US6275052B1 — Probe card and testing method for semiconductor w…

Claim 1

Independent Claim 117 words

In a test apparatus for testing a semiconductor wafer having a contact location, a probe card for establishing temporary electrical communication with the wafer comprising: a substrate comprising a contact member configured to electrically contact the contact location and a first conductor in electrical communication with the contact member; and a membrane physically and electrically attaching the substrate to the test apparatus, the membrane comprising a flexible, electrically insulating polymer tape and a second conductor on the polymer tape electrically connected to the first conductor, the membrane having a flexibility and a slack sufficient to allow the substrate and the contact member thereon to move freely in a z-direction for making electrical contact with the contact location.

Claim 2

Dependent Claim 117 words

In a test apparatus for testing a semiconductor wafer having a contact location, a probe card for establishing temporary electrical communication with the wafer comprising: a substrate comprising a contact member configured to electrically contact the contact location and a first conductor in electrical communication with the contact member; and a membrane physically and electrically attaching the substrate to the test apparatus, the membrane comprising a flexible, electrically insulating polymer tape and a second conductor on the polymer tape electrically connected to the first conductor, the membrane having a flexibility and a slack sufficient to allow the substrate and the contact member thereon to move freely in a z-direction for making electrical contact with the contact location.

Claim 3

Dependent Claim 12 words

The probe card of claim 1 wherein the polymer tape comprises polyimide.

Claim 4

Dependent Claim 32 words

The probe card of claim 1 wherein the first conductor comprises a bonding pad on a recessed portion of the substrate configured to provide clearance for bonding the membrane to the substrate.

Claim 5

Dependent Claim 30 words

The probe card of claim 1 wherein the substrate comprises a plurality of contact members configured to electrically contact a plurality of dice on the wafer at a same time.

Claim 6

Dependent Claim 32 words

The probe card of claim 1 wherein the contact member comprises a raised member comprising a surface and a projection on the surface configured to penetrate a contact location on the wafer.

Claim 7

Dependent Claim 152 words

In a test apparatus for testing a semiconductor wafer having a contact location thereon, the test apparatus configured to support the wafer and including a probe card fixture, a probe card for establishing temporary electrical communication with the wafer comprising: a substrate comprising a contact member configured to electrically contact the contact location, the contact member comprising a raised member on the substrate at least partially covered with a conductive layer and a first conductor on the substrate in electrical communication with the conductive layer; and a membrane physically and electrically attaching the substrate to the probe card fixture, the membrane comprising a flexible electrically insulating polymer tape, and a second conductor on the polymer tape bonded to the first conductor, the membrane having a flexibility and a slack sufficient to allow the substrate and the contact member thereon to move freely in a z-direction during electrical contact with the contact location.

Claim 8

Dependent Claim 152 words

In a test apparatus for testing a semiconductor wafer having a contact location thereon, the test apparatus configured to support the wafer and including a probe card fixture, a probe card for establishing temporary electrical communication with the wafer comprising: a substrate comprising a contact member configured to electrically contact the contact location, the contact member comprising a raised member on the substrate at least partially covered with a conductive layer and a first conductor on the substrate in electrical communication with the conductive layer; and a membrane physically and electrically attaching the substrate to the probe card fixture, the membrane comprising a flexible electrically insulating polymer tape, and a second conductor on the polymer tape bonded to the first conductor, the membrane having a flexibility and a slack sufficient to allow the substrate and the contact member thereon to move freely in a z-direction during electrical contact with the contact location.

Claim 9

Dependent Claim 30 words

The probe card of claim 6 further comprising a compressible member on a surface of the substrate configured to cushion contact forces applied through the probe card to the wafer.

Claim 10

Dependent Claim 22 words

The probe card of claim 6 wherein the raised member comprises at least one projection configured to penetrate into the contact location.

Claim 11

Dependent Claim 167 words

In a test apparatus including test circuitry for testing semiconductor dice contained on a semiconductor wafer, a probe card for establishing temporary electrical communication with the wafer comprising: a substrate comprising a plurality of conductors and a plurality of contact members configured to electrically contact a plurality of contact locations on the dice, the contact members comprising raised members at least partially covered with conductive layers in electrical communication with the conductors; a compressible member attached to the substrate configured to cushion contact forces applied through the substrate to the wafer; and a membrane physically and electrically attaching the substrate to the test apparatus, the membrane comprising a flexible polyimide tape and a plurality of second conductors on the polyimide tape in electrical communication with the test circuitry and bonded to the conductors on the substrate, the membrane having a flexibility and a slack sufficient to allow the substrate and the contact members thereon to move freely in a z-direction during electrical contact with the contact locations.

Claim 12

Dependent Claim 167 words

In a test apparatus including test circuitry for testing semiconductor dice contained on a semiconductor wafer, a probe card for establishing temporary electrical communication with the wafer comprising: a substrate comprising a plurality of conductors and a plurality of contact members configured to electrically contact a plurality of contact locations on the dice, the contact members comprising raised members at least partially covered with conductive layers in electrical communication with the conductors; a compressible member attached to the substrate configured to cushion contact forces applied through the substrate to the wafer; and a membrane physically and electrically attaching the substrate to the test apparatus, the membrane comprising a flexible polyimide tape and a plurality of second conductors on the polyimide tape in electrical communication with the test circuitry and bonded to the conductors on the substrate, the membrane having a flexibility and a slack sufficient to allow the substrate and the contact members thereon to move freely in a z-direction during electrical contact with the contact locations.

Claim 13

Dependent Claim 24 words

The probe card of claim 9 further comprising a plurality of metal microbumps on the polyimide tape bonding the second conductors to the conductors.

Claim 14

Dependent Claim 159 words

In a test apparatus for testing semiconductor dice contained on a semiconductor wafer, a probe card for establishing temporary electrical communication with the wafer comprising: a substrate comprising a plurality of raised contact members at least partially covered with conductive layers, and a plurality of conductors in electrical communication with the contact members, each contact member comprising a surface and at least one projection on the surface sized and shaped to penetrate a contact location on the wafer while the surface limits further penetration; and a membrane configured to physically and electrically attach the substrate to the test apparatus, the membrane comprising a flexible polymer tape having an opening for the substrate and a plurality of second conductors on the tape bonded to the conductors on the substrate, the membrane having a flexibility and a slack sufficient to allow the substrate and the contact members thereon to move freely in a z-direction during electrical contact with the contact locations.

Claim 15

Dependent Claim 159 words

In a test apparatus for testing semiconductor dice contained on a semiconductor wafer, a probe card for establishing temporary electrical communication with the wafer comprising: a substrate comprising a plurality of raised contact members at least partially covered with conductive layers, and a plurality of conductors in electrical communication with the contact members, each contact member comprising a surface and at least one projection on the surface sized and shaped to penetrate a contact location on the wafer while the surface limits further penetration; and a membrane configured to physically and electrically attach the substrate to the test apparatus, the membrane comprising a flexible polymer tape having an opening for the substrate and a plurality of second conductors on the tape bonded to the conductors on the substrate, the membrane having a flexibility and a slack sufficient to allow the substrate and the contact members thereon to move freely in a z-direction during electrical contact with the contact locations.

Claim 16

Dependent Claim 27 words

The probe card of claim 11 further comprising a compressible member attached to the substrate configured to cushion contact forces applied through the substrate to the wafer.

Claim 17

Dependent Claim 18 words

The probe card of claim 11 wherein each contact member comprises a plurality of projections on the surface.

Claim 18

Dependent Claim 22 words

The probe card of claim 11 wherein the substrate comprises a recessed portion wherein the second conductors are bonded to the conductors.

Claim 19

Dependent Claim 36 words

The probe card of claim 11 wherein the substrate comprises a recessed portion and the conductors comprise bond pads on the recessed portion, the recessed portion configured to provide clearance for bonding to the second conductors.

Claim 20

Dependent Claim 32 words

The probe card of claim 11 further comprising a pressure plate and a compressible member in contact with the substrate configured to cushion contact forces applied through the substrate to the wafer.

Claim 21

Dependent Claim 176 words

In a test apparatus including a test circuitry for testing a semiconductor wafer having a circuit side and a contact location on the circuit side, a probe card for establishing temporary electrical communication with the wafer comprising: a substrate comprising a raised contact member configured to electrically contact a contact location on the wafer, the contact member comprising a projection configured to penetrate the contact location, and a surface configured to limit a penetration depth of the projection into the contact location; and a flexible membrane configured to electrically connect the contact member to the test circuitry and to physically mount the substrate to the test apparatus proximate to the wafer which is supported circuit side up by the test apparatus, the membrane comprising a polymer tape and a conductor on the polymer tape in electrical communication with the contact member and with the test circuitry, the membrane having a flexibility and a slack on the test apparatus such that the substrate and the contact member can move for making electrical contact with the contact location.

Claim 22

Dependent Claim 176 words

In a test apparatus including a test circuitry for testing a semiconductor wafer having a circuit side and a contact location on the circuit side, a probe card for establishing temporary electrical communication with the wafer comprising: a substrate comprising a raised contact member configured to electrically contact a contact location on the wafer, the contact member comprising a projection configured to penetrate the contact location, and a surface configured to limit a penetration depth of the projection into the contact location; and a flexible membrane configured to electrically connect the contact member to the test circuitry and to physically mount the substrate to the test apparatus proximate to the wafer which is supported circuit side up by the test apparatus, the membrane comprising a polymer tape and a conductor on the polymer tape in electrical communication with the contact member and with the test circuitry, the membrane having a flexibility and a slack on the test apparatus such that the substrate and the contact member can move for making electrical contact with the contact location.

Claim 23

Dependent Claim 33 words

The probe card of claim 17 further comprising a mounting plate on the substrate, and a compressible member between the mounting plate and the substrate for cushioning a pressure applied to the substrate.

Claim 24

Dependent Claim 24 words

The probe card of claim 17 wherein the membrane allows the substrate to freely move in a z-direction away from or towards the wafer.

Claim 25

Dependent Claim 147 words

In a test apparatus comprising a probe card fixture and a test circuitry for applying test signals to a semiconductor wafer, a probe card for establishing temporary electrical communication with the wafer comprising: a substrate comprising a contact member for electrically contacting a contact location on the wafer and a bonding pad in electrical communication with the contact member; and a membrane configured to physically support the substrate proximate to the wafer as it is supported by the test apparatus and to electrically connect the substrate to the test circuitry, the membrane comprising a flexible polymer tape having an opening for the substrate and a conductor on the tape in electrical communication with the test circuitry bonded to the bonding pad, the membrane having a flexibility sufficient to allow movement of the substrate and the contact member in a z-direction during electrical contacting of the contact location.

Claim 26

Dependent Claim 147 words

In a test apparatus comprising a probe card fixture and a test circuitry for applying test signals to a semiconductor wafer, a probe card for establishing temporary electrical communication with the wafer comprising: a substrate comprising a contact member for electrically contacting a contact location on the wafer and a bonding pad in electrical communication with the contact member; and a membrane configured to physically support the substrate proximate to the wafer as it is supported by the test apparatus and to electrically connect the substrate to the test circuitry, the membrane comprising a flexible polymer tape having an opening for the substrate and a conductor on the tape in electrical communication with the test circuitry bonded to the bonding pad, the membrane having a flexibility sufficient to allow movement of the substrate and the contact member in a z-direction during electrical contacting of the contact location.

Claim 27

Dependent Claim 26 words

The probe card of claim 20 further comprising a compressible member on the substrate for cushioning contact forces applied by the probe card to the wafer.

Claim 28

Dependent Claim 21 words

The probe card of claim of claim 20 wherein the substrate comprises a recessed portion wherein the bonding pad is located.

Claim 29

Dependent Claim 16 words

The probe card of claim 20 wherein the substrate comprises silicon and the conductor comprises aluminum.

Claim 30

Dependent Claim 19 words

The probe card of claim 20 wherein the test apparatus is configured to support the wafer circuit side up.

Claim 31

Dependent Claim 21 words

The probe card of claim 20 further comprising a microbump on the conductor for bonding the membrane to the bonding pad.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	2004-08-13	2005-02-12	2005-08-14	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2008-08-13	2009-02-12	2009-08-14	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2012-08-13	2013-02-12	2013-08-14	$7700.00	Window Closed / Lapsed

Probe card and testing method for semiconductor wafers

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