US5982183A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Probing method and device with contact film wiper feature
Assignee: Tokyo Electron Ltd
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Filing: 1996-05-30
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Granted: 1999-11-09
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Expires: 2016-05-30
Abstract
Abstract A probing device for inspecting semiconductor devices such as IC chips comprises a mounting section for supporting a silicon substrate wafer (i.e., an object to be inspected), a moving section for moving a probe card in such a way that contacts formed on a surface of the probe card can be pushed against electrode pads formed on the wafer, and a measuring section. The probe card is formed by joining a silicon nitride (Si 3 N 4 ) thin film (whose thermal expansion coefficient is roughly equal to that of the silicon wafer) to a lower surface of a wiring substrate. The wiring substrate is composed of a polyamide thin film (as an insulating layer) and conductive layers (as conductive signal line paths) formed in and on both the surfaces of the polyamide this film. Further, bumps (contacts) are arranged on the lower surface of the silicon nitride thin film. A plurality of through holes are formed penetrating from the upper surface of the wiring substrate to the lower surface of the silicon nitride film at an area outside the bump arrangement region. These through holes mechanically connect the silicon nitride thin film to the wiring substrate and further electrically connect the bumps to the circumferential portion of the probe card body via the conductive layers. Since the thermal expansion coefficient of the silicon wafer is roughly equal to that of the silicon nitride thin film of the probe card, even when the silicon wafer is heated or cooled for electrical measurements, it is possible to securely keep contact between the contacts (bumps) of the probe card and the electrode pads formed on the IC chips of the wafer without dislocation.
Inventors
- 👤 Kunio Sano
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:46
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/28; G01R31/2851; G01R31/2886; G01R31/2887; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/073; G01R1/07307; G01R1/0735; G01R1/06705; G01R1/07364; G01R1/07371; G01R31/2889; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
221 words
A probing device for a wafer burn-in test comprising: object mounting means for supporting a semiconductor wafer to be inspected, having a substrate with electrode pads; measuring means; a probe card having contacts electrically connected to said measuring means and arranged so as to face said wafer, said contacts being formed on a surface of the substrate facing said wafer; and means for moving said probe card and said wafer closer together and into contact so that the contacts of said probe card can be brought into contact with the electrode pads of said wafer mounted on said mounting means and wherein said means for moving said probe card and said wafer closer together causes parallel movement between said probe card and said wafer following contact so as to create a rubbing effect; said means for moving said probe card and wafer closer together includes: support means movable relative to said object mounting means, a moveable plate for supporting said probe card thereon, said moveable plate having a surface facing said object mounting means, and link arms linking said movable plate to said support means so that said movable plate is swingable relative to said support means for movement both further toward and in parallel to the wafer on the object mounting means following contact between said probe card and wafer.
Claim 2
Dependent Claim
221 words
A probing device for a wafer burn-in test comprising: object mounting means for supporting a semiconductor wafer to be inspected, having a substrate with electrode pads; measuring means; a probe card having contacts electrically connected to said measuring means and arranged so as to face said wafer, said contacts being formed on a surface of the substrate facing said wafer; and means for moving said probe card and said wafer closer together and into contact so that the contacts of said probe card can be brought into contact with the electrode pads of said wafer mounted on said mounting means and wherein said means for moving said probe card and said wafer closer together causes parallel movement between said probe card and said wafer following contact so as to create a rubbing effect; said means for moving said probe card and wafer closer together includes: support means movable relative to said object mounting means, a moveable plate for supporting said probe card thereon, said moveable plate having a surface facing said object mounting means, and link arms linking said movable plate to said support means so that said movable plate is swingable relative to said support means for movement both further toward and in parallel to the wafer on the object mounting means following contact between said probe card and wafer.
Claim 3
Dependent Claim
19 words
A probing device as recited in claim 1 further comprising: means for changing the temperature of wafers being inspected.
Claim 4
Dependent Claim
47 words
The probing device according to claim 1, further comprising: damping means interposed between said movable plate and said support means so that when the probe card is pushed against the wafer on the object mounting means, the damping means exerts a restoring force on the probe card.
Claim 5
Dependent Claim
39 words
The probing device according to claim 1, wherein said movable plate has slots through which flexible end portions of the probe card are passed to a side of said movable plate opposite said surface facing said object mounting means.
Claim 6
Dependent Claim
42 words
The probing device according to claim 1, wherein said support means comprises: a printed circuit board; and a reinforcing plate on a surface of said printed circuit board, facing said object mounting means, said link arms being pivoted to said reinforcing plate.
Claim 7
Dependent Claim
24 words
The probing device according to claim 5, wherein said flexible end portions of the probe card are electrically connected to said printed circuit board.
Claim 8
Dependent Claim
159 words
A probing device comprising: an object-to-be-tested mount; measuring means; a probe card having contacts electrically connected to said measuring means on a facing surface arranged to face a facing surface of an object mounted on said object-to-be-tested mount which object has electrode pads; means for varying the relative spacing between said object-to-be-tested mount and probe card for placing the contacts and electrical pads into contact during testing; and a probe card placement assembly which includes a reinforcing member and a probe card support assembly which supports said probe card and is pivotally attached to said reinforcing member such that said support assembly is free to shift parallel to the facing surface of the mounted object, said support assembly includes a pair of link arms and a shifting plate, with said link arms each having a first end pivotally connected at separate locations on said reinforcing plate and a second end pivotally connected at separate locations on said shifting plate.
Claim 9
Dependent Claim
159 words
A probing device comprising: an object-to-be-tested mount; measuring means; a probe card having contacts electrically connected to said measuring means on a facing surface arranged to face a facing surface of an object mounted on said object-to-be-tested mount which object has electrode pads; means for varying the relative spacing between said object-to-be-tested mount and probe card for placing the contacts and electrical pads into contact during testing; and a probe card placement assembly which includes a reinforcing member and a probe card support assembly which supports said probe card and is pivotally attached to said reinforcing member such that said support assembly is free to shift parallel to the facing surface of the mounted object, said support assembly includes a pair of link arms and a shifting plate, with said link arms each having a first end pivotally connected at separate locations on said reinforcing plate and a second end pivotally connected at separate locations on said shifting plate.
Claim 10
Dependent Claim
36 words
A probing device as recited in claim 7, wherein said probe card is connected to said shifting plate and said probing device further comprising a damping unit positioned between said reinforcing plate and said probe card.
Claim 11
Dependent Claim
31 words
A probing device as recited in claim 7 wherein said means for varying the relative spacing includes means for vertivally adjusting said reinforcing plate while said object-to-be tested mount is stationery.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-11-08 | 2003-05-10 | 2003-11-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-11-08 | 2007-05-10 | 2007-11-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-11-08 | 2011-05-10 | 2011-11-09 | $7700.00 | Window Closed / Lapsed |