US5065281A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Molded integrated circuit package incorporating heat sink
Assignee: Circuit Components Inc
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Filing: 1990-02-12
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Granted: 1991-11-12
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Expires: 2010-02-12
Abstract
Abstract A molded integrated circuit package includes an integrated circuit chip, a heat sink device attached directly to the chip or lead frame and a molded package encapsulating the chip. The heat sink preferably comprises a thermally conductive material having a stem which communicates between the IC chip and the exterior of the molded package for direct conduction of heat from the IC chip to the exterior of the package.
Inventors
- 👤 Jorge M. Hernandez
- 👤 Scott Simpson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 06:37
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W74/00; H10W74/10; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
174 words
A molded integrated circuit (IC) package comprising: lead frame means, said lead frame means including a plurality of conductive fingers arranged in a pre-selected pattern, said fingers each having a first end and a second end, said first ends of said fingers terminating at an inner space; an integrated circuit support platform being positioned within said space in close proximity to said first ends of said fingers, said support platform having opposed first and second surfaces; an integrated circuit chip on said first surface of said support platform, said integrated circuit chip being electrically connected to said first ends of said fingers; heat sink plug means attached to said second surface of said support platform and thermally communicating with said integrated circuit chip for transferring heat away from said circuit chip; a layer of electrically insulating material bonding said heat sink plug means to said conductive fingers of said lead frame means; and molding material encapsulating said integrated circuit chip and heat sink plug means and at least part of said lead frame means.
Claim 2
Dependent Claim
174 words
A molded integrated circuit (IC) package comprising: lead frame means, said lead frame means including a plurality of conductive fingers arranged in a pre-selected pattern, said fingers each having a first end and a second end, said first ends of said fingers terminating at an inner space; an integrated circuit support platform being positioned within said space in close proximity to said first ends of said fingers, said support platform having opposed first and second surfaces; an integrated circuit chip on said first surface of said support platform, said integrated circuit chip being electrically connected to said first ends of said fingers; heat sink plug means attached to said second surface of said support platform and thermally communicating with said integrated circuit chip for transferring heat away from said circuit chip; a layer of electrically insulating material bonding said heat sink plug means to said conductive fingers of said lead frame means; and molding material encapsulating said integrated circuit chip and heat sink plug means and at least part of said lead frame means.
Claim 3
Dependent Claim
25 words
The IC package of claim 1 wherein said heat sink plug means is attached to said second surface of said support platform using an adhesive.
Claim 4
Dependent Claim
12 words
The IC package of claim 2 wherein: said adhesive is thermally conductive.
Claim 5
Dependent Claim
12 words
The IC package of claim 2 wherein: said adhesive is electrically non-conductive.
Claim 6
Dependent Claim
20 words
The IC package of claim 1 wherein said heat sink plug means comprises a stem attached to said support platform.
Claim 7
Dependent Claim
21 words
The IC package of claim 5 wherein: said stem terminates at a terminal surface which is exterior of said molding material.
Claim 8
Dependent Claim
23 words
The IC package of claim 5 wherein: said stem has striations therein for improving mechanical interlocking between said stem and said molding material.
Claim 9
Dependent Claim
32 words
The IC package of claim 5 including: a flat plate attached to an end of said stem, said flat plate terminating at a terminal surface which is exterior of said molding material.
Claim 10
Dependent Claim
25 words
The IC package of claim 8 wherein: said flat plate has a surface area which is greater than the surface area of said support platform.
Claim 11
Dependent Claim
13 words
The IC package of claim 5 wherein: said stem has a cylindrical shape.
Claim 12
Dependent Claim
14 words
The IC package of claim 8 wherein: said flat plate has a circular shape.
Claim 13
Dependent Claim
17 words
The IC package of claim 1 wherein: said heat sink plug means is comprised of a metal.
Claim 14
Dependent Claim
16 words
The IC package of claim 6 wherein: said terminal surface is flush with said molding material.
Claim 15
Dependent Claim
16 words
The IC package of claim 8 wherein: said terminal surface is flush with said molding material.
Claim 16
Dependent Claim
26 words
The IC package of claim 8 including: striations along side edges of said flat plate for improving mechanical interlocking between said plate and said molding material.
Claim 17
Dependent Claim
22 words
The IC package of claim 1 wherein said insulating material comprises: a ring of layer of plastic film coated with an adhesive.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-11-11 | 1995-05-13 | 1995-11-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-11-11 | 1999-05-13 | 1999-11-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-11-11 | 2003-05-13 | 2003-11-12 | $7700.00 | Window Closed / Lapsed |