US5909057A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated heat spreader/stiffener with apertures for semiconductor package
Assignee: Bell Semiconductor LLC
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Filing: 1997-09-23
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Granted: 1999-06-01
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Expires: 2017-09-23
Abstract
Abstract Provided is a single-piece integrated heat spreader/stiffener which is bonded to the substrate and die in a semiconductor package following electrical bonding of the die to the substrate, a packaging method using the integrated heat spreader/stiffener, and a semiconductor package incorporating the integrated heat spreader/stiffener. In a preferred embodiment, the integrated heat spreader/stiffener is a piece of high modulus, high thermal conductivity material shaped to attach over a die on the surface of a packaging substrate. The heat spreader/stiffener is equipped with a plurality of apertures to provide access to the top surface of the die for adhesive to bond the heat spreader/stiffener to the die, and to its perimeter to provide access for dispensation of underfill material between the die and the substrate. Once the adhesive and underfill materials are in place, the adhesive and underfill resins are cured by heating. A ball grid array (BGA) process may then be used to apply solder balls to the underside of the substrate for subsequent bonding of the package to a circuit board for use.
Inventors
- 👤 John P. McCormick
- 👤 Sunil A. Patel
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 16:42
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/012; H10W72/00; H10W72/30; H10W74/10; H10W74/15; H10W72/071; H10W72/072; H10W72/073; H10W72/851; H10W72/853; H10W72/856; H10W72/874; H10W72/877; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
158 words
A semiconductor device package, comprising: a packaging substrate; a semiconductor die attached to said substrate; a top portion of an integrated heat spreader/stiffener having a plurality of apertures; a circumferential side region attached to said top portion; and a cavity defined by said top portion and said circumferential side region, the top of said cavity partially covering and the circumferential side region of said cavity enclosing said die, while providing access to a perimeter region of the die through said apertures; wherein said integrated heat spreader/stiffener is attached to said die and to said packaging substrate to hold said die substantially in place on said substrate, and substantially prevent warpage of said die; and at least one of said apertures is at least partially aligned with a region adjacent to said die such that said die does not lie along a path defined by a straight line that passes through said at least one aperture and said substrate.
Claim 2
Dependent Claim
158 words
A semiconductor device package, comprising: a packaging substrate; a semiconductor die attached to said substrate; a top portion of an integrated heat spreader/stiffener having a plurality of apertures; a circumferential side region attached to said top portion; and a cavity defined by said top portion and said circumferential side region, the top of said cavity partially covering and the circumferential side region of said cavity enclosing said die, while providing access to a perimeter region of the die through said apertures; wherein said integrated heat spreader/stiffener is attached to said die and to said packaging substrate to hold said die substantially in place on said substrate, and substantially prevent warpage of said die; and at least one of said apertures is at least partially aligned with a region adjacent to said die such that said die does not lie along a path defined by a straight line that passes through said at least one aperture and said substrate.
Claim 3
Dependent Claim
64 words
The integrated heat spreader/stiffener of claim 1, wherein said integrated heat spreader/stiffener is comprised of a material having a modulus between about 9×10 6 and 30×10 6 psi and a thermal conductivity between about 2 and 4 W/cm.K shaped into said top portion and circumferential side region, wherein the top portion and circumferential side region together form a unitary structure which defines said cavity.
Claim 4
Dependent Claim
13 words
The integrated heat spreader/stiffener of claim 2, wherein said material comprises nickel-plated copper.
Claim 5
Dependent Claim
18 words
The integrated heat spreader/stiffener of claim 3, wherein said nickel-plated copper is about 10 to 50 mils thick.
Claim 6
Dependent Claim
16 words
The integrated heat spreader/stiffener of claim 1, wherein said top portion is substantially square in shape.
Claim 7
Dependent Claim
31 words
The integrated heat spreader/stiffener of claim 5, wherein said cavity is about 15.5 to 20 mm long, by about 15.5 to 20 mm wide, by about 0.4 to 0.6 mm deep.
Claim 8
Dependent Claim
25 words
The integrated heat spreader/stiffener of claim 7, wherein said cavity is about 16 mm long, by about 16 mm wide, by about 0.5 mm deep.
Claim 9
Dependent Claim
20 words
The integrated heat spreader/stiffener of claim 1, wherein said apertures further provide access to the top surface of said die.
Claim 10
Dependent Claim
14 words
The integrated heat spreader/stiffener of claim 1, wherein said apertures are substantially evenly spaced.
Claim 11
Dependent Claim
12 words
The integrated heat spreader/stiffener of claim 1, wherein said apertures are round.
Claim 12
Dependent Claim
20 words
The integrated heat spreader/stiffener of claim 10, wherein said apertures have a diameter of between about 10 and 50 mils.
Claim 13
Dependent Claim
16 words
The integrated heat spreader/stiffener of claim 1, wherein said top portion is substantially circular in shape.
Claim 14
Dependent Claim
221 words
A semiconductor device package, comprising: a packaging substrate having a top side and an underside; a semiconductor die having an active surface, a top surface and a perimeter, said active surface of said die bonded to the top side of said substrate; an underfill material substantially disposed between said die and said substrate; and an integrated heat spreader/stiffener bonded to said top surface of said die and to said top side of said substrate, said integrated heat spreader/stiffener comprising, a top portion having a plurality of apertures; a circumferential side region attached to said top portion; and a cavity defined by said top portion and said circumferential side region, the top of said cavity partially covering and the circumferential side region of said cavity enclosing the semiconductor die mounted on the packaging substrate, while providing access to a perimeter region of the die through said apertures; wherein said integrated heat spreader/stiffener is attached to the top surface of said die and to said packaging substrate, and substantially prevent warpage of said die relative to said substrate; and at least one of said apertures is at least partially aligned with a region adjacent to said die such that said die does not lie along a path defined by a straight line that passes through said at least one aperture and said substrate.
Claim 15
Dependent Claim
221 words
A semiconductor device package, comprising: a packaging substrate having a top side and an underside; a semiconductor die having an active surface, a top surface and a perimeter, said active surface of said die bonded to the top side of said substrate; an underfill material substantially disposed between said die and said substrate; and an integrated heat spreader/stiffener bonded to said top surface of said die and to said top side of said substrate, said integrated heat spreader/stiffener comprising, a top portion having a plurality of apertures; a circumferential side region attached to said top portion; and a cavity defined by said top portion and said circumferential side region, the top of said cavity partially covering and the circumferential side region of said cavity enclosing the semiconductor die mounted on the packaging substrate, while providing access to a perimeter region of the die through said apertures; wherein said integrated heat spreader/stiffener is attached to the top surface of said die and to said packaging substrate, and substantially prevent warpage of said die relative to said substrate; and at least one of said apertures is at least partially aligned with a region adjacent to said die such that said die does not lie along a path defined by a straight line that passes through said at least one aperture and said substrate.
Claim 16
Dependent Claim
20 words
The semiconductor package of claim 13, further comprising a solder ball grid array attached to the underside of said substrate.
Claim 17
Dependent Claim
31 words
The semiconductor package of claim 13, wherein said integrated heat spreader/stiffener is bonded to top surface of said die and to the top side of said substrate by a thermal adhesive.
Claim 18
Dependent Claim
14 words
The semiconductor package of claim 13, wherein said underfill material comprises a thermo-set epoxy.
Claim 19
Dependent Claim
65 words
The semiconductor package of claim 13, wherein said integrated heat spreader/stiffener is comprised of a material having a modulus between about 9×10 6 and 30×10 6 psi and a thermal conductivity between about 2 and 4 W/cm.K shaped into said top portion and said circumferential side region, wherein the top portion and the circumferential side region together form a unitary structure which defines said cavity.
Claim 20
Dependent Claim
12 words
The semiconductor package of claim 17, wherein said material comprises nickel-plated copper.
Claim 21
Dependent Claim
17 words
The semiconductor package of claim 18, wherein said nickel-plated copper is about 10 to 50 mils thick.
Claim 22
Dependent Claim
15 words
The semiconductor package of claim 13, wherein said top portion is substantially square in shape.
Claim 23
Dependent Claim
19 words
The semiconductor package of claim 13, wherein said apertures further provide access to the top surface of said die.
Claim 24
Dependent Claim
11 words
The semiconductor package of claim 13, wherein said apertures are round.
Claim 25
Dependent Claim
19 words
The semiconductor package of claim 13, wherein said apertures have a diameter of between about 10 and 50 mils.
Claim 26
Dependent Claim
13 words
The semiconductor package of claim 13, wherein said apertures are substantially evenly spaced.
Claim 27
Dependent Claim
137 words
A semiconductor device package, comprising: a packaging substrate; a semiconductor die attached to said substrate; a top portion of an integrated heat spreader/stiffener having a plurality of apertures; a circumferential side region attached to said top portion; and a cavity defined by said top portion and said circumferential side region, the top of said cavity partially covering and the circumferential side region of said cavity enclosing said die, while providing access to a perimeter region of said die through said apertures; and wherein said integrated heat spreader/stiffener is attached to said die and to said packaging substrate to hold said die substantially in place on said substrate, and substantially prevent warpage of said die; and at least one of said apertures provides an unobstructed path between said cavity and a region external to said integrated heat spreader/stiffener.
Claim 28
Dependent Claim
137 words
A semiconductor device package, comprising: a packaging substrate; a semiconductor die attached to said substrate; a top portion of an integrated heat spreader/stiffener having a plurality of apertures; a circumferential side region attached to said top portion; and a cavity defined by said top portion and said circumferential side region, the top of said cavity partially covering and the circumferential side region of said cavity enclosing said die, while providing access to a perimeter region of said die through said apertures; and wherein said integrated heat spreader/stiffener is attached to said die and to said packaging substrate to hold said die substantially in place on said substrate, and substantially prevent warpage of said die; and at least one of said apertures provides an unobstructed path between said cavity and a region external to said integrated heat spreader/stiffener.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-05-31 | 2002-11-30 | 2003-06-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-05-31 | 2006-11-30 | 2007-06-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-05-31 | 2010-11-30 | 2011-06-01 | $7700.00 | Window Closed / Lapsed |