CSP BGA test socket with insert and method

Claim 2

A test socket for a semiconductor die using a ball grid array interface comprising: a base; at least one die retaining mechanism operably associated with said base, the at least one die retaining mechanism including at least one die retaining element; at least one biasing element coupled between the at least one die retaining mechanism and the base to effect engagement and disengagement of the at least one die retaining element with the semiconductor die; and a die contact insert moveably secured to said base, the die contact insert comprising: a substrate; a plurality of wells formed in a top surface of the substrate; a conductive lining on a portion of each well; and a conductive element extending from said conductive lining on a portion of each well, each conductive element being configured to be operatively coupled with external circuitry.

Claim 3

The test socket of claim 1 , further comprising a die contact insert support in contact with the die contact insert, the die contact insert support being operatively associated with but independent of said base.

Claim 4

The test socket of claim 2 , wherein the die contact insert support comprises a plate urged upward by at least one spring.

Claim 5

The test socket of claim 1 , wherein at least a portion of the plurality of wells each have a trapezoidal cross-section.

Claim 6

The test socket of claim 1 , wherein the plurality of wells is patterned and dimensioned to receive and contact an array of balls from a chip scale packaged semiconductor die.

Claim 7

The test socket of claim 1 , wherein the die contact insert is removable.

Claim 8

The test socket of claim 1 , wherein the at least one die retaining element comprises two retention tongs configured to retain the semiconductor die by an edge thereof.

Claim 9

A test socket for a chip scale packaged semiconductor die using a ball grid array interface comprising: a vertical compression socket comprising a base and a retaining element activating frame wherein the retaining element activating frame operates such that vertical pressure upon the retaining element activating frame causes at least one retaining element within the vertical compression socket to move to an open position, and release of such vertical pressure causes the at least one retaining element to move to a closed position; a die contact insert support disposed within said vertical compression socket comprising an electrically insulating plate supported and urged upward by at least one biasing member; and a removable die contact insert disposed upon said die contact insert support comprising: a semiconductor substrate; a plurality of wells formed in a top surface of the semiconductor substrate wherein the wells are dimensioned to receive an array of balls from a chip scale packaged die; a conductive lining in each well; and a conductive element extending from the conductive lining, each conductive element being configured for electrical communication with external circuitry.

Claim 10

A test socket for a chip scale packaged semiconductor die using a ball grid array interface comprising: a vertical compression socket comprising a base and a retaining element activating frame wherein the retaining element activating frame operates such that vertical pressure upon the retaining element activating frame causes at least one retaining element within the vertical compression socket to move to an open position, and release of such vertical pressure causes the at least one retaining element to move to a closed position; a die contact insert support disposed within said vertical compression socket comprising an electrically insulating plate supported and urged upward by at least one biasing member; and a removable die contact insert disposed upon said die contact insert support comprising: a semiconductor substrate; a plurality of wells formed in a top surface of the semiconductor substrate wherein the wells are dimensioned to receive an array of balls from a chip scale packaged die; a conductive lining in each well; and a conductive element extending from the conductive lining, each conductive element being configured for electrical communication with external circuitry.

Claim 11

The test socket of claim 8 , wherein the at least one biasing member includes a spring.

Claim 12

The test socket of claim 8 , wherein the at least one retaining element includes at least one tong configured and oriented to retain the semiconductor die by an edge thereof.

Claim 13

The test socket of claim 8 , wherein the at least one retaining element comprises two tongs.