Patent US6187652B1 successfully refreshed from Google Patents.
US6187652B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of fabrication of multiple-layer high density substrate
Assignee: Fujitsu Ltd
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Filing: 1998-09-14
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Granted: 2001-02-13
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Expires: 2018-09-14
Abstract
Abstract A method of fabricating a multi-layer interconnected substrate structure. The inventive method includes forming a multi-layer structure from multiple, pre-fabricated power and/or signal substrates which are laminated together. A drill is then used to form a via through the surface of a ring-type pad down to a desired depth in the multi-layer structure. The via hole is cleaned and then filled with a conductive material. The via so formed between two or more substrates is self-aligned by using the ring pad(s). This contributes to an increased signal routing density compared to conventional methods.
Inventors
- 👤 William T. Chou
- 👤 Solomon I. Beilin
- 👤 Michael Guang-Tzong Lee
- 👤 Michael G. Peters
- 👤 Wen-chou Vincent Wang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:03
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4623
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
167 words
A method of fabricating a multi-layer substrate, comprising: providing a first substrate element having an upper and a lower surface and a conductive pad arranged on the upper surface of the element, wherein the conductive pad is in the form of at least a portion of a ring; providing a second substrate element having an upper and a lower surface and a conductive pad arranged on each of the upper and lower surfaces, and a conductive via which connects the conductive pads on the upper and the lower surfaces of the second substrate element; vertically aligning the conductive pad of the first substrate element to the conductive pad of the second substrate element; laminating the first substrate element to the second substrate element; drilling a via hole extending through the conductive pad of the first substrate element to the conductive pad of the second substrate element, wherein the conductive pad of the second substrate element stops the drilling; and filling the via hole with a conductive material.
Claim 2
Independent Claim
167 words
A method of fabricating a multi-layer substrate, comprising: providing a first substrate element having an upper and a lower surface and a conductive pad arranged on the upper surface of the element, wherein the conductive pad is in the form of at least a portion of a ring; providing a second substrate element having an upper and a lower surface and a conductive pad arranged on each of the upper and lower surfaces, and a conductive via which connects the conductive pads on the upper and the lower surfaces of the second substrate element; vertically aligning the conductive pad of the first substrate element to the conductive pad of the second substrate element; laminating the first substrate element to the second substrate element; drilling a via hole extending through the conductive pad of the first substrate element to the conductive pad of the second substrate element, wherein the conductive pad of the second substrate element stops the drilling; and filling the via hole with a conductive material.
Claim 3
Dependent Claim
27 words
The method of claim 1 , wherein filling the via hole with the conductive material comprises: plating the surface defining the via hole with the conductive material.
Claim 4
Dependent Claim
14 words
The method of claim 1 wherein the first and second substrate elements are flexible.
Claim 5
Dependent Claim
50 words
The method of claim 1 , wherein the step of laminating the first substrate element to the second substrate element further comprises: disposing an adhesive layer between the first and second substrate elements; and causing the first and second substrate elements to adhere to opposite sides of the adhesive layer.
Claim 6
Dependent Claim
12 words
The method of claim 1 , wherein the conductive material comprises solder.
Claim 7
Dependent Claim
23 words
The method of claim 1 , wherein the step of drilling the via hole comprises: drilling the via hole with a laser drill.
Claim 8
Dependent Claim
24 words
The net nod of claim 1 , wherein the step of drilling the via hole comprises: drilling the via hole with a plasma process.
Claim 9
Dependent Claim
30 words
The method of claim 1 , further comprising the step of: cleaning the via hole after the via hole is formed to remove residues. lease add the following new claims.
Claim 10
Dependent Claim
21 words
The method of claim 1 wherein the conductive pad of the first substrate element is in the form of a ring.
Claim 11
Independent Claim
183 words
A method of fabricating a multi-layer substrate, comprising: providing a first substrate element having opposing surfaces and a ring-shaped pad at one of the opposing surfaces, wherein the first substrate element is a G- or V-type substrate; providing a second substrate element having opposing surfaces and a conductive pad at one of the surfaces of the second substrate element, wherein the second substrate element is a S-type substrate; aligning the ring-shaped conductive pad of the first substrate element to the conductive pad of the second substrate element; laminating the first substrate element to the second substrate element to form a laminated structure, wherein the ring-shaped pad of the first substrate element is at an outer surface of the laminated structure and the conductive pad of the second substrate element is buried within the laminated structure; forming a via hole extending through the ring-shaped conductive pad of the first substrate element to the conductive pad of the second substrate element so that the via hole stops at the conductive pad on the second substrate element; and filling the via hole with a conductive material.
Claim 12
Independent Claim
183 words
A method of fabricating a multi-layer substrate, comprising: providing a first substrate element having opposing surfaces and a ring-shaped pad at one of the opposing surfaces, wherein the first substrate element is a G- or V-type substrate; providing a second substrate element having opposing surfaces and a conductive pad at one of the surfaces of the second substrate element, wherein the second substrate element is a S-type substrate; aligning the ring-shaped conductive pad of the first substrate element to the conductive pad of the second substrate element; laminating the first substrate element to the second substrate element to form a laminated structure, wherein the ring-shaped pad of the first substrate element is at an outer surface of the laminated structure and the conductive pad of the second substrate element is buried within the laminated structure; forming a via hole extending through the ring-shaped conductive pad of the first substrate element to the conductive pad of the second substrate element so that the via hole stops at the conductive pad on the second substrate element; and filling the via hole with a conductive material.
Claim 13
Dependent Claim
14 words
The method of claim 10 wherein the first and second substrate elements are flexible.
Claim 14
Dependent Claim
13 words
The method of claim 10 wherein forming the via hole comprises laser drilling.
Claim 15
Dependent Claim
29 words
The method of claim 10 wherein filling the via hole with the conductive material comprises: electroless plating surfaces defining the via hole; and depositing solder in the via hole.
Claim 16
Dependent Claim
42 words
The method of claim 10 wherein laminating the first substrate element to the second substrate element comprises: disposing an adhesive layer between the first and second substrate elements; and causing the first and second substrate elements to adhere to the adhesive layer.
Claim 17
Dependent Claim
16 words
The method of claim 14 wherein forming the via hole comprises drilling through the adhesive layer.
Claim 18
Dependent Claim
45 words
The method of claim 10 wherein the ring-shaped pad of the first conductive element is a first ring-shaped pad, and wherein the first conductive element further comprises a second ring-shaped pad at the opposite side of the first conductive element as the first ring-shaped pad.
Claim 19
Dependent Claim
14 words
The method of claim 10 wherein the first and second substrate elements comprise polyimide.
Claim 20
Dependent Claim
20 words
The method of claim 10 further comprising: cleaning the via hole with a plasma etch after drilling the via hole.
References Cited (Backward Citations)
US3755890A
Cited
US4258468A
Cited
US4668088A
Cited
US4916809A
Cited
US4714516A
Cited
US4764485A
Cited
US4894115A
Cited
US5022960A
Cited
US5379515A
Cited
US5347712A
Cited
US5263243A
Cited
US5255431A
Cited
US5584956A
Cited
US5355283A
Cited
US5478700A
Cited
US5880010A
Cited
US5657537A
Cited
US5566448A
Cited
US5745984A
Cited
US5703400A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-02-13 | 2004-08-14 | 2005-02-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-02-13 | 2008-08-14 | 2009-02-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-02-13 | 2012-08-14 | 2013-02-13 | $7700.00 | Window Closed / Lapsed |