US5903052A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Structure for semiconductor package for improving the efficiency of spreading heat
Assignee: Industrial Technology Research Institute
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Filing: 1998-05-12
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Granted: 1999-05-11
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Expires: 2018-05-12
Abstract
Abstract The present invention includes a substrate having a first opening. A heat spreader is attached on the bottom surface of the substrate. The bottom side surface of the heat spreader has trench pattern. The trench pattern includes a plurality of connecting cavities and a plurality of trenches. The chip is mounted on the top side surface of the heat spreader. A supporting member is formed on the top side surface of the substrate. The space among the substrate, the chip, the heat spreader and the supporting member is encapsulated by encapsulating material. The preformed solder balls are mounted on the bottom side surface of the substrate.
Inventors
- 👤 Lung-Tai Chen
- 👤 Ping-Huang Chiang
- 👤 Yu-Kon Chou
- 👤 Chien-Chi Chao
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 21:02
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H10W90/00; H10W90/701; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0364; H05K2201/0373; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10734; H05K2201/10954; H05K2201/10969; H05K2203/00; H05K2203/11; H05K2203/1178; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/751; H10W90/754; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
119 words
A structure of a semiconductor package, said structure comprising: a substrate having a conductive trace and a dielectric tape, wherein a first opening is formed in said substrate, and a plurality of second openings are formed in said dielectric tape; a heat spreader attached to said dielectric tape; a chip located in said first opening and attached to said heat spreader; signal transferring means for connecting said conductive trace and said chip; a dielectric supporting member adhered to said conductive trace; encapsulating material filling a space between said substrate, said chip, said heat spreader and said dielectric supporting member; and a plurality of bumps corresponding to said second openings of said dielectric tape, and connected to said conductive trace.
Claim 2
Dependent Claim
119 words
A structure of a semiconductor package, said structure comprising: a substrate having a conductive trace and a dielectric tape, wherein a first opening is formed in said substrate, and a plurality of second openings are formed in said dielectric tape; a heat spreader attached to said dielectric tape; a chip located in said first opening and attached to said heat spreader; signal transferring means for connecting said conductive trace and said chip; a dielectric supporting member adhered to said conductive trace; encapsulating material filling a space between said substrate, said chip, said heat spreader and said dielectric supporting member; and a plurality of bumps corresponding to said second openings of said dielectric tape, and connected to said conductive trace.
Claim 3
Dependent Claim
63 words
The structure of claim 1, wherein said heat spreader has connecting cavities and trenches formed on a bottom surface of said heat spreader, said trenches being used for exhausting gas generated during SMT process, said connecting cavities being used to firmly connect said package to a printed circuit board (PCB), said chip being mounted on said heat spreader and in said first opening.
Claim 4
Dependent Claim
15 words
The structure of claim 1, wherein said dielectric supporting member is formed of isolation material.
Claim 5
Dependent Claim
20 words
The structure of claim 1, wherein said dielectric supporting member is formed of metal with an isolation layer formed thereon.
Claim 6
Dependent Claim
18 words
The structure of claim 1, further comprising conductive pads formed in said substrate aligned to said second openings.
Claim 7
Dependent Claim
24 words
The structure of claim 1, wherein a scale of said conductive pads is larger than a scale of a diameter of said second opening.
Claim 8
Dependent Claim
32 words
The structure of claim 2, wherein said connecting cavities are respectively formed on said heat spreader, a portion of said trenches leading to edges of said heat spreader from said connecting cavities.
Claim 9
Dependent Claim
20 words
The structure of claim 7, wherein a further portion of said trenches being connecting between said plurality of connecting cavities.
Claim 10
Dependent Claim
128 words
A structure of a semiconductor package, said structure comprising: A substrate having a conductive trace and a dielectric tape, wherein a first opening is formed in said substrate, and a plurality of second openings are formed in said dielectric tape; a heat spreader attached to said dielectric tape, wherein said heat spreader has a trench pattern formed thereon; a chip located in said first opening and attached to said heat spreader; signal transferring means for connecting said conductive trace and said chip; a dielectric supporting member adhered to said conductive trace; encapsulating material filling a space between said substrate, said chip, said heat spreader and said dielectric supporting member; and a plurality of bumps corresponding to said second openings of said dielectric tape, and connected said conductive trace.
Claim 11
Dependent Claim
128 words
A structure of a semiconductor package, said structure comprising: A substrate having a conductive trace and a dielectric tape, wherein a first opening is formed in said substrate, and a plurality of second openings are formed in said dielectric tape; a heat spreader attached to said dielectric tape, wherein said heat spreader has a trench pattern formed thereon; a chip located in said first opening and attached to said heat spreader; signal transferring means for connecting said conductive trace and said chip; a dielectric supporting member adhered to said conductive trace; encapsulating material filling a space between said substrate, said chip, said heat spreader and said dielectric supporting member; and a plurality of bumps corresponding to said second openings of said dielectric tape, and connected said conductive trace.
Claim 12
Dependent Claim
66 words
The structure of claim 9, wherein said trench pattern includes connecting cavities and trenches, said trenches being formed on a bottom surface of said heat spreader, said trenches being used for exhausting gas generated during SMT process, said connecting cavities being used to firmly connect said package to a printed circuit board (PCB), said chip being mounted on said heat spreader and in said first opening.
Claim 13
Dependent Claim
15 words
The structure of claim 9, wherein said dielectric supporting member is formed of isolation material.
Claim 14
Dependent Claim
20 words
The structure of claim 9, wherein said dielectric supporting member is formed of metal with an isolation layer formed thereon.
Claim 15
Dependent Claim
18 words
The structure of claim 9, further comprising conductive pads formed in said substrate aligned to said second openings.
Claim 16
Dependent Claim
24 words
The structure of claim 9, wherein a scale of said conductive pads is larger than a scale of a diameter of said second opening.
Claim 17
Dependent Claim
32 words
The structure of claim 10, wherein said connecting cavities are respectively formed on said heat spreader, a portion of said trenches leading to edges of said heat spreader from said connecting cavities.
Claim 18
Dependent Claim
20 words
The structure of claim 15, wherein a further portion of said trenches being connecting between said plurality of connecting cavities.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-05-10 | 2002-11-09 | 2003-05-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-05-10 | 2006-11-09 | 2007-05-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-05-10 | 2010-11-09 | 2011-05-11 | $7700.00 | Window Closed / Lapsed |