Patent US6486557B1 successfully refreshed from Google Patents.
US6486557B1
Expired / Lapsed
US
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Hybrid dielectric structure for improving the stiffness of back end of the line structures
Assignee: International Business Machines Corp
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Filing: 2000-02-29
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Granted: 2002-11-26
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Expires: 2020-02-29
Abstract
Abstract A multi-level, coplanar copper damascene interconnect structure on an integrated circuit chip includes a first planar interconnect layer on an integrated circuit substrate and having plural line conductors separated by a dielectric material having a relatively low dielectric constant and a relatively low elastic modulus. A second planar interconnect layer on the first planar interconnect layer comprises a dielectric film having an elastic modulus higher than in the first planar interconnect layer and conductive vias therethrough. The vias are selectively in contact with the line conductors. A third planar interconnect layer on the second planar interconnect layer has plural line conductors separated by the dielectric material and selectively in contact with the vias.
Inventors
- 👤 Charles R. Davis
- 👤 Daniel Charles Edelstein
- 👤 John C. Hay
- 👤 Jeffrey C. Hedrick
- 👤 Christopher Jahnes
- 👤 Vincent McGahay
- 👤 Henry A. Nye, III
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 12:56
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/40; H10W; H10W20/00; H10W20/01; H10W20/071; H10W20/081; H10W20/084; H10W20/085; H10W20/40; H10W20/41; H10W20/44; H10W20/4403; H10W20/4421; H10W20/45; H10W20/48; H10W20/495
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
133 words
A multi-level, coplanar interconnect structure on an integrated circuit chip, comprising: a planar line layer having plural interconnect conductors, all separated by a dielectric material having a relatively low dielectric constant and a relatively low elastic modulus; and a planar via layer comprising a dielectric film having an elastic modulus higher than in the line layer and conductive vias therethrough, wherein one of the line and via layer is on an integrated circuit substrate and defines a first layer having an upper horizontal planar surface and another of the line and via layer has a lower horizontal planar surface on the first layer upper horizontal planar surface so that the vias are selectively in contact with the line layer conductors and all interfaces between the dielectric material and the dielectric film are horizontal.
Claim 2
Dependent Claim
133 words
A multi-level, coplanar interconnect structure on an integrated circuit chip, comprising: a planar line layer having plural interconnect conductors, all separated by a dielectric material having a relatively low dielectric constant and a relatively low elastic modulus; and a planar via layer comprising a dielectric film having an elastic modulus higher than in the line layer and conductive vias therethrough, wherein one of the line and via layer is on an integrated circuit substrate and defines a first layer having an upper horizontal planar surface and another of the line and via layer has a lower horizontal planar surface on the first layer upper horizontal planar surface so that the vias are selectively in contact with the line layer conductors and all interfaces between the dielectric material and the dielectric film are horizontal.
Claim 3
Dependent Claim
18 words
The multi-level, coplanar interconnect structure of claim 1 wherein the dielectric film has a relatively low dielectric constant.
Claim 4
Dependent Claim
20 words
The multi-level, coplanar interconnect structure of claim 1 wherein the dielectric material has a dielectric constant less than about 3.0.
Claim 5
Dependent Claim
17 words
The multi-level, coplanar interconnect structure of claim 1 wherein the dielectric material comprises a polyarylene ether material.
Claim 6
Dependent Claim
16 words
The multi-level, coplanar interconnect structure of claim 1 wherein the dielectric material comprises an organic material.
Claim 7
Dependent Claim
17 words
The multi-level, coplanar interconnect structure of claim 1 wherein the dielectric film comprises an inorganic thin film.
Claim 8
Dependent Claim
14 words
The multi-level, coplanar interconnect structure of claim 1 wherein the dielectric comprises SiCOH film.
Claim 9
Dependent Claim
124 words
A multi-level, coplanar interconnect structure on an integrated circuit chip, comprising: a planar line layer having plural interconnect conductors all separated by a dielectric material having a relatively low dielectric constant; and a planar via layer comprising an inorganic dielectric film having a relatively low dielectric constant and conductive vias therethrough, wherein one of the line and via layer is on an integrated circuit substrate and defines a first layer having an upper horizontal planar surface and another of the line and via layer has a lower horizontal planar surface on the first layer upper horizontal planar surface so that the vias are selectively in contact with the line layer conductors and all interfaces between the dielectric material and the dielectric film are horizontal.
Claim 10
Dependent Claim
124 words
A multi-level, coplanar interconnect structure on an integrated circuit chip, comprising: a planar line layer having plural interconnect conductors all separated by a dielectric material having a relatively low dielectric constant; and a planar via layer comprising an inorganic dielectric film having a relatively low dielectric constant and conductive vias therethrough, wherein one of the line and via layer is on an integrated circuit substrate and defines a first layer having an upper horizontal planar surface and another of the line and via layer has a lower horizontal planar surface on the first layer upper horizontal planar surface so that the vias are selectively in contact with the line layer conductors and all interfaces between the dielectric material and the dielectric film are horizontal.
Claim 11
Dependent Claim
21 words
The multi-level, coplanar interconnect structure of claim 8 wherein the dielectric material has a lower elastic modulus than the dielectric film.
Claim 12
Dependent Claim
25 words
The multi-level, coplanar interconnect structure of claim 8 wherein the dielectric material and the dielectric film each have a dielectric constant less than about 3.0.
Claim 13
Dependent Claim
20 words
The multi-level, coplanar interconnect structure of claim 9 wherein the dielectric material has an elastic module less than 20 GPa.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-11-25 | 2006-05-27 | 2006-11-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-11-25 | 2010-05-27 | 2010-11-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-11-25 | 2014-05-27 | 2014-11-26 | $7700.00 | Window Closed / Lapsed |