US6356098B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Probe card, test method and test system for semiconductor wafers
Assignee: Micron Technology Inc
•
Filing: 1999-09-10
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Granted: 2002-03-12
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Expires: 2019-09-10
Abstract
Abstract A probe card for testing a semiconductor wafer, a test method, and a test system employing the probe card are provided. The probe card includes: a substrate; patterns of pin contacts slidably mounted to the substrate; and a force applying member for biasing the pin contacts into electrical contact with die contacts on the wafer. In an illustrative embodiment the force applying member includes spring loaded electrical connectors in physical and electrical contact with the pin contacts. Alternately, the force applying member includes a compressible pad for multiple pin contacts, or separate compressible pads for each pin contact. A penetration depth of the pin contacts into the die contacts is controlled by selecting a spring force of the force applying member, and an amount of Z-direction overdrive of the pin contacts into the die contacts.
Inventors
- 👤 Salman Akram
- 👤 C. Patrick Doherty
- 👤 Warren M. Farnworth
- 👤 David R. Hembree
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:29
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/28; G01R31/2851; G01R31/2886; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/073; G01R1/07307; G01R1/07364; G01R1/07378
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
136 words
A method for testing a semiconductor wafer having a plurality of contacts comprising: providing a probe card comprising a substrate having a plurality of openings, a plurality of electrically conductive pins slidably mounted in the openings for movement in a Z direction, and a force applying member configured to bias the pins against the contacts with a biasing force; aligning the contacts with the pins by moving the wafer or the probe card in a X direction and a Y direction; moving the wafer or the probe card in the Z-direction to place the contacts and the pins in physical contact; overdriving the wafer or the probe card in the Z-direction by a selected distance so that the pins penetrate the contacts with the biasing force; and applying test signals through the pins to the contacts.
Claim 2
Independent Claim
136 words
A method for testing a semiconductor wafer having a plurality of contacts comprising: providing a probe card comprising a substrate having a plurality of openings, a plurality of electrically conductive pins slidably mounted in the openings for movement in a Z direction, and a force applying member configured to bias the pins against the contacts with a biasing force; aligning the contacts with the pins by moving the wafer or the probe card in a X direction and a Y direction; moving the wafer or the probe card in the Z-direction to place the contacts and the pins in physical contact; overdriving the wafer or the probe card in the Z-direction by a selected distance so that the pins penetrate the contacts with the biasing force; and applying test signals through the pins to the contacts.
Claim 3
Dependent Claim
25 words
The method of claim 1 further comprising selecting a spring constant of the force applying member and the selected distance to provide the biasing force.
Claim 4
Dependent Claim
26 words
The method of claim 1 wherein the force applying member comprises a plurality of spring loaded electrical connectors in physical and electrical contact with the pins.
Claim 5
Dependent Claim
20 words
The method of claim 1 wherein the force applying member comprises a separate compressible pad in contact with each pin.
Claim 6
Dependent Claim
19 words
The method of claim 1 wherein the force applying member comprises a compressible pad in contact with the pins.
Claim 7
Independent Claim
163 words
A method for testing a semiconductor wafer having a plurality of contacts comprising: providing a probe card comprising a substrate having a plurality of openings and a plurality of electrically conductive pins slidably mounted in the openings configured to electrically engage the contacts; attaching a flex circuit to the probe card having a first set of contacts in electrical communication with the pins and a second set of contacts having a pitch P 1 greater than a pitch P 2 of the pins; providing a plurality of electrical connectors in electrical communication with a test circuitry; electrically engaging the second set of contacts with the electrical connectors; placing the flex circuit in contact with a compressible pad configured to bias the pins against the contacts with a biasing force; controlling the biasing force by overdriving the pins into the contacts by a selected distance; and applying test signals from the test circuitry through the electrical connectors and through the pins to the contacts.
Claim 8
Independent Claim
163 words
A method for testing a semiconductor wafer having a plurality of contacts comprising: providing a probe card comprising a substrate having a plurality of openings and a plurality of electrically conductive pins slidably mounted in the openings configured to electrically engage the contacts; attaching a flex circuit to the probe card having a first set of contacts in electrical communication with the pins and a second set of contacts having a pitch P 1 greater than a pitch P 2 of the pins; providing a plurality of electrical connectors in electrical communication with a test circuitry; electrically engaging the second set of contacts with the electrical connectors; placing the flex circuit in contact with a compressible pad configured to bias the pins against the contacts with a biasing force; controlling the biasing force by overdriving the pins into the contacts by a selected distance; and applying test signals from the test circuitry through the electrical connectors and through the pins to the contacts.
Claim 9
Dependent Claim
16 words
The method of claim 6 wherein each pin comprises a pointed tip and an enlarged head.
Claim 10
Independent Claim
132 words
A method for testing a semiconductor wafer having a plurality of contacts comprising: providing a probe card comprising a substrate having a plurality of openings, and a plurality of electrically conductive pins slidably mounted in the openings configured to electrically engage the contacts on the wafer; providing a plurality of compressible members in the openings in contact with the pins and configured to bias the pins against the contacts with a biasing force; aligning the contacts with the pins by moving the wafer or the probe card; moving the wafer or the probe card to place the contacts and the pins in physical contact; overdriving the wafer or the probe card by a selected distance so that the pins penetrate the contacts; and applying test signals through the pins to the contacts.
Claim 11
Independent Claim
132 words
A method for testing a semiconductor wafer having a plurality of contacts comprising: providing a probe card comprising a substrate having a plurality of openings, and a plurality of electrically conductive pins slidably mounted in the openings configured to electrically engage the contacts on the wafer; providing a plurality of compressible members in the openings in contact with the pins and configured to bias the pins against the contacts with a biasing force; aligning the contacts with the pins by moving the wafer or the probe card; moving the wafer or the probe card to place the contacts and the pins in physical contact; overdriving the wafer or the probe card by a selected distance so that the pins penetrate the contacts; and applying test signals through the pins to the contacts.
Claim 12
Dependent Claim
13 words
The method of claim 8 wherein the compressible members comprise a conductive elastomer.
Claim 13
Dependent Claim
17 words
The method of claim 8 wherein each opening comprises a contact in electrical communication with a pin.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-03-11 | 2005-09-10 | 2006-03-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-03-11 | 2009-09-10 | 2010-03-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-03-11 | 2013-09-10 | 2014-03-12 | $7700.00 | Window Closed / Lapsed |