Patent US6265771B1 successfully refreshed from Google Patents.
US6265771B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Dual chip with heat sink
Assignee: GlobalFoundries Inc
•
Filing: 1999-01-27
•
Granted: 2001-07-24
•
Expires: 2019-01-27
Abstract
Abstract An apparatus for simultaneously removing heat from two surfaces of a semiconductor structure includes a heat sink mounted to a front surface and a heat sink mounted to a back surface of the semiconductor structure. The structure can be two chips mounted in face-to-face arrangement, and the heat sinks remove heat from back surfaces of both chips.
Inventors
- 👤 Thomas G. Ference
- 👤 Wayne J. Howell
- 👤 Edmund J. Sprogis
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 07:58
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H10W90/00; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/071; H10W72/075; H10W72/851; H10W72/874; H10W72/877; H10W72/884; H10W72/90; H10W72/951; H10W74/00; H10W74/10; H10W74/111; H10W74/127; H10W74/15; H10W90/20; H10W90/28; H10W90/288; H10W90/291; H10W90/297; H10W90/701; H10W90/721; H10W90/722; H10W90/724; H10W90/731; H10W90/732; H10W90/734; H10W90/736; H10W90/751; H10W90/752; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
133 words
A semiconductor module, comprising a substrate and a semiconductor structure, said semiconductor structure comprising a first surface and a second surface, a first heat sink or heat slug thermally contacting said first surface and a second heat sink or heat slug thermally contacting said second surface, said first heat sink or heat slug integrated in said substrate and said first heat sink or heat slug comprises metal filled vias and solder bumps not used for electrical signals, wherein said semiconductor structure comprises a first semiconductor chip stacked on a second semiconductor chip in an active-surface-facing-active-surface arrangement further wherein said first chip is connected to said second chip through a bump connection, said first surface being a back surface of said first chip, said second surface being a back surface of said second chip.
Claim 2
Dependent Claim
133 words
A semiconductor module, comprising a substrate and a semiconductor structure, said semiconductor structure comprising a first surface and a second surface, a first heat sink or heat slug thermally contacting said first surface and a second heat sink or heat slug thermally contacting said second surface, said first heat sink or heat slug integrated in said substrate and said first heat sink or heat slug comprises metal filled vias and solder bumps not used for electrical signals, wherein said semiconductor structure comprises a first semiconductor chip stacked on a second semiconductor chip in an active-surface-facing-active-surface arrangement further wherein said first chip is connected to said second chip through a bump connection, said first surface being a back surface of said first chip, said second surface being a back surface of said second chip.
Claim 3
Dependent Claim
15 words
A semiconductor module as recited in claim 1 , wherein said bump connection comprises solder.
Claim 4
Dependent Claim
41 words
A semiconductor module as recited in claim 1 , wherein said first heat sink or heat slug and said second heat sink or heat slug are for removing heat from back surfaces of said first chip and said second chips simultaneously.
Claim 5
Dependent Claim
15 words
A semiconductor module as recited in claim 1 , wherein said substrate comprises laminate material.
Claim 6
Dependent Claim
15 words
A semiconductor module as recited in claim 1 , wherein said substrate comprises ceramic material.
Claim 7
Dependent Claim
27 words
A semiconductor module as recited in claim 1 , wherein said first heat sink or heat slug is electrically connected to a ground plane of said chip.
References Cited (Backward Citations)
US4091408A
Cited
US4393393A
Cited
US4878106A
Cited
US5065281A
Cited
US5345106A
Cited
US5377077A
Cited
EP0484180A1
Cited
US5199164A
Cited
US5297006A
Cited
US5295044A
Cited
US5332921A
Cited
US5508565A
Cited
US5394298A
Cited
US5510956A
Cited
US5594282A
Cited
US5578869A
Cited
US5886408A
Cited
US5615475A
Cited
US5703400A
Cited
US5777381A
Cited
US5910682A
Cited
US5792677A
Cited
US5818107A
Cited
US5866943A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-07-23 | 2005-01-22 | 2005-07-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-07-23 | 2009-01-22 | 2009-07-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-07-23 | 2013-01-22 | 2013-07-24 | $7700.00 | Window Closed / Lapsed |