Method of providing electrically conductive substrate through-holes
Abstract
Abstract THIS DISCLOSURE TEACHES SPECIFICALLY THE METHOD OF METALLIZING A SUBSTRATE OR DIELECTRIC THROUGH-HOLE BY DIRECTING A LASER BEAM OR AN ELECTRON BEAM ON A SUPPLY OF METAL TO VAPORIZE THE METAL AND VAPOR DEPOSIT THE METAL ON THE WALLS OF THE SUBSTRAE THROUGH-HOLE. THIS DISCLOSURE ALSO TEACHES THE METHOD OF DRILLING A SUBSTRATE THROUGH-HOLE WITH A LASER BEAM OR AN ELECTRON BEAM AND METALLIZING THE THROUGH-HOLE AS STATED ABOVE. FURTHER, THIS DISCLOSURE TEACHES THE METHOD OF METALLIZING A SUBSTRATE THROUGH-HOLE BY PLACING A SUPPLY OF METAL OVER A SUB STRATE THROUGHHOLE AND ENGAGING THE METAL SUPPLY WITH A LASER BEAM OR AN ELECTRON BEAM TO METL THE SUPPLY AND FLOW OF MELTED SUPPLY THROUGH THE THROUGH-HOLE. IN ADDITION, THE PRESENT DISCLOSURE TEACHES THE METHOD OF METALLIZING A SUBSTRATE THROUGH-HOLE BY FILLING THE THROUGH-HOLE WITH METAL GRANULES, AND ENGAGING THE GRANULES WITH A LASER BEAM OR AN ELECTRON BEAM TO VAPORIZE THE GRANULES AND VAPOR DEPOSIT THE METAL ON THE WALLS OF THE THROUGH-HOLE.
Inventors
- 👤 Benjamin Howell Cranston
- 👤 Richard Allen Wydro Sr
Bibliographic Details
Claims Analysis
Total Claims: 0References Cited (Backward Citations)
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