US4258468A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Forming vias through multilayer circuit boards
Assignee: AT&T Inc
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Filing: 1978-12-14
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Granted: 1981-03-31
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Expires: 1998-12-14
Abstract
Abstract A via (21) is formed in a multilayer printed circuit board (10) by initially etching apertures (14) in the land areas (13) of the circuit pattern on the layers (11) prior to uniting the layers. A beam (16) of laser energy is then directed through the apertures to form a via through the printed circuit board. Each via is defined by the apertures in a plurality of vertically aligned land areas. The via is then electrolessly plated to provide electrical connections between vertically aligned land areas.
Inventors
- 👤 John W. Balde
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 16:09
CPC Classifications
B; B23; B23K; B23K26/00; B23K26/36; B23K26/38; B23K26/382; B23K26/40; H; H05; H05K; H05K3/00; H05K3/0011; H05K3/0017; H05K3/0026; H05K3/0032; H05K3/40; H05K3/42; H05K3/429; B23K2101/00; B23K2101/36; B23K2101/42; B23K2103/00; B23K2103/08; B23K2103/12; B23K2103/16; B23K2103/166; B23K2103/172; B23K2103/30; B23K2103/42; H05K2201/00; H05K2201/09; H05K2201/09818; H05K2201/09845; H05K2203/00; H05K2203/05; H05K2203/0548; H05K2203/0554; H05K3/46; H05K3/4611; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
195 words
A method of fabricating a circuit board having an electrically conductive circuit pattern on both sides of a dielectric layer, the conductive pattern being formed of a material which is substantially less responsive to being drilled by laser radiation of a predetermined wavelength than is said dielectric layer and having a plurality of leads connected to land areas, the land areas on one side of the layer being aligned with the land areas on the other side of the layer, the method comprising the steps of: forming an aperture in the land areas to expose the dielectric layer thereunder; stacking a plurality of such conductively patterned layers alternately with unmetallized dielectric layers; uniting the stacked layers together to form a multilayer circuit board having one or more groups of aligned land areas each having an aperture therein; and directing a beam of laser energy of the predetermined wavelength towards at least one exposed land on the outer surface of the stacked layers to drill a via in the substrate through apertures in at leat one aligned group of land areas while exposing at least a portion of at least one of the aligned land areas.
Claim 2
Independent Claim
195 words
A method of fabricating a circuit board having an electrically conductive circuit pattern on both sides of a dielectric layer, the conductive pattern being formed of a material which is substantially less responsive to being drilled by laser radiation of a predetermined wavelength than is said dielectric layer and having a plurality of leads connected to land areas, the land areas on one side of the layer being aligned with the land areas on the other side of the layer, the method comprising the steps of: forming an aperture in the land areas to expose the dielectric layer thereunder; stacking a plurality of such conductively patterned layers alternately with unmetallized dielectric layers; uniting the stacked layers together to form a multilayer circuit board having one or more groups of aligned land areas each having an aperture therein; and directing a beam of laser energy of the predetermined wavelength towards at least one exposed land on the outer surface of the stacked layers to drill a via in the substrate through apertures in at leat one aligned group of land areas while exposing at least a portion of at least one of the aligned land areas.
Claim 3
Dependent Claim
25 words
The method as set forth in claim 1, which is characterized by: plating electrically conductive material in the holes to interconnect the aligned land areas.
Claim 4
Dependent Claim
35 words
The method as set forth in claim 1, wherein: the laser is a CO 2 laser having a radiation wavelength of 10.6 μm; the dielectric material is an epoxy-glass; and the conductive material is copper.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-03-30 | 1984-09-29 | 1985-03-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-03-30 | 1988-09-29 | 1989-03-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-03-30 | 1992-09-29 | 1993-03-31 | $7700.00 | Window Closed / Lapsed |