US5124639A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Probe card apparatus having a heating element and process for using the same
Assignee: NXP USA Inc
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Filing: 1990-11-20
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Granted: 1992-06-23
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Expires: 2010-11-20
Abstract
Abstract A probe card apparatus is used to functionally test an integrated circuit wafer at elevated temperatures. In one form, a probe card having a cavity between first and second opposite sides is provided. Within the probe card cavity is a probe card ring which is used to support and position a plurality of probe leads. The plurality of probe leads are attached to the first side of the probe card and extend toward the cavity and are used to make electrical contact with an integrated circuit wafer. Radiant heat is provided in close proximity to the probe card ring for heating the plurality of probe leads to a predetermined temperature and for sustaining the predetermined temperature to accurately keep each probe lead at a predetermined location within the cavity.
Inventors
- 👤 Scott J. Carlin
- 👤 Samuel Roberts, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 21:15
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/28; G01R31/2851; G01R31/2855; G01R31/2872; G01R31/2874; G01R31/2877; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/073; G01R1/07307; G01R1/07342; G01R31/286; G01R31/2863; G01R31/2886
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
132 words
A process for functional test probing an integrated circuit wafer using a probe card apparatus, comprising the steps of: providing a probe card having a cavity between and through first and second opposite sides of the probe card and having a plurality of probe leads attached to predetermined positions of the first side of the probe card and extending toward the cavity for making electrical contact with the integrated circuit wafer; providing a probe card ring within a portion of the cavity to support and position the plurality of probe leads; and providing a heating element and positioning the heating element in contact with the probe card ring for heating the plurality of probe leads to a predetermined temperature to accurately keep each probe lead at a predetermined location within the cavity.
Claim 2
Dependent Claim
132 words
A process for functional test probing an integrated circuit wafer using a probe card apparatus, comprising the steps of: providing a probe card having a cavity between and through first and second opposite sides of the probe card and having a plurality of probe leads attached to predetermined positions of the first side of the probe card and extending toward the cavity for making electrical contact with the integrated circuit wafer; providing a probe card ring within a portion of the cavity to support and position the plurality of probe leads; and providing a heating element and positioning the heating element in contact with the probe card ring for heating the plurality of probe leads to a predetermined temperature to accurately keep each probe lead at a predetermined location within the cavity.
Claim 3
Dependent Claim
21 words
The process of claim 1 further comprising the step of substantially maintaining the predetermined temperature within a specified range of temperatures.
Claim 4
Dependent Claim
37 words
The process of claim 2 wherein the step of substantially maintaining the predetermined temperature further comprises placing a thermocouple in contact with a portion of the probe card ring to monitor temperature of the probe card ring.
Claim 5
Dependent Claim
38 words
The process of claim 1 wherein the step of providing a probe card ring further comprises providing a slotted ring of predetermined circumferential volume for receiving said heating element which conducts a direct current to provide radiant heat.
Claim 6
Dependent Claim
32 words
The process of claim 1 wherein the step of providing a probe card having a cavity comprises providing a probe card having a cavity substantially in a center of the probe card.
Claim 7
Dependent Claim
20 words
The process of claim 1 wherein the step of providing a probe card ring comprises providing an anodized aluminum ring.
Claim 8
Dependent Claim
39 words
The process of claim 1 wherein the step of positioning the heating element in contact with the probe card ring comprises providing said heating element adjacent the probe card ring for conducting a direct current to provide radiant heat.
Claim 9
Dependent Claim
43 words
The process of claim 7 wherein the step of positioning said heating element in contact with the probe card ring further comprises placing a thermocouple in contact with a portion of the probe card ring to monitor temperature of the probe card ring.
Claim 10
Dependent Claim
135 words
A probe card apparatus for functional test probing an integrated circuit wafer having a plurality of die, comprising: a probe card having a cavity between and through first and second opposite sides of the probe card and having a plurality of probe leads attached to predetermined positions of the first side of the probe card and extending toward the cavity for making electrical contact with the integrated circuit wafer; a probe card ring within a portion of the cavity to support and position the plurality of probe leads; and a heating element positioned within at least a portion of the cavity, or in contact with the probe card ring the heating element heating the plurality of probe leads to a predetermined temperature to accurately keep each probe lead at a predetermined location within the cavity.
Claim 11
Dependent Claim
135 words
A probe card apparatus for functional test probing an integrated circuit wafer having a plurality of die, comprising: a probe card having a cavity between and through first and second opposite sides of the probe card and having a plurality of probe leads attached to predetermined positions of the first side of the probe card and extending toward the cavity for making electrical contact with the integrated circuit wafer; a probe card ring within a portion of the cavity to support and position the plurality of probe leads; and a heating element positioned within at least a portion of the cavity, or in contact with the probe card ring the heating element heating the plurality of probe leads to a predetermined temperature to accurately keep each probe lead at a predetermined location within the cavity.
Claim 12
Dependent Claim
24 words
The probe card apparatus of claim 9 further comprising a control means to substantially maintain the predetermined temperature within a specified range of temperatures.
Claim 13
Dependent Claim
32 words
The probe card apparatus of claim 10 wherein the control means comprises a thermocouple in contact with a portion of the probe card ring to monitor temperature of the probe card ring.
Claim 14
Dependent Claim
42 words
The probe card apparatus of claim 9 wherein the probe card ring further comprises a circumferential slot on a surface thereof, the slot having a predetermined circumferential volume for receiving said heating element which conducts a direct current to provide radiant heat.
Claim 15
Dependent Claim
24 words
The probe card apparatus of claim 9 wherein the cavity of the probe card is positioned substantially in a center of the probe card.
Claim 16
Dependent Claim
17 words
The probe card apparatus of claim 9 wherein the probe card ring is an anodized aluminum ring.
Claim 17
Dependent Claim
30 words
The probe card apparatus of claim 9 wherein the heating element is a resistive material positioned adjacent the probe card ring for conducting a direct current to provide radiant heat.
Claim 18
Dependent Claim
29 words
The probe card apparatus of claim 15 further comprising a thermocouple in contact with a portion of the probe card ring to monitor temperature of the probe card ring.
Claim 19
Dependent Claim
179 words
A process for functional test probing an integrated circuit wafer using a probe card apparatus, comprising the steps of: providing a probe card having first and second opposite sides, a cavity which extends from the first side to the second side, and a plurality of conductive traces located on the second side of the probe card; providing a plurality of probe leads attached to the first side of the probe card and electrically coupled to the plurality of conductive traces; providing a non-conductive probe card ring located within the cavity of the probe card which is used to support the plurality of probe leads in predetermined positions, the probe card ring having a slot formed within a surface of the probe card ring; and heating the probe card ring to a predetermined temperature with a resistive heating element located, at least in part, within the slot of the probe card ring, the plurality of probe leads which are supported by the probe card ring also being heated in order to accurately keep the probe leads in the predetermined positions.
Claim 20
Dependent Claim
179 words
A process for functional test probing an integrated circuit wafer using a probe card apparatus, comprising the steps of: providing a probe card having first and second opposite sides, a cavity which extends from the first side to the second side, and a plurality of conductive traces located on the second side of the probe card; providing a plurality of probe leads attached to the first side of the probe card and electrically coupled to the plurality of conductive traces; providing a non-conductive probe card ring located within the cavity of the probe card which is used to support the plurality of probe leads in predetermined positions, the probe card ring having a slot formed within a surface of the probe card ring; and heating the probe card ring to a predetermined temperature with a resistive heating element located, at least in part, within the slot of the probe card ring, the plurality of probe leads which are supported by the probe card ring also being heated in order to accurately keep the probe leads in the predetermined positions.
Claim 21
Dependent Claim
44 words
The process of claim 17 further comprising the step of maintaining the predetermined temperature within a specified range of temperatures by monitoring temperture of the probe card ring with a thermocouple and controlling temperature of the probe card ring with an electronic temperature controller.
Claim 22
Dependent Claim
33 words
The process of claim 17 wherein the step of heating the probe card ring to a predetermined temperature comprises heating the probe card ring to a predetermined temperature substantially greater than 25° C.
Claim 23
Dependent Claim
29 words
The process of claim 17 wherein the step of providing a non-conductive probe card ring comprises providing an anodized aluminum probe card ring having a continuous, circumferential slot therein.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-06-23 | 1995-12-23 | 1996-06-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-06-23 | 1999-12-23 | 2000-06-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-06-23 | 2003-12-23 | 2004-06-23 | $7700.00 | Window Closed / Lapsed |