Patent US6221682B1 successfully refreshed from Google Patents.
US6221682B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for evaluating a known good die using both wire bond and flip-chip interconnects
Assignee: M-Red Inc
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Filing: 1999-05-28
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Granted: 2001-04-24
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Expires: 2019-05-28
Abstract
Abstract Wire bond pad and solder ball or controlled collapse chip connections C 4 are combined on a planar surface of a an integrated circuit device to provide a die. Known good die (KGD) testing is optionally performed using wire bond connections or stress tolerant solder ball connections. The KGD testing is conducted after the integrated circuit dies are diced from a wafer. Solder ball or C 4 array connections which withstand thermal stress are used to KGD test the die prior to final use of the wire bond pad connections to an end use device. Alternatively, wire bond pads are used to test the die while maintaining the solder ball or C 4 array in a pristine condition for bonding to a final end product device. Both testing with the solder ball C 4 array contacts and with the wire bond connections provides metallurgical connections for the KGD test. The solder ball or C 4 array is connected to the wire bond pads and either connection can be used to burn-in test the die.
Inventors
- 👤 Steve M Danziger
- 👤 Tushar Shah
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:53
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/28; G01R31/2851; G01R31/2886; H; H10; H10P; H10P74/00; H10P74/27; H10P74/273; H10W; H10W72/00; H10W72/01; H10W72/012; H10W72/019; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W72/20; H10W72/251; H10W72/252; H10W72/29; H10W72/50; H10W72/59; H10W72/90; H10W72/951; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 43
Claim 1
Independent Claim
83 words
A method of making a known good integrated circuit device for solder ball array connection to an end use device comprising the steps of: constructing said integrated circuit device having wire bond pads, and a solder ball array, wherein the solder ball array is connected to the wire bond pads by discrete connections on the integrated circuit; after constructing the integrated circuit device connecting the integrated circuit device to a test device with the wire bond pads; and testing the integrated circuit device.
Claim 2
Independent Claim
83 words
A method of making a known good integrated circuit device for solder ball array connection to an end use device comprising the steps of: constructing said integrated circuit device having wire bond pads, and a solder ball array, wherein the solder ball array is connected to the wire bond pads by discrete connections on the integrated circuit; after constructing the integrated circuit device connecting the integrated circuit device to a test device with the wire bond pads; and testing the integrated circuit device.
Claim 3
Dependent Claim
19 words
The method in accordance with claim 1 , further comprising leaving the solder ball array contacts in pristine condition.
Claim 4
Dependent Claim
16 words
The method in accordance with claim 1 , further comprising heavily leading the solder ball array.
Claim 5
Dependent Claim
16 words
The method in accordance with claim 1 , wherein said testing is a cyclic temperature test.
Claim 6
Dependent Claim
30 words
A method in accordance with claim 1 , further comprising the step of placing the solder ball array connections and the wire bond pads on the same substantially planar surface.
Claim 7
Dependent Claim
20 words
A method in accordance with claim 1 , further comprising metallurgically bonding the wire bond pads to the test device.
Claim 8
Dependent Claim
16 words
A method in accordance with claim 1 , wherein said integrated circuit device is a die.
Claim 9
Dependent Claim
16 words
The method in accordance with claim 1 , further comprising constructing stress tolerant solder ball connections.
Claim 10
Dependent Claim
22 words
The method in accordance with claim 1 , further comprising connecting the integrated circuit device to an end use device after testing.
Claim 11
Independent Claim
88 words
A method of making a known good integrated circuit module having wire bond connections for connection to an end use device comprising the steps of: forming wire bond pads on the integrated circuit module; forming a stress tolerant solder ball array on the integrated circuit module; discretely connecting the stress tolerant solder ball array to the wire bond pads; and using the stress tolerant solder ball array to metallurgically connect the integrated circuit module to a known good integrated circuit test device; and testing the integrated circuit module.
Claim 12
Independent Claim
88 words
A method of making a known good integrated circuit module having wire bond connections for connection to an end use device comprising the steps of: forming wire bond pads on the integrated circuit module; forming a stress tolerant solder ball array on the integrated circuit module; discretely connecting the stress tolerant solder ball array to the wire bond pads; and using the stress tolerant solder ball array to metallurgically connect the integrated circuit module to a known good integrated circuit test device; and testing the integrated circuit module.
Claim 13
Dependent Claim
19 words
The method in accordance with claim 10 , further comprising leaving the wire bond pad connections in pristine condition.
Claim 14
Dependent Claim
23 words
The method in accordance with claim 10 , further comprising forming the stress tolerant solder ball array contacts using heavily leaded soldered balls.
Claim 15
Dependent Claim
29 words
A method in accordance with claim 10 , further comprising removing the integrated circuit device from the test device by reheating balls of the stress tolerant solder ball array.
Claim 16
Dependent Claim
25 words
A method in accordance with claim 13 , further comprising a step of leaving a taffy pull configuration when the solder balls are drawn away.
Claim 17
Dependent Claim
30 words
A method in accordance with claim 13 , further comprising a step of causing stress tolerant solder ball array balls to sheer in the middle on the reheating for removal.
Claim 18
Dependent Claim
22 words
The method in accordance with claim 10 , further comprising connecting the integrated circuit module to an end use device after testing.
Claim 19
Independent Claim
104 words
A method of testing a known good integrated circuit device having stress tolerant solder ball array connections for connecting to an end use device comprising the steps of: constructing on a surface of the integrated circuit device a stress tolerant solder ball array of connections; constructing on a surface of the integrated circuit device wire bond pads which are discretely connected to the stress tolerant solder ball array of connections; testing said integrated circuit device by forming metallic connections between said wire bond pads and a test device; and removing said metallic connections from said wire bond pads after testing said integrated circuit device.
Claim 20
Independent Claim
104 words
A method of testing a known good integrated circuit device having stress tolerant solder ball array connections for connecting to an end use device comprising the steps of: constructing on a surface of the integrated circuit device a stress tolerant solder ball array of connections; constructing on a surface of the integrated circuit device wire bond pads which are discretely connected to the stress tolerant solder ball array of connections; testing said integrated circuit device by forming metallic connections between said wire bond pads and a test device; and removing said metallic connections from said wire bond pads after testing said integrated circuit device.
Claim 21
Dependent Claim
32 words
A method in accordance with claim 17 , further comprising the step of placing the stress tolerant solder ball array connections and the wire bond pads on the same substantially planar surface.
Claim 22
Dependent Claim
16 words
A method in accordance with claim 17 , wherein said testing is cyclic temperature burn-in testing.
Claim 23
Dependent Claim
17 words
A method in accordance with claim 17 , wherein the testing is at the integrated circuit level.
Claim 24
Dependent Claim
20 words
A method in accordance with claim 17 , further comprising bonding the wire bond pads metallurgically to a test device.
Claim 25
Dependent Claim
22 words
The method in accordance with claim 17 , further comprising leaving the stress tolerant solder ball array of connections in pristine condition.
Claim 26
Dependent Claim
18 words
The method in accordance with claim 17 , further comprising heavily leading the stress tolerant solder ball array.
Claim 27
Independent Claim
91 words
A method of testing an integrated circuit having wire bond connections for connecting to an end use device comprising the steps of: constructing on a surface of the integrated circuit a stress tolerant solder ball array of connections; constructing on a surface of the integrated circuit wire bond pads which are discretely connected to the stress tolerant solder ball array connections; testing the integrated circuit by forming metallic connections between the stress tolerant solder ball array connections and a test device; and removing said metallic connections after testing said integrated circuit.
Claim 28
Independent Claim
91 words
A method of testing an integrated circuit having wire bond connections for connecting to an end use device comprising the steps of: constructing on a surface of the integrated circuit a stress tolerant solder ball array of connections; constructing on a surface of the integrated circuit wire bond pads which are discretely connected to the stress tolerant solder ball array connections; testing the integrated circuit by forming metallic connections between the stress tolerant solder ball array connections and a test device; and removing said metallic connections after testing said integrated circuit.
Claim 29
Dependent Claim
45 words
A method of testing an integrated circuit having wire bond connections for connecting to an end use device in accordance with claim 24 , further comprising removing by reheating solder balls of the stress tolerant solder ball array which are connected to the test device.
Claim 30
Dependent Claim
40 words
A method of testing an integrated circuit having wire bond connections for connecting to an end use device in accordance with claim 24 , further comprising a step of leaving a taffy pull configuration when the solder is drawn away.
Claim 31
Dependent Claim
41 words
A method of testing an integrated circuit having wire bond connections for connecting to an end use device in accordance with claim 24 , further comprising the step of forming a stress tolerant solder ball array balls which are heavily leaded.
Claim 32
Dependent Claim
42 words
A method of testing integrated circuit having wire bond connections for connecting to an end use device in accordance with claim 24 , further comprising a step of causing stress tolerant solder ball array balls to sheer in the middle after reheating.
Claim 33
Dependent Claim
40 words
A method of testing an integrated circuit having wire bond connections for connecting to an end use device, in accordance with claim 24 , further comprising forming metallurgical connections between the stress tolerant solder ball array and a test substrate.
Claim 34
Dependent Claim
19 words
The method in accordance with claim 24 , further comprising leaving the wire bond pad connections in pristine condition.
Claim 35
Dependent Claim
17 words
The method in accordance with claim 24 , wherein said testing is a cyclic temperature burn-in test.
Claim 36
Independent Claim
103 words
A method of making a known good integrated circuit device having wire bond connections for connection to an end use device comprising the steps of: forming wire bond pads on the integrated circuit device; forming a stress tolerant solder ball array on the integrated circuit device; discreetly connecting the stress tolerant solder ball array to the wire bond pads; and using the stress tolerant solder ball array to metallurgically connect the integrated circuit device to a known good integrated circuit test device; and testing the integrated circuit device; further comprising forming the stress tolerant solder ball array contacts using heavily leaded soldered balls.
Claim 37
Independent Claim
103 words
A method of making a known good integrated circuit device having wire bond connections for connection to an end use device comprising the steps of: forming wire bond pads on the integrated circuit device; forming a stress tolerant solder ball array on the integrated circuit device; discreetly connecting the stress tolerant solder ball array to the wire bond pads; and using the stress tolerant solder ball array to metallurgically connect the integrated circuit device to a known good integrated circuit test device; and testing the integrated circuit device; further comprising forming the stress tolerant solder ball array contacts using heavily leaded soldered balls.
Claim 38
Independent Claim
95 words
A method of making a known good integrated circuit device having wire bond connections for connection to an end use device comprising the steps of: forming wire bond pads on the integrated circuit device; forming a stress tolerant solder ball array on the integrated circuit device; discreetly connecting the stress tolerant solder ball array to the wire bond pads; and using the stress tolerant solder ball array to metallurgically connect the integrated circuit device to a known good integrated circuit test device; and testing the integrated circuit; wherein said testing is a cyclic temperature test.
Claim 39
Independent Claim
95 words
A method of making a known good integrated circuit device having wire bond connections for connection to an end use device comprising the steps of: forming wire bond pads on the integrated circuit device; forming a stress tolerant solder ball array on the integrated circuit device; discreetly connecting the stress tolerant solder ball array to the wire bond pads; and using the stress tolerant solder ball array to metallurgically connect the integrated circuit device to a known good integrated circuit test device; and testing the integrated circuit; wherein said testing is a cyclic temperature test.
Claim 40
Independent Claim
108 words
A method of making a known good integrated circuit device having wire bond connections for connection to an end use device comprising the steps of: forming wire bond pads on the integrated circuit device; forming a stress tolerant solder ball array on the integrated circuit device; discreetly connecting the stress tolerant solder ball array to the wire bond pads; and using the stress tolerant solder ball array to metallurgically connect the integrated circuit device to a known good integrated circuit test device; and testing the integrated circuit; further comprising removing the integrated circuit device from the test device by reheating balls of the stress tolerant solder ball array.
Claim 41
Independent Claim
108 words
A method of making a known good integrated circuit device having wire bond connections for connection to an end use device comprising the steps of: forming wire bond pads on the integrated circuit device; forming a stress tolerant solder ball array on the integrated circuit device; discreetly connecting the stress tolerant solder ball array to the wire bond pads; and using the stress tolerant solder ball array to metallurgically connect the integrated circuit device to a known good integrated circuit test device; and testing the integrated circuit; further comprising removing the integrated circuit device from the test device by reheating balls of the stress tolerant solder ball array.
Claim 42
Dependent Claim
25 words
A method in accordance with claim 34 , further comprising a step of leaving a taffy pull configuration when the solder balls are drawn away.
Claim 43
Dependent Claim
30 words
A method in accordance with claim 34 , further comprising a step of causing stress tolerant solder ball array balls to sheer in the middle on the heating for removal.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-04-23 | 2004-10-23 | 2005-04-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-04-23 | 2008-10-23 | 2009-04-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-04-23 | 2012-10-23 | 2013-04-24 | $7700.00 | Window Closed / Lapsed |