Patent US6176992B1 successfully refreshed from Google Patents.
US6176992B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for electro-chemical mechanical deposition
Assignee: Novellus Systems Inc
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Filing: 1998-12-01
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Granted: 2001-01-23
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Expires: 2018-12-01
Abstract
Abstract The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer using an electrolyte solution disposed on a surface of the wafer, when the wafer is disposed between a cathode and an anode, and preventing accumulation of the conductive material to areas other than the predetermine area by mechanically polishing the other areas while the conductive material is being applied.
Inventors
- 👤 Homayoun Talieh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 23:06
CPC Classifications
H; H10; H10P; H10P52/00; B; B24; B24B; B24B37/00; B24B37/11; B24B37/20; B24B37/26; B23; B23H; B23H5/00; B23H5/06; B23H5/08; C; C25; C25D; C25D5/00; C25D5/02; C25D5/04; C25D5/06; C25D5/22; C25D5/60; C25D5/605; C25D5/611; C25D5/615; C25D5/617; C25D5/627; H10P14/00; H10P14/40; H10P14/46; H10P14/47; H10P52/40; H10P52/403
Claims Analysis
Total Claims: 55
Claim 1
Independent Claim
135 words
A method of depositing a conductive material from an electrolyte solution of a workpiece having a top surface and a cavity portion disposed on the top surface and having a conductive layer disposed on the top surface and the cavity portion of the workpiece comprising the steps of: applying a potential difference between the workpiece and an anode, with the workpiece being positioned in proximity to the anode, thereby causing the application of the conductive material to at least the conductive layer disposed on the cavity portion of the workpiece; and minimizing accumulation of the conductive material to the conductive layer disposed on the top surface of the workpiece by polishing the the conductive layer disposed on the top surface of the workpiece with a pad while the application of the conductive material is occurring.
Claim 2
Independent Claim
135 words
A method of depositing a conductive material from an electrolyte solution of a workpiece having a top surface and a cavity portion disposed on the top surface and having a conductive layer disposed on the top surface and the cavity portion of the workpiece comprising the steps of: applying a potential difference between the workpiece and an anode, with the workpiece being positioned in proximity to the anode, thereby causing the application of the conductive material to at least the conductive layer disposed on the cavity portion of the workpiece; and minimizing accumulation of the conductive material to the conductive layer disposed on the top surface of the workpiece by polishing the the conductive layer disposed on the top surface of the workpiece with a pad while the application of the conductive material is occurring.
Claim 3
Dependent Claim
48 words
The method of claim 1 , further comprising the steps of: removing the electrolyte solution from a chamber in which the steps of applying and minimizing accumulating take place; cleaning the removed electrolyte solution; and replenishing the electrolyte solution for application back into the chamber to the workpiece.
Claim 4
Dependent Claim
12 words
The method of claim 1 , wherein the conductive material comprises copper.
Claim 5
Dependent Claim
22 words
The method of claim 1 , wherein the cavity portion of the workpiece comprises a via and the workpiece comprises a wafer.
Claim 6
Dependent Claim
15 words
The method of claim 1 , wherein the electrolyte solution has an insubstantial amount slurry.
Claim 7
Dependent Claim
13 words
The method of claim 1 wherein the conductive layer is a barrier/seed layer.
Claim 8
Dependent Claim
37 words
The method of claim 1 , wherein the step of minimizing accumulation includes moving the pad to assist in retaining the electrolyte solution in contact with the conductive layer disposed on the cavity portion of the workpiece.
Claim 9
Dependent Claim
21 words
The method of claim 7 , wherein the step of moving the pad also generates mechanical pulsing, thereby improving grain size.
Claim 10
Dependent Claim
21 words
The method of claim 7 , wherein the step of moving the pad also generates mechanical pulsing, thereby improving grain size.
Claim 11
Dependent Claim
37 words
The method if claim 1 , wherein the pad is attached to the anode and the step of applying the conductive material further comprises the step of flowing the electrolyte solution through the anode and the pad.
Claim 12
Dependent Claim
27 words
The method of claim 1 , wherein the step of applying the conductive material further comprises the step of dispensing the electrolyte solution directly to the pad.
Claim 13
Dependent Claim
30 words
The method of claim 1 , wherein the step of minimizing accumulation prevents to conductive material from being formed on the conductive layer on the top surface fo the workpiece.
Claim 14
Dependent Claim
71 words
The method of claim 1 , wherein the step of applying, the potential difference applies the potential difference having a first polarity, and further including the following steps prior to the step of applying: applying a second potential difference having a second polarity opposite the first polarity between the workpiece and the anode; and polishing the conductive layer on the top surface of the workpiece while applying the second potential difference.
Claim 15
Dependent Claim
14 words
The method of claim 13 wherein the electrolyte solution has an insubstantial amount slurry.
Claim 16
Dependent Claim
43 words
The method of claim 1 further comprising the steps of applying a slurry to the workpiece and chemically mechanically polishing the workpiece after the conductive material has been applied to the conductive layer disposed over the cavity portion and filled the cavity portion.
Claim 17
Dependent Claim
11 words
The method of claim 1 wherein the workpiece is a wafer.
Claim 18
Dependent Claim
24 words
The method of claim 1 wherein the step of applying the conductive material includes the step of flowing the electrolyte solution through the pad.
Claim 19
Dependent Claim
25 words
The method of claim 1 wherein the step of applying the potential difference uses an inert anode and the electrolyte solution contains the conductive material.
Claim 20
Dependent Claim
18 words
The method of claim 1 wherein the step of applying the potential difference uses platinum as the anode.
Claim 21
Independent Claim
81 words
A method of transferring an electrolyte solution containing a conductive material to a workpiece surface so that depositing of the conductive material can occur upon application of power, the method comprising the steps of: moving a pad that contacts the workpiece surface; and applying the electrolyte solution through the pad so that the electrolyte solution is in contact with the workpiece surface, thereby providing a condition suitable for depositing of the conductive material on the workpiece surface upon application of power.
Claim 22
Independent Claim
81 words
A method of transferring an electrolyte solution containing a conductive material to a workpiece surface so that depositing of the conductive material can occur upon application of power, the method comprising the steps of: moving a pad that contacts the workpiece surface; and applying the electrolyte solution through the pad so that the electrolyte solution is in contact with the workpiece surface, thereby providing a condition suitable for depositing of the conductive material on the workpiece surface upon application of power.
Claim 23
Dependent Claim
49 words
The method of claim 20 wherein during the step of applying the electrolyte solution, the conductive material is deposited on a cavity of the workpiece and is inhibited from being deposited on the top surface of the workpiece by moving the pad on the top surface of the workpiece.
Claim 24
Dependent Claim
70 words
The method of claim 21 wherein the step of applying the electrolyte solution further includes the steps of: applying power in the form of a potential difference between the workpiece and an anode; and moving the pad while applying the potential difference, thereby causing the accumulation of conductive material in the cavity of the workpiece and minimizing the accumulation of the conductive material on the top surface of the workpiece.
Claim 25
Dependent Claim
26 words
A method according to claim 22 wherein the step of applying the electrolyte solution through the pad provides a flow of electrolyte solution to the workpiece.
Claim 26
Dependent Claim
45 words
The method of claim 22 , further comprising the steps of: removing the electrolyte solution from a chamber in which the step of applying takes place; cleaning the removed electrolyte solution; and replenishing the electrolyte solution for application back into the chamber to the workpiece.
Claim 27
Dependent Claim
27 words
The method of claim 22 , wherein the step of moving the pad assist in retaining the electrolyte solution in contact with the cavity of the workpiece.
Claim 28
Dependent Claim
21 words
The method of claim 22 , wherein the step of moving the pad also generates mechanical pulsing, thereby improving grain size.
Claim 29
Dependent Claim
11 words
The method of claim 20 wherein the workpiece is a wafer.
Claim 30
Dependent Claim
21 words
The method of claim 20 , wherein the cavity of the workpiece comprises a via and the workpiece comprises a wafer.
Claim 31
Dependent Claim
12 words
The method of claim 20 , wherein the conductive material comprises copper.
Claim 32
Dependent Claim
26 words
The method of claim 20 , wherein the step of applying the potential difference uses an inert anode and the electrolyte solution contains the conductive material.
Claim 33
Dependent Claim
18 words
The method of claim 30 wherein the step of applying the potential difference uses platinum as the anode.
Claim 34
Independent Claim
168 words
A method of depositing a conductive material from an electrolyte solution on a cavity portion of a workpiece also having a top surface, the top surface and the cavity portion having a conductive layer disposed thereover, the method comprising the steps of: applying a second potential difference having a first polarity between the workpiece and an anode having a pad attached thereto; polishing the conductive layer on the top surface of the workpiece while applying the second potential difference; applying a first potential difference having a second polarity opposite the first polarity between the workpiece and the anode having the pad attached thereto, the workpiece being positioned in proximity to the anode, and applying the electrolyte solution to the workpiece, thereby causing the application of the conductive material to at least the cavity portion of the workpiece; and minimizing accumulation of the conductive material to the top surface of the workpiece by polishing the top surface with a pad while the application of the conductive material is occurring.
Claim 35
Independent Claim
168 words
A method of depositing a conductive material from an electrolyte solution on a cavity portion of a workpiece also having a top surface, the top surface and the cavity portion having a conductive layer disposed thereover, the method comprising the steps of: applying a second potential difference having a first polarity between the workpiece and an anode having a pad attached thereto; polishing the conductive layer on the top surface of the workpiece while applying the second potential difference; applying a first potential difference having a second polarity opposite the first polarity between the workpiece and the anode having the pad attached thereto, the workpiece being positioned in proximity to the anode, and applying the electrolyte solution to the workpiece, thereby causing the application of the conductive material to at least the cavity portion of the workpiece; and minimizing accumulation of the conductive material to the top surface of the workpiece by polishing the top surface with a pad while the application of the conductive material is occurring.
Claim 36
Dependent Claim
13 words
The method of claim 32 wherein the conductive layer is a barrier/seed layer.
Claim 37
Dependent Claim
29 words
The method of claim 33 , wherein the step of applying the conductive material further comprises the step of flowing the electrolyte solution through the anode and the pad.
Claim 38
Dependent Claim
27 words
The method of claim 32 , wherein the step of applying the conductive material further comprises the step of dispensing the electrolyte solution directly to the pad.
Claim 39
Independent Claim
121 words
A method of depositing a conductive material onto a workpiece having a top surface and a cavity portion disposed on the top surface comprising the steps of: applying an electrolyte solution of the top surface and the cavity portion of the workpiece, the electrolyte solution containing the conductive material without a substantial amount slurry; applying a potential difference between the workpiece and an anode, with the workpiece being positioned in proximity to the anode, thereby causing the application of the conductive material to the cavity portion of the wafer; and minimizing accumulation of the conductive material to top surface of the workpiece by polishing the top surface of the workpiece with a pad while application of the conductive material is occurring.
Claim 40
Independent Claim
121 words
A method of depositing a conductive material onto a workpiece having a top surface and a cavity portion disposed on the top surface comprising the steps of: applying an electrolyte solution of the top surface and the cavity portion of the workpiece, the electrolyte solution containing the conductive material without a substantial amount slurry; applying a potential difference between the workpiece and an anode, with the workpiece being positioned in proximity to the anode, thereby causing the application of the conductive material to the cavity portion of the wafer; and minimizing accumulation of the conductive material to top surface of the workpiece by polishing the top surface of the workpiece with a pad while application of the conductive material is occurring.
Claim 41
Dependent Claim
21 words
A method according to claim 36 wherein the step of applying the electrolyte solution causes application of electrolyte containing no slurry.
Claim 42
Dependent Claim
24 words
The method of claim 36 wherein the step of applying the electrolyte solution includes the step of flowing the electrolyte solution through the pad.
Claim 43
Dependent Claim
33 words
A method according to claim 36 wherein a conductive layer is disposed on the top surface of the workpiece and the cavity portion of the workpiece to which the electrolyte solution is applied.
Claim 44
Dependent Claim
41 words
The method of claim 39 further comprising the steps of applying a slurry to the workpiece and chemically mechanically polishing the workpiece after the conductive material has been applied to the conductive layer disposed over the cavity and filled the cavity.
Claim 45
Dependent Claim
21 words
A method according to claim 40 wherein the step of applying the electrolyte solution causes application of electrolyte containing no slurry.
Claim 46
Dependent Claim
74 words
The method of claim 39 , wherein the step of applying, the potential difference applies the potential difference having a first polarity, and further including the following steps prior to the step of applying the electrolyte solution: applying a second potential difference having a second polarity opposite the first polarity between the workpiece and the anode; and polishing the conductive layer on the top surface of the workpiece while applying the second potential difference.
Claim 47
Dependent Claim
25 words
The method of claim 36 wherein the step of applying the potential difference uses an inert anode and the electrolyte solution contains the conductive material.
Claim 48
Dependent Claim
18 words
The method of claim 43 wherein the step of applying the potential difference uses platinum as the anode.
Claim 49
Independent Claim
124 words
A method of depositing a conductive material from an electrolyte solution on a workpiece having a top surface containing a top surface portion and a cavity portion comprising the steps of: applying an electrolyte solution through an anode and a pad attached thereto to the top surface and the cavity portion of the workpiece; applying a potential difference between the workpiece and the anode, with the workpiece being positioned in proximity to the anode, thereby causing the application of the conductive material to at least the cavity portion of the workpiece; and minimizing accumulation of the conductive material to top surface of the workpiece by polishing the top surface of the workpiece with the pad while the application of the conductive material is occurring.
Claim 50
Independent Claim
124 words
A method of depositing a conductive material from an electrolyte solution on a workpiece having a top surface containing a top surface portion and a cavity portion comprising the steps of: applying an electrolyte solution through an anode and a pad attached thereto to the top surface and the cavity portion of the workpiece; applying a potential difference between the workpiece and the anode, with the workpiece being positioned in proximity to the anode, thereby causing the application of the conductive material to at least the cavity portion of the workpiece; and minimizing accumulation of the conductive material to top surface of the workpiece by polishing the top surface of the workpiece with the pad while the application of the conductive material is occurring.
Claim 51
Dependent Claim
11 words
The method of claim 45 wherein the conductive material comprises copper.
Claim 52
Dependent Claim
21 words
The method of claim 45 wherein the cavity portion of the workpiece comprises a via and the workpiece comprises a wafer.
Claim 53
Dependent Claim
25 words
The method of claim 45 wherein the step of applying the potential difference uses an inert anode and the electrolyte solution contains the conductive material.
Claim 54
Dependent Claim
18 words
The method of claim 48 wherein the step of applying the potential difference uses platinum as the anode.
Claim 55
Dependent Claim
23 words
The method of claim 45 wherein the step of applying the electrolyte solution applies the electrolyte solution with an insubstantial amount of slurry.
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| 3.5 Years (Year 4) | 2004-01-23 | 2004-07-24 | 2005-01-23 | $2000.00 | Window Closed / Lapsed |
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