrate at least partially around said at least one slot; and disposing a quantity of encapsulant over said at least one slot and said intermediate conductive element, said at least one upwardly protruding dam at least partially laterally confining said quantity of encapsulant.
Claim 2
Independent Claim
183 words
A method for protecting conductive elements of a semiconductor device package, comprising: providing an assembly including at least one semiconductor die and at least one interposer, said at least one semiconductor die including at least one bond pad on an active surface thereof, said at least one interposer including at least one slot therethrough, said at least one bond pad being exposed through said at least one slot, a first surface of a substrate of said at least one interposer being secured to said active surface by an adhesive layer, said at least one bond pad being connected to a corresponding contact pad of said at least one interposer by way of an intermediate conductive element extending through said at least one slot; forming, without a preformed dam, at least one upwardly protruding dam on a second surface of said substrate at least partially around said at least one slot; and disposing a quantity of encapsulant over said at least one slot and said intermediate conductive element, said at least one upwardly protruding dam at least partially laterally confining said quantity of encapsulant.
Claim 3
Dependent Claim
89 words
The method of claim 1 , wherein said forming comprises: forming at least one layer of material in a substantially unconsolidated state over at least a portion of said second surface of said substrate; and selectively altering a state of said material of said at least one layer at least in regions located at least partially around said at least one slot from said substantially unconsolidated state to at least a semisolid state, while leaving protective material over other regions of said second surface in said substantially unconsolidated state.
Claim 4
Dependent Claim
121 words
The method of claim 2 , further comprising: forming at least one additional layer of material in a substantially unconsolidated state over at least a second portion of said second surface of said substrate; and selectively altering a state of said material of said at least one additional layer at least in selected regions located at least partially around said at least one slot from said substantially unconsolidated state to at least a semisolid state, said at least said second portion being at least partially superimposed over, contiguous with, and mutually adhered to said at least said portion, while leaving protective material of said at least one additional layer over other regions of said active surface in said substantially unconsolidated state.
Claim 5
Dependent Claim
29 words
The method of claim 3 , further comprising removing at least some of the protective material in said substantially unconsolidated state from said other regions of said second surface.
Claim 6
Dependent Claim
29 words
The method of claim 2 , wherein said forming said at least one layer comprises substantially completely covering said second surface with said material in said substantially unconsolidated state.
Claim 7
Dependent Claim
25 words
The method of claim 2 , wherein said selectively altering comprises subjecting said regions of said at least one layer to a beam of radiation.
Claim 8
Dependent Claim
23 words
The method of claim 6 , wherein said selectively altering comprises subjecting said regions of said at least one layer to UV radiation.
Claim 9
Dependent Claim
31 words
The method of claim 1 , further comprising disposing a quantity of material in a substantially unconsolidated state between said at least one interposer and said at least one semiconductor die.
Claim 10
Dependent Claim
39 words
The method of claim 8 , further comprising selectively altering said material between said at least one interposer and said at least one semiconductor die in selected areas from said substantially unconsolidated state to at least a semisolid state.
Claim 11
Dependent Claim
57 words
The method of claim 9 , wherein said selectively altering said material between said at least one interposer and said at least one semiconductor die comprises forming a sealing member between said at least one interposer and said at least one semiconductor die that, along with said adhesive layer, laterally surrounds said at least one bond pad.
Claim 12
Dependent Claim
50 words
The method of claim 9 , wherein said selectively altering said material between said at least one interposer and said at least one semiconductor die comprises selectively altering material adjacent an outer periphery of at least one of said at least one interposer and said at least one semiconductor die.
Claim 13
Dependent Claim
38 words
The method of claim 9 , wherein said selectively altering said material between said at least one interposer and said at least one semiconductor die comprises selectively altering material adjacent a periphery of said at least one slot.
Claim 14
Dependent Claim
35 words
The method of claim 9 , wherein said selectively altering said material between said at least one interposer and said at least one semiconductor die comprises subjecting said selected areas to a beam of radiation.
Claim 15
Dependent Claim
33 words
The method of claim 9 , wherein said selectively altering said material between said at least one interposer and said at least one semiconductor die comprises subjecting said selected areas to UV radiation.
Claim 16
Dependent Claim
85 words
The method of claim 11 , wherein said forming comprises: supporting said assembly on a platform with a backside of said at least one semiconductor die facing said platform; submerging said assembly in liquid resin to form a layer of said liquid resin over said second surface of said substrate of said at least one interposer; and subjecting said selected regions of said layer to a controllable beam of radiation to change said liquid resin in said selected regions to an at least semisolid state.
Claim 17
Dependent Claim
20 words
The method of claim 15 , wherein said subjecting comprises subjecting said selected regions to a beam of UV radiation.
Claim 18
Dependent Claim
29 words
The method of claim 16 , further comprising repeating said submerging and said subjecting to form at least one additional layer of said at least one upwardly protruding dam.
Claim 19
Dependent Claim
49 words
The method of claim 1 , further comprising storing data including at least one physical parameter of said at least one interposer in computer memory, and using the stored data in conjunction with a machine vision system to recognize a location and orientation of the at least one interposer.
Claim 20
Dependent Claim
30 words
The method of claim 18 , further comprising using the stored data, in conjunction with the machine vision system, to effect said forming said at least one upwardly protruding dam.
Claim 21
Independent Claim
57 words
A method for fabricating an interposer, comprising: placing at least an interposer including a substrate with at least one slot therethrough in a horizontal plane; recognizing a location and orientation of said substrate; and stereolithographically fabricating at least one upwardly protruding dam on a surface of said interposer at least partially around said at least one slot.
Claim 22
Independent Claim
57 words
A method for fabricating an interposer, comprising: placing at least an interposer including a substrate with at least one slot therethrough in a horizontal plane; recognizing a location and orientation of said substrate; and stereolithographically fabricating at least one upwardly protruding dam on a surface of said interposer at least partially around said at least one slot.
Claim 23
Dependent Claim
55 words
The method of claim 20 , further comprising storing data including at least one physical parameter of said interposer and of said at least one upwardly protruding dam in computer memory, and using the stored data in conjunction with a machine vision system to recognize a location and orientation of said at least one interposer.
Claim 24
Dependent Claim
36 words
The method of claim 21 , further including storing in computer memory at least one physical parameter of said at least one slot around which said at least one upwardly protruding dam is to be fabricated.
Claim 25
Dependent Claim
36 words
The method of claim 21 , further comprising using the stored data, in conjunction with said machine vision system, to effect stereolithographically fabrication of at least one layer of said at least one upwardly protruding dam.
Claim 26
Dependent Claim
17 words
The method of claim 21 , further comprising recognizing a location of said at least one slot.
Claim 27
Dependent Claim
29 words
The method of claim 20 , further including securing said at least one interposer to a carrier prior to placing said at least one interposer in said horizontal plane.
Claim 28
Independent Claim
220 words
A method for protecting conductive elements of a semiconductor device package, comprising: providing an assembly including at least one semiconductor die and at least one interposer, said at least one semiconductor die including at least one bond pad on an active surface thereof, said at least one interposer including at least one slot therethrough, said at least one bond pad being exposed through said at least one slot, a first surface of a substrate of said at least one interposer being secured to said active surface by an adhesive layer, said at least one bond pad being connected to a corresponding contact pad of said at least one interposer by way of an intermediate conductive element extending through said at least one slot; forming at least one upwardly protruding dam on a second surface of said substrate at least partially around said at least one slot; disposing a quantity of encapsulant over said at least one slot and said intermediate conductive element, said at least one upwardly protruding dam at least partially laterally confining said quantity of encapsulant; and storing data including at least one physical parameter of said at least one interposer in computer memory, and using the stored data in conjunction with a machine vision system to recognize a location and orientation of the at least one interposer.
Claim 29
Independent Claim
220 words
A method for protecting conductive elements of a semiconductor device package, comprising: providing an assembly including at least one semiconductor die and at least one interposer, said at least one semiconductor die including at least one bond pad on an active surface thereof, said at least one interposer including at least one slot therethrough, said at least one bond pad being exposed through said at least one slot, a first surface of a substrate of said at least one interposer being secured to said active surface by an adhesive layer, said at least one bond pad being connected to a corresponding contact pad of said at least one interposer by way of an intermediate conductive element extending through said at least one slot; forming at least one upwardly protruding dam on a second surface of said substrate at least partially around said at least one slot; disposing a quantity of encapsulant over said at least one slot and said intermediate conductive element, said at least one upwardly protruding dam at least partially laterally confining said quantity of encapsulant; and storing data including at least one physical parameter of said at least one interposer in computer memory, and using the stored data in conjunction with a machine vision system to recognize a location and orientation of the at least one interposer.
Claim 30
Dependent Claim
30 words
The method of claim 26 , further comprising: using the stored data, in conjunction with the machine vision system, to effect said forming said at least one upwardly protruding dam.
Claim 31
Dependent Claim
25 words
The method of claim 26 , wherein said forming comprises substantially completely covering said second surface with a protective material in a substantially unconsolidated state.
Claim 32
Dependent Claim
31 words
The method of claim 28 , further comprising, following said forming, removing at least some of the protective material in a substantially unconsolidated state from other regions of said second surface.
Claim 33
Dependent Claim
23 words
The method of claim 28 , wherein said forming further comprises selectively altering regions of said protective material with a beam of radiation.
Claim 34
Dependent Claim
17 words
The method of claim 30 , wherein said selectively altering comprises subjecting said regions to UV radiation.
Claim 35
Dependent Claim
31 words
The method of claim 26 , further comprising disposing a quantity of material in a substantially unconsolidated state between said at least one interposer and said at least one semiconductor die.
Claim 36
Dependent Claim
39 words
The method of claim 32 , further comprising selectively altering said material between said at least one interposer and said at least one semiconductor die in selected areas from said substantially unconsolidated state to at least a semisolid state.
Claim 37
Dependent Claim
57 words
The method of claim 33 , wherein said selectively altering said material between said at least one interposer and said at least one semiconductor die comprises forming a sealing member between said at least one interposer and said at least one semiconductor die that, along with said adhesive layer, laterally surrounds said at least one bond pad.
Claim 38
Dependent Claim
50 words
The method of claim 33 , wherein said selectively altering said material between said at least one interposer and said at least one semiconductor die comprises selectively altering material adjacent an outer periphery of at least one of said at least one interposer and said at least one semiconductor die.
Claim 39
Dependent Claim
38 words
The method of claim 33 , wherein said selectively altering said material between said at least one interposer and said at least one semiconductor die comprises selectively altering material adjacent a periphery of said at least one slot.
Claim 40
Dependent Claim
35 words
The method of claim 33 , wherein said selectively altering said material between said at least one interposer and said at least one semiconductor die comprises subjecting said selected areas to a beam of radiation.
Claim 41
Dependent Claim
33 words
The method of claim 33 , wherein said selectively altering said material between said at least one interposer and said at least one semiconductor die comprises subjecting said selected areas to UV radiation.
Claim 42
Dependent Claim
85 words
The method of claim 26 , wherein said forming comprises: supporting said assembly on a platform with a backside of said at least one semiconductor die facing said platform; submerging said assembly in liquid resin to form a layer of said liquid resin over said second surface of said substrate of said at least one interposer; and subjecting said selected regions of said layer to a controllable beam of radiation to change said liquid resin in said selected regions to an at least semisolid state.
Claim 43
Dependent Claim
20 words
The method of claim 39 , wherein said subjecting comprises subjecting said selected regions to a beam of UV radiation.
Claim 44
Dependent Claim
29 words
The method of claim 39 , further comprising repeating said submerging and said subjecting to form at least one additional layer of said at least one upwardly protruding dam.
Claim 45
Independent Claim
104 words
A method for fabricating an interposer, comprising: placing at least an interposer including a substrate with at least one slot therethrough in a horizontal plane; recognizing a location and orientation of said substrate; stereolithographically fabricating at least one upwardly protruding dam on a surface of said interposer at least partially around said at least one slot; and storing data including at least one physical parameter of said interposer and of said at least one upwardly protruding dam in computer memory, and using the stored data in conjunction with a machine vision system to recognize a location and orientation of said at least one interposer.
Claim 46
Independent Claim
104 words
A method for fabricating an interposer, comprising: placing at least an interposer including a substrate with at least one slot therethrough in a horizontal plane; recognizing a location and orientation of said substrate; stereolithographically fabricating at least one upwardly protruding dam on a surface of said interposer at least partially around said at least one slot; and storing data including at least one physical parameter of said interposer and of said at least one upwardly protruding dam in computer memory, and using the stored data in conjunction with a machine vision system to recognize a location and orientation of said at least one interposer.
Claim 47
Dependent Claim
36 words
The method of claim 42 , further including storing in computer memory at least one physical parameter of said at least one slot around which said at least one upwardly protruding dam is to be fabricated.
Claim 48
Dependent Claim
36 words
The method of claim 42 , further comprising using the stored data, in conjunction with said machine vision system, to effect stereolithographically fabrication of at least one layer of said at least one upwardly protruding dam.
Claim 49
Dependent Claim
17 words
The method of claim 42 , further comprising recognizing a location of said at least one slot.
Claim 50
Dependent Claim
29 words
The method of claim 42 , further including securing said at least one interposer to a carrier prior to placing said at least one interposer in said horizontal plane.
Claim 51
Independent Claim
244 words
A method for protecting conductive elements of a semiconductor device package, comprising: providing an assembly including at least one semiconductor die and at least one interposer, said at least one semiconductor die including at least one bond pad on an active surface thereof, said at least one interposer including at least one slot therethrough, said at least one bond pad being exposed through said at least one slot, a first surface of a substrate of said at least one interposer being secured to said active surface by an adhesive layer, said at least one bond pad being connected to a corresponding contact pad of said at least one interposer by way of an intermediate conductive element extending through said at least one slot; forming at least one upwardly protruding dam on a second surface of said substrate at least partially around said at least one slot by sequentially forming a plurality of layers comprising material in a substantially unconsolidated state on at least a portion of said second surface and selectively altering a state of said material in at least portions of each of said plurality of layers from said substantially unconsolidated state to an at least partially consolidated state prior to forming a next-higher layer of said plurality of layers; and disposing a quantity of encapsulant over said at least one slot and said intermediate conductive element, said at least one upwardly protruding dam at least partially laterally confining said quantity of encapsulant.
Claim 52
Independent Claim
244 words
A method for protecting conductive elements of a semiconductor device package, comprising: providing an assembly including at least one semiconductor die and at least one interposer, said at least one semiconductor die including at least one bond pad on an active surface thereof, said at least one interposer including at least one slot therethrough, said at least one bond pad being exposed through said at least one slot, a first surface of a substrate of said at least one interposer being secured to said active surface by an adhesive layer, said at least one bond pad being connected to a corresponding contact pad of said at least one interposer by way of an intermediate conductive element extending through said at least one slot; forming at least one upwardly protruding dam on a second surface of said substrate at least partially around said at least one slot by sequentially forming a plurality of layers comprising material in a substantially unconsolidated state on at least a portion of said second surface and selectively altering a state of said material in at least portions of each of said plurality of layers from said substantially unconsolidated state to an at least partially consolidated state prior to forming a next-higher layer of said plurality of layers; and disposing a quantity of encapsulant over said at least one slot and said intermediate conductive element, said at least one upwardly protruding dam at least partially laterally confining said quantity of encapsulant.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-03-10 | 2006-09-09 | 2007-03-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-03-10 | 2010-09-09 | 2011-03-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-03-10 | 2014-09-09 | 2015-03-11 | $7700.00 | Window Closed / Lapsed |