US6265772B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Stacked semiconductor device
Assignee: Lenovo Innovations Ltd Hong Kong
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Filing: 1999-06-15
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Granted: 2001-07-24
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Expires: 2019-06-15
Abstract
Abstract The object of the present invention is to provide a stacked semiconductor device which can diffuse heat generated by the semiconductor chip in the module substrate, other semiconductor chips, the mother board, and the radiator plate, and can prevent needless increases in the temperature of an operating semiconductor chip; in order to achieve this object, the stacked semiconductor device of the present invention comprises a mother board and a module-stacked body mounted on the mother board, the module-stacked body comprising staked two or more modules each of which comprises a module substrate and a semiconductor chip mounted to the module substrate, wherein at least one radiator hole is formed in each of the module substrates and the mother board so that the radiator hole faces to the semiconductor chips.
Inventors
- 👤 Yuichi Yoshida
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 18:25
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W90/00; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K1/0204; H05K1/0206; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/10; H05K2201/10431; H05K2201/10507; H05K2201/10515; H05K2201/10613; H05K2201/10621; H05K2201/10734; H05K3/00; H05K3/0058; H05K3/0061; H05K3/40; H05K3/4038; H05K3/4053; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4629; H05K3/4641; H10W90/20; H10W90/22; H10W90/288; H10W90/701; H10W90/721; H10W90/731; H10W90/734; H10W90/737
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
79 words
A stacked semiconductor device comprising a mother board and a module-stacked body mounted on the mother board, the module-stacked body comprising two or more stacked modules each of which comprises a module substrate and a semiconductor chip mounted on the module substrate, wherein at least one radiator hole is formed in each of the module substrates and the mother board so that the radiator hole formed in at least one of the module substrates faces to the semiconductor chip.
Claim 2
Dependent Claim
79 words
A stacked semiconductor device comprising a mother board and a module-stacked body mounted on the mother board, the module-stacked body comprising two or more stacked modules each of which comprises a module substrate and a semiconductor chip mounted on the module substrate, wherein at least one radiator hole is formed in each of the module substrates and the mother board so that the radiator hole formed in at least one of the module substrates faces to the semiconductor chip.
Claim 3
Dependent Claim
51 words
A stacked semiconductor device according to claim 1 , wherein a heat conduction member is in spaces between the module substrates, and the module substrate and the mother board, and the radiator hole formed in the module substrate and the mother board faces the heat conduction member or the semiconductor chip.
Claim 4
Dependent Claim
48 words
A stacked semiconductor device according to claim 1 , wherein a heat dissipation layer is formed in the module substrates and the mother board, and a heat diffusion pattern is formed at location at which the semiconductor chips is mounted on the module substrate and the mother board.
Claim 5
Dependent Claim
43 words
A stacked semiconductor device according to claim 1 , wherein the radiator hole is formed so that the radiator hole face to at least one connector or heat dissipation which mechanically connects the module substrates, and the module substrate and the mother board.
Claim 6
Dependent Claim
46 words
A stacked semiconductor device according to claim 1 , wherein a radiator plate is provided on the lower surface of the mother board, the heat conduction member is provided onto the mother board, and the radiator hole faces the radiator plate and the heat conduction member.
Claim 7
Dependent Claim
34 words
A stacked semiconductor device according to claim 1 , wherein the inside wall of the radiator hole is plated with at least one metal selected from the group consisting of copper, gold, and silver.
Claim 8
Dependent Claim
41 words
A stacked semiconductor device according to claim 1 , wherein the radiator hole is filled with at least one metal selected from the group consisting of metals having high thermal conductivity, and resins containing metals having high thermal conductivity or ceramics.
Claim 9
Dependent Claim
32 words
A stacked semiconductor device according to claim 1 , wherein the heat conduction member is made of silicone containing one material selected from the group consisting of copper, alumina, and boron nitride.
Claim 10
Dependent Claim
21 words
A stacked semiconductor device according to claim 1 , wherein the heat conduction member is made of resin having low elasticity.
Claim 11
Dependent Claim
18 words
A stacked semiconductor device according to claim 1 , wherein the heat conduction member is made of rubber.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-07-23 | 2005-01-22 | 2005-07-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-07-23 | 2009-01-22 | 2009-07-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-07-23 | 2013-01-22 | 2013-07-24 | $7700.00 | Window Closed / Lapsed |