Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
149 words
An assembly, comprising: a monolithic integrated circuit having a plurality of input/output (I/O) pads arranged upon a surface of the integrated circuit, wherein the plurality of I/O pads are spaced across a central portion and a surrounding peripheral portion of the integrated circuit, and wherein each member of the peripheral portion is connected to an electrical ground potential; a substrate having a plurality of electrically conductive bonding pads extending to a surface of said substrate in coupled alignment with members of the central portion of the plurality of I/O pads; and a thermally and electrically conductive heat spreader, wherein the heat spreader is thermally coupled to the integrated circuit, and wherein the heat spreader is electrically coupled to at least one member of the peripheral portion of the I/O pads of the integrated circuit so as to form an electromagnetic shield partially surrounding and proximate to the integrated circuit.
Claim 2
Dependent Claim
149 words
An assembly, comprising: a monolithic integrated circuit having a plurality of input/output (I/O) pads arranged upon a surface of the integrated circuit, wherein the plurality of I/O pads are spaced across a central portion and a surrounding peripheral portion of the integrated circuit, and wherein each member of the peripheral portion is connected to an electrical ground potential; a substrate having a plurality of electrically conductive bonding pads extending to a surface of said substrate in coupled alignment with members of the central portion of the plurality of I/O pads; and a thermally and electrically conductive heat spreader, wherein the heat spreader is thermally coupled to the integrated circuit, and wherein the heat spreader is electrically coupled to at least one member of the peripheral portion of the I/O pads of the integrated circuit so as to form an electromagnetic shield partially surrounding and proximate to the integrated circuit.
Claim 3
Dependent Claim
23 words
The assembly as recited in claim 1, wherein the integrated circuit comprises at least one electronic device formed upon a monolithic semiconductor substrate.
Claim 4
Dependent Claim
47 words
The assembly as recited in claim 1, wherein the plurality of I/O pads of the integrated circuit are arranged as a two dimensional array having rows and columns, and wherein the peripheral portion of the plurality of I/O pads comprises members of the outermost rows and columns.
Claim 5
Dependent Claim
36 words
The assembly as recited in claim 1, wherein the heat spreader is electrically coupled to the at least one member of the peripheral portion of the I/O pads of the integrated circuit by a grounding lead.
Claim 6
Dependent Claim
19 words
The assembly as recited in claim 4, wherein the grounding lead is a metal foil strip or a wire.
Claim 7
Dependent Claim
37 words
The assembly as recited in claim 1, further comprising a thermally electrically conductive stiffener interposed between the substrate and the heat spreader, wherein the stiffener comprises an opening, and wherein the integrated circuit resides within the opening.
Claim 8
Dependent Claim
36 words
The assembly as recited in claim 1, wherein members of the central portion of the plurality of I/O pads of the integrated circuit are coupled to the bonding pads of the substrate with respective solder bumps.
Claim 9
Dependent Claim
36 words
The assembly as recited in claim 7, wherein the solder bumps couple members of the central portion of the plurality of I/O pads of the integrated circuit to the bonding pads of the substrate when heated.
Claim 10
Dependent Claim
26 words
The assembly as recited in claim 6, wherein the stiffener retains a substantially planar shape when exposed to maximum thermal energy of about 230 degrees C.
Claim 11
Dependent Claim
17 words
The assembly as recited in claim 7, wherein the heat spreader is electrically coupled to the stiffener.
Claim 12
Dependent Claim
26 words
The assembly as recited in claim 7, wherein the heat spreader is attached to the stiffener by a layer of an electrically and thermally conductive adhesive.
Claim 13
Dependent Claim
40 words
The assembly as recited in claim 1, wherein the heat spreader comprises an underside surface having a cavity, and wherein the integrated circuit resides within the cavity, and wherein the underside surface is attached to the surface of the substrate.