US5541524A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Burn-in technologies for unpackaged integrated circuits
Assignee: nCHIP Inc
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Filing: 1993-09-23
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Granted: 1996-07-30
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Expires: 2013-09-23
Abstract
Abstract A device and method for burn-in of bare chips prior to assembly into a multichip module. Each die to be tested is positioned with its I/O pads positioned to face an interconnection burn-in test substrate which may be a silicon circuit board. Each die is temporarily electrically connected to the substrate by a deformable solder bump.
Inventors
- 👤 David B. Tuckerman
- 👤 Pradip D. Patel
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:22
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/28; G01R31/2851; G01R31/2855; G01R31/286; G01R31/2863; H; H10; H10W; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
101 words
A test apparatus for testing at least one integrated circuit having contact pads, the apparatus comprising: a test substrate including an interconnect layer including a heater resistor; means for coupling the test substrate to a source of test signals; and a plurality of electrically conductive non-rigid deformable bumps disposed between a region of the interconnect layer of said test substrates adjacent said resistor and individual contact pads of the at least one integrated circuit to provide electrical contact between the test substrate and at least one integrated circuit, whereby said heater resistor is capable of providing heat to a deformable bump.
Claim 2
Dependent Claim
101 words
A test apparatus for testing at least one integrated circuit having contact pads, the apparatus comprising: a test substrate including an interconnect layer including a heater resistor; means for coupling the test substrate to a source of test signals; and a plurality of electrically conductive non-rigid deformable bumps disposed between a region of the interconnect layer of said test substrates adjacent said resistor and individual contact pads of the at least one integrated circuit to provide electrical contact between the test substrate and at least one integrated circuit, whereby said heater resistor is capable of providing heat to a deformable bump.
Claim 3
Dependent Claim
28 words
The test apparatus of claim 1, wherein said test substrate further comprises: a conducting plane; and an insulating layer disposed between said interconnect layer and said conducting plane.
Claim 4
Dependent Claim
28 words
The test apparatus of claim 1, wherein said electrically conductive deformable bump has a melting point less than a maximum temperature at which said test substrate retains functionality.
Claim 5
Dependent Claim
23 words
The test apparatus of claim 1, further comprising a current limiting resistor coupled in series between said interconnect layer and a power supply.
Claim 6
Dependent Claim
15 words
The test apparatus of claim 4, wherein said power supply comprises a discrete metal layer.
Claim 7
Dependent Claim
24 words
The test apparatus of claim 1, further comprising a means for holding said at least one integrated circuit in contact with said deformable bumps.
Claim 8
Dependent Claim
56 words
The test apparatus of claim 6, wherein said means for holding further comprise a sealed pressure vessel including: (i) an interior chamber containing said at least one integrated circuit and said deformable bumps; and (ii) means for pressurizing said interior chamber, whereby said at least one integrated circuit is held in contact with said deformable bumps.
Claim 9
Dependent Claim
41 words
The test apparatus of claim 1, further comprising a temperature regulator including: (i) a heat sink attached to said substrate; (ii) a temperature measuring device mounted on said heat sink; and (iii) a control system coupled to said temperature measuring device.
Claim 10
Dependent Claim
47 words
The test apparatus of claim 1, wherein the test substrate further includes a plurality of bond pads and wherein a metallization layer provides a plurality of resistors connected in series wherein each of said plurality of bond pads is associated with one of said plurality of resistors.
Claim 11
Dependent Claim
25 words
The test apparatus of claim 1, wherein said means for coupling include at least one electrical feedthrough extending through said substrate to said interconnect layer.
Claim 12
Dependent Claim
22 words
A test apparatus according to claim 1 further comprising means for passing current through said heater resistor to reflow said deformable bump.
Claim 13
Independent Claim
88 words
A method for testing an integrated circuit comprising the steps of: forming a heater resistor on an interconnect layer of a test substrate; forming a deformable, electrically conductive bump on the interconnect layer of the test substrate in a region proximate to said heater resistor; placing a contact pad of the integrated circuit in removable contact with said deformable electrically conductive bump; supplying a plurality of test signals to said test substrate to exercise said integrated circuit; supplying electric current to said heater resistor to generate heat energy.
Claim 14
Independent Claim
88 words
A method for testing an integrated circuit comprising the steps of: forming a heater resistor on an interconnect layer of a test substrate; forming a deformable, electrically conductive bump on the interconnect layer of the test substrate in a region proximate to said heater resistor; placing a contact pad of the integrated circuit in removable contact with said deformable electrically conductive bump; supplying a plurality of test signals to said test substrate to exercise said integrated circuit; supplying electric current to said heater resistor to generate heat energy.
Claim 15
Dependent Claim
33 words
The method of claim 12, further comprising the step of actively controlling a temperature of said test substrate and said integrated circuit whereby a burn-in test may be conducted without a burn-in oven.
Claim 16
Dependent Claim
18 words
The method of claim 12, wherein said heat energy reflows said deformable bump to reform said deformable bump.
Claim 17
Dependent Claim
39 words
The method of claim 12, wherein said step of forming a heater resistor further comprises forming a plurality of resistors in series wherein each of said plurality of resistors is associated with a unique one of said deformable bumps.
Claim 18
Dependent Claim
38 words
The method of claim 12, further comprising the step of ablating a selected contact pad using a laser to prevent operation of a given integrated circuit during testing of a device wafer having a plurality of integrated circuits.
Claim 19
Dependent Claim
34 words
The method of claim 12, wherein said step of supplying a plurality of test signals further comprises the step of providing at least one electrical feedthrough extending through said substrate to said interconnect layer.
Claim 20
Independent Claim
133 words
A method for burning-in an integrated circuit comprising the steps of: forming a resistor on an interconnect layer of a test substrate; forming a deformable, electrically conductive bump on an interconnect layer of a test substrate and proximate to said resistor; placing a contact pad of the integrated circuit in removable contact with said deformable electrically conductive bump; supplying a plurality of test signals to said test substrate to exercise said integrated circuit; supplying current to said resistor after said integrated circuit has been tested, to generate heat energy for reflowing said deformable bump to form a new deformable bump; placing a contact pad of a second integrated circuit in contact with said new deformable bump; and supplying a plurality of test signals to said test substrate to exercise said second integrated circuit.
Claim 21
Independent Claim
133 words
A method for burning-in an integrated circuit comprising the steps of: forming a resistor on an interconnect layer of a test substrate; forming a deformable, electrically conductive bump on an interconnect layer of a test substrate and proximate to said resistor; placing a contact pad of the integrated circuit in removable contact with said deformable electrically conductive bump; supplying a plurality of test signals to said test substrate to exercise said integrated circuit; supplying current to said resistor after said integrated circuit has been tested, to generate heat energy for reflowing said deformable bump to form a new deformable bump; placing a contact pad of a second integrated circuit in contact with said new deformable bump; and supplying a plurality of test signals to said test substrate to exercise said second integrated circuit.
Claim 22
Dependent Claim
33 words
The method of claim 18, further comprising the step of actively controlling a temperature of said test substrate and said integrated circuit whereby a burn-in test may be conducted without a burn-in oven.
Claim 23
Dependent Claim
39 words
The method of claim 18, wherein said step of forming a resistor further comprises forming a plurality of resistors in series wherein each one of said plurality of resistors is associated with a unique one of said deformable bumps.
Claim 24
Dependent Claim
31 words
The method of claim 18, wherein said step of supplying test signals further comprises the step of providing at least one electrical feedthrough extending through said substrate to said interconnect layer.
Claim 25
Dependent Claim
126 words
A test apparatus for testing at least one integrated circuit having contact pads, the apparatus comprising: a test substrate including: (a) a base; (b) a conducting plane; (c) an interconnect layer including a resistor; (d) an insulating layer disposed between the interconnect layer and said conducting plane; means for coupling the test substrate to a source of test signals; and a plurality of electrically conductive non-rigid deformable bumps disposed between a region of the interconnect layer of said test substrate adjacent said resistor and individual contact pads of the at least one integrated circuit to provide electrical contact between the test substrate and at least one integrated circuit, whereby said resistor is capable of providing heat to at least one of said plurality of deformable bumps.
Claim 26
Dependent Claim
126 words
A test apparatus for testing at least one integrated circuit having contact pads, the apparatus comprising: a test substrate including: (a) a base; (b) a conducting plane; (c) an interconnect layer including a resistor; (d) an insulating layer disposed between the interconnect layer and said conducting plane; means for coupling the test substrate to a source of test signals; and a plurality of electrically conductive non-rigid deformable bumps disposed between a region of the interconnect layer of said test substrate adjacent said resistor and individual contact pads of the at least one integrated circuit to provide electrical contact between the test substrate and at least one integrated circuit, whereby said resistor is capable of providing heat to at least one of said plurality of deformable bumps.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-07-30 | 2000-01-29 | 2000-07-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-07-30 | 2004-01-29 | 2004-07-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-07-30 | 2008-01-29 | 2008-07-30 | $7700.00 | Window Closed / Lapsed |