JPH02269552A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Polishing method and device thereof
Assignee: RODEELE NITTA KK
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Filing: 1989-04-06
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Granted: —
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Expires: 2009-04-06
Abstract
Abstract PURPOSE:To improve polishing accuracy by linearly opposing the circumferential surface of a cylindrical rotating tool to a workpiece to be polished, and relatively moving them. CONSTITUTION:A rotating tool 11 or a polishing belt wound around the tool is linearly opposed to a wafer 14. The wafer 14 is polished in this condition by relatively moving the tool 11 and the wafer 14 at high speed and in linear movement, while being supplied with grinding liquid between opposing parts from a nozzle part 15.
Inventors
- 👤 Toshiro Doi
- 👤 俊郎 土肥
- 👤 Takehisa Shinagawa
- 👤 品川 武久
Bibliographic Details
Application Number
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Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-01 07:57
CPC Classifications
—
Claims Analysis
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References Cited (Backward Citations)
JPS63267155A
Cited
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