US5558568A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wafer polishing machine with fluid bearings
Assignee: Applied Materials Inc
•
Filing: 1994-11-02
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Granted: 1996-09-24
•
Expires: 2014-11-02
Abstract
Abstract A semi-conductor wafer polishing machine having a polishing pad assembly and a wafer holder includes a support positioned adjacent the polishing pad assembly. The support includes multiple fluid bearings that support the polishing pad assembly on the support. These fluid bearings are arranged concentrically to provide concentric regions of support for the polishing pad assembly, and each fluid bearing is coupled to a respective source of pressurized fluid at a respective pressure.
Inventors
- 👤 Homayoun Talieh
- 👤 David E. Weldon
- 👤 Boguslaw A. Nagorski
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 18:08
CPC Classifications
B; B24; B24B; B24B37/00; B24B37/11; B24B37/20; B24B21/00; B24B21/04; B24B21/06; B24B37/12
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
125 words
In a semiconductor wafer polishing machine of the type comprising at least one polishing pad assembly and at least one wafer holder positioned to hold a semiconductor wafer against the polishing pad assembly, the improvement comprising: a support positioned adjacent the polishing pad assembly, said support comprising a plurality of fluid bearings that support the polishing pad assembly on the support, each of said fluid bearings comprising: a respective fluid supply conduit connectable to a separate respective source of fluid at a separate respective pressure; a respective set of fluid pads, each in fluid communication with the respective fluid supply conduit, said fluid pads configured to direct fluid from the respective fluid supply conduit to support in part the polishing pad assembly on the support.
Claim 2
Dependent Claim
125 words
In a semiconductor wafer polishing machine of the type comprising at least one polishing pad assembly and at least one wafer holder positioned to hold a semiconductor wafer against the polishing pad assembly, the improvement comprising: a support positioned adjacent the polishing pad assembly, said support comprising a plurality of fluid bearings that support the polishing pad assembly on the support, each of said fluid bearings comprising: a respective fluid supply conduit connectable to a separate respective source of fluid at a separate respective pressure; a respective set of fluid pads, each in fluid communication with the respective fluid supply conduit, said fluid pads configured to direct fluid from the respective fluid supply conduit to support in part the polishing pad assembly on the support.
Claim 3
Dependent Claim
21 words
The invention of claim 1 wherein at least some of the sets of fluid pads are arranged in respective concentric rings.
Claim 4
Dependent Claim
29 words
The invention of claim 1 wherein the polishing pad assembly comprises at least one polishing pad and a belt supporting the at least one polishing pad for linear translation.
Claim 5
Dependent Claim
19 words
The invention of claim 1 wherein at least two of the separate pressures differ from one another in magnitude.
Claim 6
Dependent Claim
25 words
The invention of claim 1 wherein the fluid supply conduits each comprise a separate respective mounting feature for connection to the respective source of fluid.
Claim 7
Dependent Claim
34 words
The invention of claim 1 wherein each of the fluid supply conduits contains a pressurized fluid at the respective pressure, and wherein at least two of the pressures differ from one another in magnitude.
Claim 8
Dependent Claim
24 words
The invention of claim 1 wherein the fluid bearings are separately adjustable with respect to fluid pressure to provide a range of pressure profiles.
Claim 9
Dependent Claim
24 words
The invention of claim 1 wherein the bearings comprise a central bearing and peripheral bearing, and wherein the peripheral bearing surrounds the central bearing.
Claim 10
Dependent Claim
206 words
In a semiconductor wafer polishing machine of the type comprising at least one polishing pad assembly and at least one wafer holder positioned to hold a semiconductor wafer against the polishing pad assembly, the improvement comprising: a support positioned adjacent the polishing pad assembly, said support comprising a plurality of fluid bearings that support the polishing pad assembly on the support, each of said fluid bearings comprising: a respective fluid supply conduit connectable to a respective source of fluid at a respective pressure; a respective set of fluid pads, each in fluid communication with the respective fluid supply conduit, said fluid pads configured to direct fluid from the respective fluid supply conduit to support in part the polishing pad assembly on the support; wherein the fluid bearings comprise first and second plates; said first plate comprising a plurality of concentric grooves, each in communication with a respective one of the fluid supply conduits; said second plate comprising a plurality of sets of orifices, each set of orifices overlying and aligned with a respective concentric groove; said first and second plates secured together to hold the orifices in alignment with the respective grooves; each fluid pad formed in the second plate in communication with a respective orifice.
Claim 11
Dependent Claim
206 words
In a semiconductor wafer polishing machine of the type comprising at least one polishing pad assembly and at least one wafer holder positioned to hold a semiconductor wafer against the polishing pad assembly, the improvement comprising: a support positioned adjacent the polishing pad assembly, said support comprising a plurality of fluid bearings that support the polishing pad assembly on the support, each of said fluid bearings comprising: a respective fluid supply conduit connectable to a respective source of fluid at a respective pressure; a respective set of fluid pads, each in fluid communication with the respective fluid supply conduit, said fluid pads configured to direct fluid from the respective fluid supply conduit to support in part the polishing pad assembly on the support; wherein the fluid bearings comprise first and second plates; said first plate comprising a plurality of concentric grooves, each in communication with a respective one of the fluid supply conduits; said second plate comprising a plurality of sets of orifices, each set of orifices overlying and aligned with a respective concentric groove; said first and second plates secured together to hold the orifices in alignment with the respective grooves; each fluid pad formed in the second plate in communication with a respective orifice.
Claim 12
Dependent Claim
21 words
The invention of claim 9 further comprising an array of drainage grooves formed in the second plate between the fluid pads.
Claim 13
Dependent Claim
19 words
The invention of claim 10 wherein the drainage grooves comprise both radially extending drainage grooves and concentric drainage grooves.
Claim 14
Dependent Claim
92 words
In a semiconductor wafer polishing machine of the type comprising one polishing pad assembly and at least one wafer holder positioned to hold a semiconductor wafer against the polishing pad assembly, the improvement comprising: a support positioned adjacent the polishing pad assembly, said support comprising a plurality of fluid bearings that support the polishing pad assembly on the support; said fluid bearings arranged concentrically to provide concentric regions of support for the polishing pad assembly, each fluid bearing coupled to a separate respective source of pressurized fluid at a separate respective pressure.
Claim 15
Dependent Claim
92 words
In a semiconductor wafer polishing machine of the type comprising one polishing pad assembly and at least one wafer holder positioned to hold a semiconductor wafer against the polishing pad assembly, the improvement comprising: a support positioned adjacent the polishing pad assembly, said support comprising a plurality of fluid bearings that support the polishing pad assembly on the support; said fluid bearings arranged concentrically to provide concentric regions of support for the polishing pad assembly, each fluid bearing coupled to a separate respective source of pressurized fluid at a separate respective pressure.
Claim 16
Dependent Claim
19 words
The invention of claim 12 wherein at least two of the separate pressures differ from one another in magnitude.
Claim 17
Dependent Claim
24 words
The invention of claim 12 wherein the separate sources are separately adjustable with respect to fluid pressure to provide a range of pressure profiles.
Claim 18
Dependent Claim
38 words
The invention of claim 12 wherein the fluid bearings comprise a central bearing and a peripheral bearing, and wherein the respective sources provide pressurized fluid at a higher pressure to the central bearing than to the peripheral bearing.
Claim 19
Dependent Claim
38 words
The invention of claim 12 wherein the fluid bearings comprise a central bearing and a peripheral bearing, and wherein the respective sources provide pressurized fluid at a lower pressure to the central bearing than to the peripheral bearing.
Claim 20
Dependent Claim
25 words
The invention of claim 12 wherein the bearings comprise a central bearing and a peripheral bearing, and wherein the peripheral bearing surrounds the central bearing.
References Cited (Backward Citations)
US619399A
Cited
US3447306A
Cited
US3654739A
Cited
US3753269A
Cited
US3906678A
Cited
US4416090A
Cited
US4347689A
Cited
DE3411120A1
Cited
JPS59232768A
Cited
US4593495A
Cited
US4628640A
Cited
US4704823A
Cited
US4642943A
Cited
JPS62162466A
Cited
JPS63200965A
Cited
US4811522A
Cited
JPS63251166A
Cited
JPS63267155A
Cited
US4934102A
Cited
US5081795A
Cited
US4941293A
Cited
JPH02269553A
Cited
JPH02269552A
Cited
JPH049209A
Cited
US5276999A
Cited
RU2007784C1
Cited
EP0517595A1
Cited
EP0517594A1
Cited
US5335453A
Cited
US5297361A
Cited
US5246525A
Cited
US5230184A
Cited
US5212910A
Cited
US5205082A
Cited
US5287663A
Cited
US5329732A
Cited
US5274964A
Cited
US5232875A
Cited
WO1994017957A1
Cited
US5329734A
Cited
US5399125A
Cited
JPH07111256A
Cited
US5456627A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-09-24 | 2000-03-25 | 2000-09-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-09-24 | 2004-03-25 | 2004-09-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-09-24 | 2008-03-25 | 2008-09-24 | $7700.00 | Window Closed / Lapsed |