US6493229B2 — Heat sink chip package

Claim 1

Independent Claim 128 words

An integrated circuit chip packaging, comprising: a plurality of integrated circuit (IC) chips, each IC chip having an active surface and an inactive surface, each chip being mounted upon a respective printed circuit board (PCB), the PCB having a first side and a second side that is parallel to the first side, each IC chip having a geometric center of mechanical expansion, wherein the inactive surface of each IC chip is disposed upon the respective PCB; a ball array disposed upon at least one of the first side and the second side of each PCB; and a heat sink disposed upon at least one of the first side and the second side of each PCB, each ball array being located between the heat sink and the geometric center.

Claim 2

Dependent Claim 128 words

An integrated circuit chip packaging, comprising: a plurality of integrated circuit (IC) chips, each IC chip having an active surface and an inactive surface, each chip being mounted upon a respective printed circuit board (PCB), the PCB having a first side and a second side that is parallel to the first side, each IC chip having a geometric center of mechanical expansion, wherein the inactive surface of each IC chip is disposed upon the respective PCB; a ball array disposed upon at least one of the first side and the second side of each PCB; and a heat sink disposed upon at least one of the first side and the second side of each PCB, each ball array being located between the heat sink and the geometric center.

Claim 3

Dependent Claim 52 words

An integrated circuit chip package according to claim 1 , wherein the plurality of PCBs comprise two circuit boards that contact ball arrays on the first side and the second side and two circuit boards that contact ball arrays, one upon the first side thereof and one upon the second side thereof.

Claim 4

Dependent Claim 28 words

An integrated circuit chip package according to claim 1 , the integrated circuit chip package further comprising: an expansion card upon which the IC chip package is mounted.

Claim 5

Dependent Claim 28 words

An integrated circuit chip package according to claim 1 , the integrated circuit chip package further comprising: a motherboard of which the IC chip package is a component.

Claim 6

Dependent Claim 20 words

An integrated circuit chip package according to claim 1 , wherein said heat sink is disposed against each IC chip.

Claim 7

Dependent Claim 18 words

An integrated circuit chip package according to claim 1 , wherein said heat sink is attached with adhesive.

Claim 8

Dependent Claim 22 words

An integrated circuit chip package according to claim 1 , wherein at least one of said IC chips is a flip chip.

Claim 9

Dependent Claim 18 words

An integrated circuit chip package according to claim 1 , wherein said heat sink comprises a tin alloy.

Claim 10

Dependent Claim 24 words

An integrated circuit chip package according to claim 8 , wherein said alloy comprises at least one of In, Ag, Pb, and combinations thereof.

Claim 11

Dependent Claim 148 words

An integrated circuit (IC) chip package assembly, comprising: a plurality of IC chip packages disposed in serial stacked relation to each other, each including: a geometric center; an IC chip having an active surface opposite an inactive surface, a printed circuit board (PCB) having: a first side opposite a second side; the inactive surface of the IC chip mounted on the first side of the PCB; and a via having therein an electrically conductive material extending from the first side to the second side; a ball array disposed upon the first side of the PCB and upon the second side of an adjacent PCB; and a heat sink disposed upon and in thermal communication with the first side of the PCB and the second side of an adjacent PCB, the ball array being located between the heat sink and the geometric center of the integrated circuit chip package.

Claim 12

Dependent Claim 148 words

An integrated circuit (IC) chip package assembly, comprising: a plurality of IC chip packages disposed in serial stacked relation to each other, each including: a geometric center; an IC chip having an active surface opposite an inactive surface, a printed circuit board (PCB) having: a first side opposite a second side; the inactive surface of the IC chip mounted on the first side of the PCB; and a via having therein an electrically conductive material extending from the first side to the second side; a ball array disposed upon the first side of the PCB and upon the second side of an adjacent PCB; and a heat sink disposed upon and in thermal communication with the first side of the PCB and the second side of an adjacent PCB, the ball array being located between the heat sink and the geometric center of the integrated circuit chip package.

Claim 13

Dependent Claim 22 words

An integrated circuit chip package according to claim 10 , wherein at least one of said IC chips is a flip chip.

Claim 14

Dependent Claim 18 words

An integrated circuit chip package according to claim 10 , wherein said heat sink comprises a tin alloy.

Claim 15

Dependent Claim 24 words

An integrated circuit chip package according to claim 12 , wherein said alloy comprises at least one of In, Ag, Pb, and combinations thereof.

Claim 16

Dependent Claim 19 words

An integrated circuit chip package according to claim 10 , wherein said heat sink is attached with an adhesive.

Claim 17

Dependent Claim 99 words

An integrated circuit (IC) chip package assembly, comprising: a plurality of printed circuit boards (PCB) each having a via extending therethrough, each said via having an electrically conductive material extending therethrough; a plurality of heat sinks each separating and being in contact with two of said PCBs; a plurality of ball arrays each separating and being in contact with two of said PCBs; and a plurality of IC chips each being: mounted on one of said PCBs; and electrically connected to the electrically conductive material extending through the via of the PCB on which the IC chip is mounted.

Claim 18

Dependent Claim 99 words

An integrated circuit (IC) chip package assembly, comprising: a plurality of printed circuit boards (PCB) each having a via extending therethrough, each said via having an electrically conductive material extending therethrough; a plurality of heat sinks each separating and being in contact with two of said PCBs; a plurality of ball arrays each separating and being in contact with two of said PCBs; and a plurality of IC chips each being: mounted on one of said PCBs; and electrically connected to the electrically conductive material extending through the via of the PCB on which the IC chip is mounted.

Claim 19

Dependent Claim 42 words

An IC chip package assembly according to claim 15 , wherein: each said ball array has first and second opposite portions; and each said IC chip is situated in between the first and second opposition portions of one of said ball arrays.

Claim 20

Dependent Claim 42 words

An IC chip package assembly according to claim 15 , wherein: each said beat sink has first and second opposite portions; and each said IC chip is situated in between the first and second opposition portions of one of said heat sinks.

Claim 21

Dependent Claim 58 words

An IC chip package assembly according to claim 15 , wherein: each said ball array has first and second opposite portions; each said heat sink has first and second opposite portions; and each said IC chip is situated in between the first and second opposition portions of: one of said ball arrays; and one of said heat sinks.

Claim 22

Dependent Claim 54 words

An IC chip package assembly according to claim 15 , wherein: each said IC chip is wire bonded to the PCB upon which the IC chip is mounted; an encapsulant encapsulates both the IC chip and the wire bonding thereof; and the encapsulant contacts the PCB upon which each said IC chip is mounted.

Claim 23

Dependent Claim 22 words

An IC chip package assembly according to claim 15 , wherein at least one of said IC chips is a flip chip.

Claim 24

Dependent Claim 22 words

An IC chip package assembly according to claim 15 , wherein at least one of said heat sinks comprises a tin alloy.

Claim 25

Dependent Claim 24 words

An IC chip package assembly according to claim 21 , wherein said alloy comprises at least one of In, Ag, Pb, and combinations thereof.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	2005-12-09	2006-06-10	2006-12-10	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2009-12-09	2010-06-10	2010-12-10	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2013-12-09	2014-06-10	2014-12-10	$7700.00	Window Closed / Lapsed

Heat sink chip package

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