US6437591B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Test interconnect for bumped semiconductor components and method of fabrication
Assignee: Micron Technology Inc
•
Filing: 1999-03-25
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Granted: 2002-08-20
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Expires: 2019-03-25
Abstract
Abstract An interconnect for testing semiconductor components includes a substrate, and contacts on the substrate for making temporary electrical connections with bumped contacts on the components. Each contact includes a recess and a support member over the recess configured to electrically engage a bumped contact. The support member is suspended over the recess on spiral leads formed on a surface of the substrate. The spiral leads allow the support member to move in a z-direction within the recess to accommodate variations in the height and planarity of the bumped contacts. In addition, the spiral leads twist the support member relative to the bumped contact to facilitate penetration of oxide layers thereon. The spiral leads can be formed by attaching a polymer substrate with the leads thereon to the substrate, or by forming a patterned metal layer on the substrate. In an alternate embodiment contact, the support member is suspended over the surface of the substrate on raised spring segment leads.
Inventors
- 👤 Warren M. Farnworth
- 👤 Salman Akram
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:34
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/04; G01R1/0408; G01R1/0433; G01R1/0441; G01R1/0466; G01R1/06; G01R1/067; G01R1/06711; G01R1/06733; G01R1/06738; G01R3/00; G01R1/073; G01R1/07307; G01R1/07314; G01R1/07364; G01R1/07378; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/325; H05K3/326; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49155; Y10T29/49156; Y10T29/49165
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
100 words
An interconnect for testing a semiconductor component having a bumped contact comprising: a substrate comprising a recess; and a contact on the substrate configured to make a temporary electrical connection with the bumped contact, the contact comprising a support member configured to support the bumped contact for movement into the recess and having an edge configured to penetrate the bumped contact, and a plurality of leads on the substrate attached to the support member, the leads configured to twist the support member relative to the bumped contact during movement into the recess such that the edge penetrates the bumped contact.
Claim 2
Dependent Claim
100 words
An interconnect for testing a semiconductor component having a bumped contact comprising: a substrate comprising a recess; and a contact on the substrate configured to make a temporary electrical connection with the bumped contact, the contact comprising a support member configured to support the bumped contact for movement into the recess and having an edge configured to penetrate the bumped contact, and a plurality of leads on the substrate attached to the support member, the leads configured to twist the support member relative to the bumped contact during movement into the recess such that the edge penetrates the bumped contact.
Claim 3
Dependent Claim
23 words
The interconnect of claim 1 wherein the contact has an axis and the leads are arranged in a spiral relative to the axis.
Claim 4
Dependent Claim
15 words
The interconnect of claim 1 wherein the leads are configured for extension into the recess.
Claim 5
Dependent Claim
23 words
The interconnect of claim 1 wherein the support member has an opening therein configured to retain the bumped contact and forming the edge.
Claim 6
Dependent Claim
19 words
The interconnect of claim 1 wherein the support member comprises at least one projection for penetrating the bumped contact.
Claim 7
Dependent Claim
143 words
An interconnect for testing a semiconductor component having a bumped contact comprising: a substrate comprising a recess and a plurality of conductors; a polymer film attached to the substrate; and a contact on the substrate configured to make a temporary electrical connection with the bumped contact, the contact comprising a support member proximate the recess configured to support the bumped contact for movement into the recess, and a plurality of leads on the polymer film in electrical communication with the conductors and attached to the support member, the support member having an opening configured to retain the bumped contact with a peripheral edge configured to penetrate the bumped contact, the support member and the leads configured to move within the recess and to rotate the opening and the edge relative to the bumped contact during movement into the recess. contacting the bumped contact.
Claim 8
Dependent Claim
143 words
An interconnect for testing a semiconductor component having a bumped contact comprising: a substrate comprising a recess and a plurality of conductors; a polymer film attached to the substrate; and a contact on the substrate configured to make a temporary electrical connection with the bumped contact, the contact comprising a support member proximate the recess configured to support the bumped contact for movement into the recess, and a plurality of leads on the polymer film in electrical communication with the conductors and attached to the support member, the support member having an opening configured to retain the bumped contact with a peripheral edge configured to penetrate the bumped contact, the support member and the leads configured to move within the recess and to rotate the opening and the edge relative to the bumped contact during movement into the recess. contacting the bumped contact.
Claim 9
Dependent Claim
21 words
The interconnect of claim 6 further comprising a conductive adhesive layer on the substrate electrically connecting the leads to the conductors.
Claim 10
Dependent Claim
21 words
The interconnect of claim 6 further comprising a plurality of conductive vias in the substrate in electrical communication with the conductors.
Claim 11
Dependent Claim
19 words
The interconnect of claim 6 wherein the support member comprises a non-bonding outer surface for contacting the bumped contact.
Claim 12
Dependent Claim
131 words
An interconnect for testing a semiconductor component having a bumped contact comprising: a substrate comprising a recess and a plurality of conductors; a polymer film attached to the substrate having an opening therein aligned with the recess; and a contact configured to make a temporary electrical connection with the bumped contact, the contact comprising a plurality of leads on the polymer film in electrical communication with the conductors, and a support member attached to the leads and suspended proximate the recess, the support member located proximate the opening and configured to move into the recess while supporting the bumped contact, the support member having an edge and the leads configured to exert a torque on the support member during movement into the recess such that the edge penetrates the bumped contact.
Claim 13
Dependent Claim
131 words
An interconnect for testing a semiconductor component having a bumped contact comprising: a substrate comprising a recess and a plurality of conductors; a polymer film attached to the substrate having an opening therein aligned with the recess; and a contact configured to make a temporary electrical connection with the bumped contact, the contact comprising a plurality of leads on the polymer film in electrical communication with the conductors, and a support member attached to the leads and suspended proximate the recess, the support member located proximate the opening and configured to move into the recess while supporting the bumped contact, the support member having an edge and the leads configured to exert a torque on the support member during movement into the recess such that the edge penetrates the bumped contact.
Claim 14
Dependent Claim
20 words
The interconnect of claim 10 further comprising a conductive polymer on the substrate electrically connecting the leads and the conductors.
Claim 15
Dependent Claim
23 words
The interconnect of claim 10 wherein the support member has a second opening configured to retain the bumped contact and forming the edge.
Claim 16
Dependent Claim
17 words
The interconnect of claim 10 wherein the support member comprises a projection for penetrating the bumped contact.
Claim 17
Dependent Claim
20 words
The interconnect of claim 10 wherein the substrate comprises a plurality of conductive vias in electrical communication with the conductors.
Claim 18
Dependent Claim
12 words
The interconnect of claim 14 wherein the leads have a serpentine configuration.
Claim 19
Dependent Claim
118 words
An interconnect for testing a semiconductor component having a bumped contact comprising: a substrate; and a contact on the substrate configured to make a temporary electrical connection with the bumped contact and having an axis, the contact comprising: a recess in the substrate; a plurality of leads on the substrate cantilevered on the recess and having a generally spiral configuration with respect to the axis of the contact; and a support member attached to the leads and having an edge, the support member configured to support the bumped contact for movement within the recess under an external biasing force, and to twist about the axis during movement into the recess such that the edge penetrates the bumped contact.
Claim 20
Dependent Claim
118 words
An interconnect for testing a semiconductor component having a bumped contact comprising: a substrate; and a contact on the substrate configured to make a temporary electrical connection with the bumped contact and having an axis, the contact comprising: a recess in the substrate; a plurality of leads on the substrate cantilevered on the recess and having a generally spiral configuration with respect to the axis of the contact; and a support member attached to the leads and having an edge, the support member configured to support the bumped contact for movement within the recess under an external biasing force, and to twist about the axis during movement into the recess such that the edge penetrates the bumped contact.
Claim 21
Dependent Claim
27 words
The interconnect of claim 16 wherein the support member has an opening therein configured to retain the bumped contact and the edge is formed by the opening.
Claim 22
Dependent Claim
19 words
The interconnect of claim 16 wherein the support member comprises a projection for retaining and penetrating the bumped contact.
Claim 23
Dependent Claim
18 words
The interconnect of claim 16 wherein the leads are contained on a polymer film attached to the substrate.
Claim 24
Dependent Claim
31 words
The interconnect of claim 16 wherein the substrate comprises a plurality of conductors in electrical communication with the leads and a plurality of conductive vias in electrical communication with the conductors.
Claim 25
Dependent Claim
12 words
The interconnect of claim 16 wherein the leads have an extensible configuration.
Claim 26
Dependent Claim
16 words
The interconnect of claim 16 wherein the support member comprises a non-bonding conductive polymer outer layer.
Claim 27
Dependent Claim
23 words
The interconnect of claim 16 wherein the support member comprises a material selected from the group consisting of Ti, TiSi 2 and Al.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-08-19 | 2006-02-18 | 2006-08-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-08-19 | 2010-02-18 | 2010-08-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-08-19 | 2014-02-18 | 2014-08-20 | $7700.00 | Window Closed / Lapsed |