Polishing method and device thereof

Abstract

Abstract PURPOSE:To high-accurately polish the whole face of a workpiece to be polished by applying pressure with pressure fluid on the back of a polishing belt which linearly moves relative to the workpiece to be polished, and pressing the belt through grinding liquid interposed between them. CONSTITUTION:When a polishing belt 11 circulatedly moves between the carrier 13 holding a wafer 14 and a pressure disc 12, a fluid film of pressure fluid discharged from respective discharge holes 12a in the pressure disk 12 is formed. The polishing belt 11 is pushed up to the wafer 14 side with this fluid film. As a result, the polishing belt 11 is strongly contacted with the wafer 14 on the carrier 13 through the grinding liquid discharged from a nozzle part 15, and moved keeping the condition which is strongly pressed to whole face of the wafer to be polished. During this movement, whole face of the wafer 14 is polished with the grinding liquid in high quality.

Inventors

• 👤 Takehisa Shinagawa
• 👤 品川　武久

Bibliographic Details