US5692947A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Linear polisher and method for semiconductor wafer planarization
Assignee: Lam Research Corp
•
Filing: 1996-12-03
•
Granted: 1997-12-02
•
Expires: 2016-12-03
Abstract
Abstract A wafer polisher and method for the chemical mechanical planarization of semiconductor wafers. The polisher includes a wafer holder for supporting the semiconductor wafer and a linear polishing assembly having a polishing member positioned to engage the surface of the wafer. The polishing member is movable in a linear direction relative to the wafer surface to uniformly polish the surface of the wafer. A pivotal alignment device may be used to pivotally support one of the wafer holder and the polishing member relative to the other of the wafer holder and the polishing member with the surface of the wafer and the polishing member retained in parallel alignment during operation of the polisher. The polisher optionally includes a conditioning station for conditioning the polishing member.
Inventors
- 👤 Homayoun Talieh
- 👤 David Edwin Weldon
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 18:11
CPC Classifications
B; B24; B24B; B24B53/00; B24B53/017; B24B21/00; B24B21/04; B24B35/00; B24B37/00; B24B37/04; B24B41/00; B24B41/06; B24B7/00; B24B7/20; B24B7/22; B24B7/228
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
133 words
A wafer polishing machine for the chemical mechanical planarization of a surface of a semiconductor wafer with an abrasive polishing agent comprising: a wafer support assembly having a wafer holder shaped to receive said wafer and support said wafer with said surface projecting from said wafer holder; a linear polishing assembly having a polishing member positioned to engage said surface of said wafer, said polishing member being movable in a linear direction relative to said wafer to continuously apply a uniform polishing force across said surface of said wafer during operation of said wafer polishing machine for uniformly polishing said surface of said wafer, said polishing member comprising a plurality of reciprocating bars having a polishing material mounted to said bars, said bars being movable in a linear direction relative to said wafer.
Claim 2
Dependent Claim
133 words
A wafer polishing machine for the chemical mechanical planarization of a surface of a semiconductor wafer with an abrasive polishing agent comprising: a wafer support assembly having a wafer holder shaped to receive said wafer and support said wafer with said surface projecting from said wafer holder; a linear polishing assembly having a polishing member positioned to engage said surface of said wafer, said polishing member being movable in a linear direction relative to said wafer to continuously apply a uniform polishing force across said surface of said wafer during operation of said wafer polishing machine for uniformly polishing said surface of said wafer, said polishing member comprising a plurality of reciprocating bars having a polishing material mounted to said bars, said bars being movable in a linear direction relative to said wafer.
Claim 3
Dependent Claim
34 words
The wafer polishing machine of claim 1 in which said polishing assembly includes at least one actuating device coupled to said bars for moving said bars in a linear direction relative to said wafer.
Claim 4
Dependent Claim
37 words
The wafer polishing machine of claim 2 in which said polishing assembly includes a control system coupled to said actuating device, which control system is configured for moving said bars in accordance with a selected velocity profile.
Claim 5
Independent Claim
84 words
A method for uniformly planarizing the surface of a semiconductor wafer, said surface comprising at least one layer formed on the wafer, said method comprising the steps of: supporting said wafer with said surface of said wafer engaging a polishing member adapted for chemical mechanical polishing; rotating said wafer relative to said polishing member; supplying a polishing slurry to the polishing member; and moving said polishing member in a linear direction relative to said wafer to chemically mechanically planarize said surface of said wafer.
Claim 6
Independent Claim
84 words
A method for uniformly planarizing the surface of a semiconductor wafer, said surface comprising at least one layer formed on the wafer, said method comprising the steps of: supporting said wafer with said surface of said wafer engaging a polishing member adapted for chemical mechanical polishing; rotating said wafer relative to said polishing member; supplying a polishing slurry to the polishing member; and moving said polishing member in a linear direction relative to said wafer to chemically mechanically planarize said surface of said wafer.
Claim 7
Dependent Claim
29 words
The method of claim 4 in which said moving step includes moving said polishing member at a constant velocity within the range of 50 to 150 feet per minute.
Claim 8
Dependent Claim
34 words
The method of claim 4 in which said moving step includes moving said polishing member in accordance with a velocity profile selected to apply a uniform polishing force across said surface of said wafer.
Claim 9
Dependent Claim
50 words
The method of claim 4 which said step of rotating said wafer includes rotating said wafer at a velocity of at most approximately 1/10 the velocity of said polishing member, with the angular velocity of said wafer relative to said polishing member being uniform across said surface of said wafer.
Claim 10
Dependent Claim
53 words
The method of claim 4 in which said moving step includes moving said polishing member in a continuous path in which said polishing member passes across said surface of said wafer, and further comprising the step of conditioning said polishing member with a scraper as said polishing member travels in said continuous path.
Claim 11
Dependent Claim
44 words
The method of claim 4 which further comprises the step of pivoting one of said wafer and said polishing member relative to the other of said wafer and said polishing member until said surface of said wafer and said polishing member are substantially parallel.
Claim 12
Dependent Claim
131 words
A wafer polishing machine for the chemical mechanical planarization of a surface of a semiconductor wafer with an abrasive polishing agent comprising: a rotary wafer support assembly having a wafer holder shaped to receive said wafer and support said wafer with said surface projecting from said wafer holder; a linear polishing assembly having a polishing member positioned to engage said surface of said wafer, said polishing member being movable in a linear direction relative to said wafer to continuously apply a uniform polishing force across said surface of said wafer during operation of said wafer polishing machine for uniformly polishing said surface of said wafer; wherein said polishing member comprises a metal belt and a polishing layer mounted on the belt, said belt having a width substantially greater than its thickness.
Claim 13
Dependent Claim
131 words
A wafer polishing machine for the chemical mechanical planarization of a surface of a semiconductor wafer with an abrasive polishing agent comprising: a rotary wafer support assembly having a wafer holder shaped to receive said wafer and support said wafer with said surface projecting from said wafer holder; a linear polishing assembly having a polishing member positioned to engage said surface of said wafer, said polishing member being movable in a linear direction relative to said wafer to continuously apply a uniform polishing force across said surface of said wafer during operation of said wafer polishing machine for uniformly polishing said surface of said wafer; wherein said polishing member comprises a metal belt and a polishing layer mounted on the belt, said belt having a width substantially greater than its thickness.
References Cited (Backward Citations)
US619399A
Cited
US3447306A
Cited
US3654739A
Cited
US3753269A
Cited
US3906678A
Cited
US4016857A
Cited
US4416090A
Cited
US4347689A
Cited
DE3411120A1
Cited
JPS59232768A
Cited
US4593495A
Cited
US4628640A
Cited
US4704823A
Cited
US4642943A
Cited
JPS62162466A
Cited
JPS63200965A
Cited
US4811522A
Cited
JPS63251166A
Cited
JPS63267155A
Cited
US4934102A
Cited
US5081795A
Cited
US4941293A
Cited
JPH02269552A
Cited
JPH02269553A
Cited
US5276999A
Cited
JPH04250967A
Cited
US5335453A
Cited
EP0517595A1
Cited
EP0517594A1
Cited
US5297361A
Cited
US5246525A
Cited
US5230184A
Cited
US5212910A
Cited
US5205082A
Cited
US5287663A
Cited
US5329732A
Cited
US5274964A
Cited
US5232875A
Cited
WO1994017957A1
Cited
US5329734A
Cited
US5399125A
Cited
JPH07111256A
Cited
US5456627A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-12-01 | 2001-06-02 | 2001-12-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-12-01 | 2005-06-02 | 2005-12-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-12-01 | 2009-06-02 | 2009-12-02 | $7700.00 | Window Closed / Lapsed |