Solder-ball connected semiconductor device with a recessed chip mounting area

Claim 1

A semiconductor device comprising: a constant-thickness, strip metal, thermally conductive support substrate having a recessed portion serving as a chip mounting area and a peripheral flat portion surrounding the recessed portion, said peripheral and recessed portions both having front and back surfaces, the recessed portion front surface being recessed in relation to the peripheral flat portion front surface, while the recessed portion back surface is raised in relation to the peripheral portion back surface; a semiconductor chip fixed to the recessed portion of the support substrate with the use of an adhesive; a TAB substrate formed of an insulating tape having one and the other opposed surfaces, said TAB substrate carrying on the one surface, multiple conductor patterns electrically connected to the semiconductor chip, the other surface of the insulating tape being fixed on the peripheral flat portion of the support substrate over a continuous area of the TAB substrate surface opposing the multiple conductor patterns; an insulating film covering the conductor patterns and being formed with contact holes extending through the insulating film in the vicinity of the conductor patterns; and multiple solder balls, each connected to a corresponding one of the conductor patterns via a corresponding one of the contact holes formed in the insulating film and each projecting beyond the insulating film, said peripheral flat portion of said substrate overlying said solder balls; wherein wiring holes are formed in the metal plate substrate and the insulating tape in such a way that a wire bonding area of each conductor pattern is exposed; and the semiconductor chip is connected to the conductor patterns by means of wire bonding via the wiring holes.