US5309090A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for heating and controlling temperature in an integrated circuit chip
Assignee: Individual
•
Filing: 1990-09-06
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Granted: 1994-05-03
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Expires: 2010-09-06
Abstract
Abstract A method and an apparatus to heat an integrated circuit and regulate its temperature for the purposes of burn-in and temperature testing are provided. The circuit is heated internally by integrating a heating means. Sensing and controlling means may also be integrated. Such heating and controlling are activated by external signals applied to the IC. Practical means to heat the integrated circuit with pre-existing components is provided.
Inventors
- 👤 Robert J. Lipp
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 14:45
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/28; G01R31/2851; G01R31/2855; G01R31/2872; G01R31/2874; G01R31/2877; G01R31/2856; G01R31/2886; G01R31/2891
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
79 words
An apparatus for quality, reliability or diagnostic testing in an integrated circuit die, comprising: means for receiving one or more control signals; and a plurality of means for heating said integrated circuit die in response to said one or more control signals, wherein said plurality of means for heating are embedded in said integrated circuit, said plurality of means for heating encircling the interior of said integrated circuit die, such that said integrated circuit die is heated substantially evenly.
Claim 2
Independent Claim
79 words
An apparatus for quality, reliability or diagnostic testing in an integrated circuit die, comprising: means for receiving one or more control signals; and a plurality of means for heating said integrated circuit die in response to said one or more control signals, wherein said plurality of means for heating are embedded in said integrated circuit, said plurality of means for heating encircling the interior of said integrated circuit die, such that said integrated circuit die is heated substantially evenly.
Claim 3
Dependent Claim
17 words
An apparatus as in claim 1, further comprising means for sensing the temperature of said integrated circuit.
Claim 4
Dependent Claim
25 words
An apparatus as in claim 2, further comprising means for controlling said means for heating based on the temperature sensed by said means for sensing.
Claim 5
Dependent Claim
24 words
An apparatus as in claim 1, wherein said integrated circuit includes output buffers and said means for heating is formed by said output buffers.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-05-02 | 1997-11-01 | 1998-05-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-05-02 | 2001-11-01 | 2002-05-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-05-02 | 2005-11-01 | 2006-05-03 | $7700.00 | Window Closed / Lapsed |